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- 06:19, 2 September 2024 Taiwan semiconductor manufacturing company, ltd. (20240290810). PIXEL WITH DUAL-PD LAYOUT simplified abstract (hist) [3,853 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:19, 2 September 2024 Taiwan semiconductor manufacturing company, ltd. (20240290806). ABSORPTION ENHANCEMENT STRUCTURE TO INCREASE QUANTUM EFFICIENCY OF IMAGE SENSOR simplified abstract (hist) [3,886 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:19, 2 September 2024 Taiwan semiconductor manufacturing company, ltd. (20240290786). METHOD TO EMBED PLANAR FETS WITH FINFETS simplified abstract (hist) [4,043 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:18, 2 September 2024 Taiwan semiconductor manufacturing company, ltd. (20240290779). INTEGRATED CIRCUIT WITH STACKED TRANSISTORS HAVING INDUCTORS AT BOTH SIDES OF SUBSTRATE simplified abstract (hist) [4,356 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:18, 2 September 2024 Taiwan semiconductor manufacturing company, ltd. (20240290755). SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE simplified abstract (hist) [2,989 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:18, 2 September 2024 Taiwan semiconductor manufacturing company, ltd. (20240290740). ISOLATION STRUCTURE FOR BOND PAD STRUCTURE simplified abstract (hist) [4,594 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:18, 2 September 2024 Taiwan semiconductor manufacturing company, ltd. (20240290734). PACKAGE STRUCTURE simplified abstract (hist) [4,420 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:18, 2 September 2024 Taiwan semiconductor manufacturing company, ltd. (20240290721). METHOD FOR FORMING SEMICONDUCTOR STRUCTURE simplified abstract (hist) [3,421 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:18, 2 September 2024 Taiwan semiconductor manufacturing company, ltd. (20240290719). INTEGRATED CIRCUIT DEVICE, SYSTEM AND METHOD simplified abstract (hist) [3,505 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:18, 2 September 2024 Taiwan semiconductor manufacturing company, ltd. (20240290718). INTERCONNECT STRUCTURE AND METHOD FOR FORMING THE SAME simplified abstract (hist) [3,441 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:18, 2 September 2024 Taiwan semiconductor manufacturing company, ltd. (20240290712). INTERCONNECT STRUCTURE AND METHOD FOR FORMING THE SAME simplified abstract (hist) [4,148 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:18, 2 September 2024 Taiwan semiconductor manufacturing company, ltd. (20240290682). PACKAGE STRUCTURE WITH BUFFER LAYER EMBEDDED IN LID LAYER simplified abstract (hist) [4,731 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:18, 2 September 2024 Taiwan semiconductor manufacturing company, ltd. (20240290662). Volumeless Threshold Voltage Tuning for Stacked Device Structures simplified abstract (hist) [4,325 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:18, 2 September 2024 Taiwan semiconductor manufacturing company, ltd. (20240290659). SEMICONDUCTOR DEVICE AND FORMING METHOD THEREOF simplified abstract (hist) [3,704 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:17, 2 September 2024 Taiwan semiconductor manufacturing company, ltd. (20240290656). REDISTRIBUTION LINES WITH PROTECTION LAYERS AND METHOD FORMING SAME simplified abstract (hist) [3,765 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:17, 2 September 2024 Taiwan semiconductor manufacturing company, ltd. (20240290654). Polishing Interconnect Structures In Semiconductor Devices simplified abstract (hist) [4,391 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:17, 2 September 2024 Taiwan semiconductor manufacturing company, ltd. (20240290653). INTEGRATED CIRCUIT INTERCONNECT STRUCTURE HAVING DISCONTINUOUS BARRIER LAYER AND AIR GAP simplified abstract (hist) [3,675 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:17, 2 September 2024 Taiwan semiconductor manufacturing company, ltd. (20240290652). SEMICONDUCTOR DEVICE simplified abstract (hist) [4,724 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:17, 2 September 2024 Taiwan semiconductor manufacturing company, ltd. (20240290630). Incorporating Nitrogen in Dipole Engineering for Multi-Threshold Voltage Applications in Stacked Device Structures simplified abstract (hist) [4,611 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 06:17, 2 September 2024 Taiwan semiconductor manufacturing company, ltd. (20240290620). CUT METAL GATE PROCESSES simplified abstract (hist) [3,855 bytes] Wikipatents (talk | contribs) (Creating a new page)
