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- 02:33, 26 April 2024 Samsung electronics co., ltd. (20240136272). SEMICONDUCTOR PACKAGES simplified abstract (hist) [3,659 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 02:33, 26 April 2024 Dell products l.p. (20240130033). HEATSINK BASED POWER DELIVERY FOR CPUS simplified abstract (hist) [3,761 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 02:33, 26 April 2024 Samsung electronics co., ltd. (20240136271). SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (hist) [3,254 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 02:33, 26 April 2024 Dell products l.p. (20240129973). ULTRA-LOW POWER ACCURATE RANGING AND PC WAKE FOR WIRELESS DOCKING APPLICATIONS simplified abstract (hist) [4,028 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 02:33, 26 April 2024 Samsung electronics co., ltd. (20240136266). SEMICONDUCTOR PACKAGE simplified abstract (hist) [3,898 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 02:33, 26 April 2024 Samsung electronics co., ltd. (20240136264). FAN-OUT SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE FAN-OUT SEMICONDUCTOR PACKAGE simplified abstract (hist) [5,147 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 02:33, 26 April 2024 Dell products l.p. (20240129928). PACKET DATA CONVERGENCE PROTOCOL DUPLICATION COOPERATIVE CONFIGURED GRANT simplified abstract (hist) [4,659 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 02:33, 26 April 2024 Samsung electronics co., ltd. (20240136262). SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME simplified abstract (hist) [3,291 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 02:33, 26 April 2024 Samsung electronics co., ltd. (20240136261). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (hist) [3,802 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 02:33, 26 April 2024 Dell products l.p. (20240129736). MITIGATING AGAINST SPURIOUS DELIVERIES IN DEVICE ONBOARDING simplified abstract (hist) [3,662 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 02:33, 26 April 2024 Dell products l.p. (20240129608). CAMERA SENSOR AND LENS HOUSING STRUCTURE FOR ENHANCED MANUFACTURE ASSEMBLY AND REPAIR simplified abstract (hist) [3,959 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 02:33, 26 April 2024 Samsung electronics co., ltd. (20240136255). INTEGRATED CIRCUIT DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (hist) [4,767 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 02:32, 26 April 2024 Dell products l.p. (20240129607). CAMERA HOUSING STRUCTURE FOR ENHANCED MANUFACTURE ASSEMBLY AND REPAIR simplified abstract (hist) [3,268 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 02:32, 26 April 2024 Samsung electronics co., ltd. (20240136254). INTEGRATED CIRCUIT DEVICE simplified abstract (hist) [4,557 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 02:32, 26 April 2024 Dell products l.p. (20240129403). DUMMY NODE MANAGEMENT IN EDGE COMPUTING simplified abstract (hist) [4,356 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 02:32, 26 April 2024 Samsung electronics co., ltd. (20240136250). SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION STRUCTURE simplified abstract (hist) [3,371 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 02:32, 26 April 2024 Dell products l.p. (20240129314). ACCESS ENFORCEMENT THROUGH AUTHENTICATION VERIFICATION ENTITY (AVE) simplified abstract (hist) [3,444 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 02:32, 26 April 2024 Samsung electronics co., ltd. (20240136237). TEST SUBSTRATE, TEST DEVICE, AND TEST METHOD simplified abstract (hist) [3,728 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 02:32, 26 April 2024 Dell products l.p. (20240129294). AUTOMATICALLY GENERATING TASK-BASED AND LIMITED-PRIVILEGE USER SECURITY CREDENTIALS simplified abstract (hist) [4,344 bytes] Wikipatents (talk | contribs) (Creating a new page)
- 02:32, 26 April 2024 Samsung electronics co., ltd. (20240136234). METHOD OF MEASURING OVERLAY OFFSET AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME simplified abstract (hist) [4,844 bytes] Wikipatents (talk | contribs) (Creating a new page)