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- 05:39, 4 July 2024 Intel corporation (20240222326). PACKAGE ARCHITECTURE WITH MEMORY CHIPS HAVING DIFFERENT PROCESS REGIONS simplified abstract (hist) [5,890 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:39, 4 July 2024 Intel corporation (20240222321). PACKAGE ARCHITECTURE WITH MEMORY CHIPS HAVING DIFFERENT PROCESS REGIONS simplified abstract (hist) [4,521 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:38, 4 July 2024 Intel corporation (20240222320). DIRECTLY BONDED MULTICHIP IC DEVICE PACKAGES simplified abstract (hist) [3,244 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:38, 4 July 2024 Intel corporation (20240222304). METHODS AND APPARATUS TO REDUCE SOLDER BUMP BRIDGING BETWEEN TWO SUBSTRATES simplified abstract (hist) [5,018 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:38, 4 July 2024 Intel corporation (20240222301). METHODS AND APPARATUS FOR OPTICAL THERMAL TREATMENT IN SEMICONDUCTOR PACKAGES simplified abstract (hist) [4,955 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:38, 4 July 2024 Intel corporation (20240222298). TECHNOLOGIES FOR DIE RECYCLING FOR HIGH YIELD PACKAGING simplified abstract (hist) [3,748 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:38, 4 July 2024 Intel corporation (20240222295). STACKED INORGANIC-ORGANIC DIELECTRICS FOR THIN FILM CAPACITORS IN PACKAGE SUBSTRATES simplified abstract (hist) [3,774 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:38, 4 July 2024 Intel corporation (20240222293). TECHNOLOGIES FOR PACKAGE SUBSTRATES WITH ASYMMETRIC PLATING simplified abstract (hist) [4,046 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:38, 4 July 2024 Intel corporation (20240222288). SOCKET INTERFACE FRAMES FOR DEVICES WITH IMPROVED-PERFORMANCE SUBSTRATES simplified abstract (hist) [4,725 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:38, 4 July 2024 Intel corporation (20240222286). HYBRID BONDED DIE-LAST INTERCONNECT ARCHITECTURES simplified abstract (hist) [3,322 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:38, 4 July 2024 Intel corporation (20240222283). METHODS AND APPARATUS TO PREVENT OVER-ETCH IN SEMICONDUCTOR PACKAGES simplified abstract (hist) [4,118 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:38, 4 July 2024 Intel corporation (20240222282). ZERO MISALIGNED PAD AND VIA METALLIZATION STRUCTURES IN GLASS PACKAGE SUBSTRATES simplified abstract (hist) [3,807 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:38, 4 July 2024 Intel corporation (20240222279). TECHNOLOGIES FOR VERTICALLY INTERCONNECTED GLASS CORE ARCHITECTURE simplified abstract (hist) [4,014 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:37, 4 July 2024 Intel corporation (20240222276). INTEGRATED CIRCUIT STRUCTURES HAVING LOOKUP TABLE DECODERS FOR FPGAS simplified abstract (hist) [4,478 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:37, 4 July 2024 Intel corporation (20240222274). HYBRID INTEGRATION OF BACK-END-OF-LINE LAYERS FOR DISAGGREGATED TECHNOLOGIES simplified abstract (hist) [4,371 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:37, 4 July 2024 Intel corporation (20240222272). DOUBLE INTERCONNECTS FOR STITCHED DIES simplified abstract (hist) [3,887 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:37, 4 July 2024 Intel corporation (20240222271). INTEGRATED CIRCUIT STRUCTURES HAVING ROUTING ACROSS LAYERS OF CHANNEL STRUCTURES simplified abstract (hist) [3,929 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:37, 4 July 2024 Intel corporation (20240222270). VIA FUSE WITH METAL-INSULATOR-METAL ARCHITECTURE AND IMPROVED ELECTRODE MATERIAL simplified abstract (hist) [3,532 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:37, 4 July 2024 Intel corporation (20240222259). METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO PRODUCE INTEGRATED CIRCUIT PACKAGES HAVING SILICON NITRIDE ADHESION PROMOTERS simplified abstract (hist) [5,326 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 05:37, 4 July 2024 Intel corporation (20240222258). GLASS SUBSTRATES WITH SELF-ASSEMBLED MONOLAYERS FOR COPPER ADHESION simplified abstract (hist) [3,083 bytes] Wikipatents (talk | contribs) (Creating a new page)