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- 06:55, 19 September 2024 Taiwan semiconductor manufacturing co., ltd. (20240312876). Air Gap Seal for Interconnect Air Gap and Method of Fabricating Thereof simplified abstract (hist) [4,017 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:55, 19 September 2024 18118365. AIRFOIL TIP ARRANGEMENT FOR GAS TURBINE ENGINE simplified abstract (Raytheon Technologies Corporation) (hist) [3,019 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:54, 19 September 2024 18118706. Airfoils with Mixed Skin Passageway Cooling simplified abstract (Raytheon Technologies Corporation) (hist) [3,483 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:54, 19 September 2024 Taiwan semiconductor manufacturing co., ltd. (20240312872). APPARATUS INCLUDING COOLING STRUCTURE simplified abstract (hist) [4,277 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:54, 19 September 2024 18118471. Airfoils with Axial Leading Edge Impingement Slots simplified abstract (Raytheon Technologies Corporation) (hist) [3,134 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:54, 19 September 2024 Taiwan semiconductor manufacturing co., ltd. (20240312864). PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (hist) [4,328 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:54, 19 September 2024 18118450. CHEMICAL VAPOR INFILTRATION TOOLING HOLE MODIFICATION FOR OPTIMIZING INFILTRATION IN CERAMIC MATRIX COMPOSITES simplified abstract (Raytheon Technologies Corporation) (hist) [4,007 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:54, 19 September 2024 Taiwan semiconductor manufacturing co., ltd. (20240312859). PACKAGE SYSTEM AND MANUFACTURING METHOD THEREOF simplified abstract (hist) [3,874 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:54, 19 September 2024 18118460. CHEMICAL VAPOR INFILTRATION TOOLING FOR OPTIMIZING INFILTRATION IN CERAMIC MATRIX COMPOSITES simplified abstract (Raytheon Technologies Corporation) (hist) [4,412 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:54, 19 September 2024 Taiwan semiconductor manufacturing co., ltd. (20240312852). MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE simplified abstract (hist) [4,043 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:54, 19 September 2024 Taiwan semiconductor manufacturing co., ltd. (20240312851). SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME simplified abstract (hist) [3,838 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:54, 19 September 2024 18118466. METHOD OF REDUCING SURFACE DEFORMATION FROM Z-CHANNEL CREATION simplified abstract (Raytheon Technologies Corporation) (hist) [4,293 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:54, 19 September 2024 Taiwan semiconductor manufacturing co., ltd. (20240312850). SYSTEMS AND METHODS OF TESTING MEMORY DEVICES simplified abstract (hist) [3,630 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:54, 19 September 2024 18179045. AIRCRAFT HYBRID ELECTRIC PROPULSION ARCHITECTURE ENABLING MODES OF OPERATION simplified abstract (Raytheon Technologies Corporation) (hist) [3,883 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:54, 19 September 2024 Taiwan semiconductor manufacturing co., ltd. (20240312846). GATE PATTERNING FOR STACKED DEVICE STRUCTURE USING SELF-ASSEMBLED MONOLAYER simplified abstract (hist) [4,159 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:54, 19 September 2024 18118443. METHODS FOR COMPLEX GEOMETRY MANDREL REMOVAL OF CERAMIC MATRIX COMPOSITE COMPONENTS simplified abstract (Raytheon Technologies Corporation) (hist) [3,182 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:54, 19 September 2024 Taiwan semiconductor manufacturing co., ltd. (20240312845). SEMICONDUCTOR DEVICE FABRICATION METHODS AND STRUCTURES THEREOF simplified abstract (hist) [4,019 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:54, 19 September 2024 18118448. CHEMICAL VAPOR INFILTRATION TOOLING FOR OPTIMIZING INFILTRATION IN CERAMIC MATRIX COMPOSITES simplified abstract (Raytheon Technologies Corporation) (hist) [4,718 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:54, 19 September 2024 Taiwan semiconductor manufacturing co., ltd. (20240312844). SOURCE/DRAIN EPI STRUCTURE FOR IMPROVING CONTACT QUALITY simplified abstract (hist) [3,705 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:54, 19 September 2024 Taiwan semiconductor manufacturing co., ltd. (20240312843). Fin Isolation Regions With Improved Depth Distribution and Methods Forming the Same simplified abstract (hist) [4,343 bytes] Wikipatents (talk | contribs) (Creating a new page)
