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- 05:41, 4 July 2024 Intel corporation (20240222485). TRANSFER-FREE 2D FET AND FEFET DEVICE FABRICATION BY 2D MATERIAL GROWTH IN SUPERLATTICE WITH NITRIDES simplified abstract (hist) [5,139 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:41, 4 July 2024 Intel corporation (20240222484). TRANSISTOR WITH CHANNEL MATERIAL IN A STACK WITH INSULATOR MATERIAL SUPPORTS simplified abstract (hist) [6,170 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:41, 4 July 2024 Intel corporation (20240222483). 2D NANORIBBONS UTILIZING SILICON SCAFFOLDING simplified abstract (hist) [5,096 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:40, 4 July 2024 Intel corporation (20240222482). TRANSISTOR STRUCTURES HAVING A DOPING LAYER ON TRANSITION METAL DICHALCOGENIDE LAYERS OUTSIDE OF THE CHANNEL REGION simplified abstract (hist) [4,504 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:40, 4 July 2024 Intel corporation (20240222475). TECHNOLOGIES FOR HIGH-PERFORMANCE MAGNETOELECTRIC SPIN-ORBIT LOGIC simplified abstract (hist) [4,488 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:40, 4 July 2024 Intel corporation (20240222469). TRANSISTOR IN A SILICON CARBIDE LAYER AND A TRANSISTOR IN A GALLIUM NITRIDE LAYER IN A CASCODE DESIGN simplified abstract (hist) [3,444 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:40, 4 July 2024 Intel corporation (20240222461). BEOL CONTACT METALS FOR 2D TRANSISTORS simplified abstract (hist) [6,028 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:40, 4 July 2024 Intel corporation (20240222447). GATE CUT, AND SOURCE AND DRAIN CONTACTS simplified abstract (hist) [5,969 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:40, 4 July 2024 Intel corporation (20240222441). SELECTIVE GATE OXIDE FORMATION ON 2D MATERIAL BASED TRANSISTOR DEVICES simplified abstract (hist) [4,587 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:40, 4 July 2024 Intel corporation (20240222440). TRANSISTOR WITH A BODY AND BACK GATE STRUCTURE IN DIFFERENT MATERIAL LAYERS simplified abstract (hist) [3,393 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:40, 4 July 2024 Intel corporation (20240222438). TRANSISTOR INCLUDING WIDE BAND GAP MATERIALS simplified abstract (hist) [3,627 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:40, 4 July 2024 Intel corporation (20240222435). COUPLING A LAYER OF SILICON CARBIDE WITH AN ADJACENT LAYER simplified abstract (hist) [4,070 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:40, 4 July 2024 Intel corporation (20240222428). SEEDED GROWTH FOR 2D NANORIBBON TRANSISTORS simplified abstract (hist) [4,890 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:39, 4 July 2024 Intel corporation (20240222376). TECHNOLOGIES FOR RIBBON FIELD EFFECT TRANSISTORS WITH VARIABLE FIN CHANNEL DIMENSIONS simplified abstract (hist) [4,481 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:39, 4 July 2024 Intel corporation (20240222360). INTEGRATED CIRCUIT STRUCTURES HAVING STACKED ELECTROSTATIC DISCHARGE (ESD) FOR BACKSIDE POWER DELIVERY simplified abstract (hist) [3,194 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:39, 4 July 2024 Intel corporation (20240222350). OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-ON- PACKAGE STRUCTURES simplified abstract (hist) [4,468 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:39, 4 July 2024 Intel corporation (20240222347). MODULAR MEMORY BLOCKS FOR INTEGRATED CIRCUIT DEVICES simplified abstract (hist) [4,559 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:39, 4 July 2024 Intel corporation (20240222346). ARCHITECTURES FOR MEMORY ON INTEGRATED CIRCUIT DEVICE PACKAGES simplified abstract (hist) [4,296 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:39, 4 July 2024 Intel corporation (20240222345). DIE ATTACH IN GLASS CORE PACKAGE THROUGH ORGANIC-TO-ORGANIC BONDING simplified abstract (hist) [4,974 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:39, 4 July 2024 Intel corporation (20240222328). PACKAGE ARCHITECTURE WITH MEMORY CHIPS HAVING DIFFERENT PROCESS REGIONS simplified abstract (hist) [4,637 bytes] Wikipatents (talk | contribs) (Creating a new page)