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- 06:52, 19 September 2024 Taiwan semiconductor manufacturing co., ltd. (20240312497). MEMORY DEVICE AND METHOD OF OPERATING THE SAME simplified abstract (hist) [2,879 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:52, 19 September 2024 18222979. Lamp Housing Braze Improvement for Semiconductor Rapid Thermal Processing (RTP) Chamber simplified abstract (Applied Materials, Inc.) (hist) [4,432 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:52, 19 September 2024 Taiwan semiconductor manufacturing co., ltd. (20240312492). INTEGRATED CIRCUIT DEVICE, MEMORY CELL AND METHOD simplified abstract (hist) [4,541 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:52, 19 September 2024 18371113. Methods For Forming Gate Structures simplified abstract (Applied Materials, Inc.) (hist) [3,961 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:52, 19 September 2024 Taiwan semiconductor manufacturing co., ltd. (20240312002). IMAGE PROCESSING METHOD AND SYSTEM simplified abstract (hist) [3,334 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:52, 19 September 2024 18118017. HYDROGEN PLASMA TREATMENT FOR FORMING LOGIC DEVICES simplified abstract (Applied Materials, Inc.) (hist) [4,480 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:52, 19 September 2024 Taiwan semiconductor manufacturing co., ltd. (20240311545). GEOMETRIC MASK RULE CHECK WITH FAVORABLE AND UNFAVORABLE ZONES simplified abstract (hist) [3,579 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:51, 19 September 2024 18667082. BACK SIDE DESIGN FOR FLAT SILICON CARBIDE SUSCEPTOR simplified abstract (Applied Materials, Inc.) (hist) [3,976 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:51, 19 September 2024 Taiwan semiconductor manufacturing co., ltd. (20240311543). INTEGRATED CIRCUIT AND METHOD OF FORMING SAME simplified abstract (hist) [4,345 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:51, 19 September 2024 18206443. DIFFERENTIAL SUBSTRATE BACKSIDE COOLING simplified abstract (Applied Materials, Inc.) (hist) [3,649 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:51, 19 September 2024 Taiwan semiconductor manufacturing co., ltd. (20240310744). METHOD AND DEVICE FOR CLEANING SUBSTRATES simplified abstract (hist) [4,132 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:51, 19 September 2024 18666686. METHODS AND SYSTEMS FOR TEMPERATURE CONTROL FOR A SUBSTRATE simplified abstract (Applied Materials, Inc.) (hist) [4,154 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:51, 19 September 2024 Taiwan semiconductor manufacturing co., ltd. (20240310743). METHODS AND APPARATUS FOR REDUCING HYDROGEN PERMEATION FROM LITHOGRAPHIC TOOL simplified abstract (hist) [3,676 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:51, 19 September 2024 18665683. HEATER ASSEMBLY WITH PROCESS GAP CONTROL FOR BATCH PROCESSING CHAMBERS simplified abstract (Applied Materials, Inc.) (hist) [3,238 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:51, 19 September 2024 Taiwan semiconductor manufacturing co., ltd. (20240310741). EXHAUST SYSTEM WITH U-SHAPED PIPES simplified abstract (hist) [3,810 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:51, 19 September 2024 Taiwan semiconductor manufacturing co., ltd. (20240310735). LITHOGRAPHY TECHNIQUES FOR REDUCING DEFECTS simplified abstract (hist) [3,181 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:51, 19 September 2024 18650014. PECVD OF SIBN THIN FILMS WITH LOW LEAKAGE CURRENT simplified abstract (Applied Materials, Inc.) (hist) [5,047 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:51, 19 September 2024 Taiwan semiconductor manufacturing co., ltd. (20240310733). Redistribution Lines and The Method Forming the Same Through Stitching simplified abstract (hist) [3,824 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:51, 19 September 2024 18666251. REAL-TIME DETECTION OF PARTICULATE MATTER DURING DEPOSITION CHAMBER MANUFACTURING simplified abstract (Applied Materials, Inc.) (hist) [4,165 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:51, 19 September 2024 Taiwan semiconductor manufacturing co., ltd. (20240310661). OPTICAL PULSE AMPLITUDE MODULATOR (PAM) WITH MULTIPLE MODULATOR SEGMENTS simplified abstract (hist) [4,033 bytes] Wikipatents (talk | contribs) (Creating a new page)
