New pages
Jump to navigation
Jump to search
(newest | oldest) View (newer 20 | older 20) (20 | 50 | 100 | 250 | 500)
- 06:56, 19 September 2024 18385085. COIL COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.) (hist) [3,352 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:56, 19 September 2024 18375310. COIL COMPONENT simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.) (hist) [3,106 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:56, 19 September 2024 Taiwan semiconductor manufacturing co., ltd. (20240312978). LAYOUT DESIGN METHODOLOGY FOR STACKED DEVICES simplified abstract (hist) [4,263 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:56, 19 September 2024 18661921. OPTICAL IMAGING SYSTEM simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.) (hist) [3,924 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:56, 19 September 2024 Taiwan semiconductor manufacturing co., ltd. (20240312952). Bonding Semiconductor Dies Through Wafer Bonding Processes simplified abstract (hist) [3,607 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:56, 19 September 2024 Taiwan semiconductor manufacturing co., ltd. (20240312941). ELECTRONIC APPARATUS AND METHOD FOR FORMING CONDUCTIVE BUMPS simplified abstract (hist) [3,393 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:56, 19 September 2024 18534266. CAMERA MODULE simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.) (hist) [3,085 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:56, 19 September 2024 Taiwan semiconductor manufacturing co., ltd. (20240312940). SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME simplified abstract (hist) [3,902 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:56, 19 September 2024 18666089. OPTICAL IMAGING SYSTEM simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.) (hist) [2,763 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:56, 19 September 2024 18415743. LENS AND LENS ASSEMBLY INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.) (hist) [2,844 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:56, 19 September 2024 Taiwan semiconductor manufacturing co., ltd. (20240312930). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (hist) [5,519 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:56, 19 September 2024 18442635. ANTI-REFLECTION FILM AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.) (hist) [2,765 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:55, 19 September 2024 Taiwan semiconductor manufacturing co., ltd. (20240312913). Vertical Transistors Occupying Reduced Chip Area and the Methods Forming the Same simplified abstract (hist) [4,470 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:55, 19 September 2024 Raytheon Technologies Corporation patent applications published on September 12th, 2024 (hist) [6,062 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:55, 19 September 2024 18119130. HEAT EXCHANGER WITH CROSSING HEAT EXCHANGE TUBES simplified abstract (Raytheon Technologies Corporation) (hist) [3,261 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:55, 19 September 2024 Taiwan semiconductor manufacturing co., ltd. (20240312910). SEMICONDUCTOR DEVICE simplified abstract (hist) [3,256 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:55, 19 September 2024 18117920. CANTED FUEL INJECTOR ASSEMBLY FOR A TURBINE ENGINE simplified abstract (Raytheon Technologies Corporation) (hist) [3,659 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:55, 19 September 2024 Taiwan semiconductor manufacturing co., ltd. (20240312906). SEMICONDUCTOR DEVICE AND METHODS OF FORMATION simplified abstract (hist) [4,040 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:55, 19 September 2024 18117924. TURBINE ENGINE COMBUSTOR WALL WITH APERTURE DEFLECTOR simplified abstract (Raytheon Technologies Corporation) (hist) [3,616 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:55, 19 September 2024 Taiwan semiconductor manufacturing co., ltd. (20240312904). METHOD OF FABRICATING PACKAGE STRUCTURE simplified abstract (hist) [3,657 bytes] Wikipatents (talk | contribs) (Creating a new page)
