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• CANON KABUSHIKI KAISHA patent applications on March 28th, 2024
  IPC Code(s): G06T17/00, G06T7/70, H04N23/69 ...e information.[[Category:G06T17/00]][[Category:G06T7/70]][[Category:H04N23/69]][[Category:canon kabushiki kaisha]]
  91 KB (13,694 words) - 04:46, 11 April 2024
• Audio Technologies patent applications on April 18th, 2024
  IPC Code(s): G06Q20/34, H04W4/80, H04W12/06, H04W76/10 [[Category:G06Q20/34]][[Category:H04W4/80]][[Category:H04W12/06]][[Category:H04W76/10]][[Category:Capital One Services, LLC]]
  57 KB (7,991 words) - 16:36, 20 April 2024
• CANON KABUSHIKI KAISHA patent applications on May 30th, 2024
  IPC Code(s): G02B9/12, G02B7/02, G02B13/02, H04N23/54, H04N23/63, H04N23/69 ...y:G02B13/02]][[Category:H04N23/54]][[Category:H04N23/63]][[Category:H04N23/69]][[Category:canon kabushiki kaisha]]
  125 KB (19,222 words) - 06:46, 31 May 2024
• Samsung Electronics Co., Ltd. patent applications on April 4th, 2024
  IPC Code(s): H04N23/67, G03B13/36, H04N23/69 ...cus distance.[[Category:H04N23/67]][[Category:G03B13/36]][[Category:H04N23/69]][[Category:samsung electronics co., ltd.]]
  164 KB (25,270 words) - 04:28, 11 April 2024
• CANON KABUSHIKI KAISHA patent applications on February 15th, 2024
  ...arbon content of the photocurable composition after curing may be at least 69%. the photocurable composition may have a low thermal shrinkage after curin IPC Code(s): H04W12/03, H04L9/40
  82 KB (12,483 words) - 04:35, 20 February 2024
• SAMSUNG ELECTRONICS CO., LTD. patent applications on April 11th, 2024
  IPC Code(s): H04N23/69, H04N23/63 ...nd camera based on the lens moved to the second position.[[Category:H04N23/69]][[Category:H04N23/63]][[Category:samsung electronics co., ltd.]]
  223 KB (34,353 words) - 07:34, 12 April 2024
• Samsung Electronics Co., Ltd. patent applications on April 18th, 2024
  IPC Code(s): H04N23/80, H04N23/45, H04N23/60, H04N23/63, H04N23/65, H04N23/69 ...y:H04N23/60]][[Category:H04N23/63]][[Category:H04N23/65]][[Category:H04N23/69]][[Category:samsung electronics co., ltd.]]
  275 KB (42,441 words) - 17:01, 20 April 2024
• SAMSUNG ELECTRONICS CO., LTD. patent applications on January 25th, 2024
  IPC Code(s): H04W12/06, H04W12/69, H04W8/18 ...entifier from the service provider.[[Category:H04W12/06]][[Category:H04W12/69]][[Category:H04W8/18]][[Category:samsung electronics co., ltd.]]
  231 KB (35,617 words) - 10:12, 30 January 2024
• SAMSUNG ELECTRONICS CO., LTD. patent applications on March 28th, 2024
  IPC Code(s): G06T19/00, H04N23/61, H04N23/69, H04N23/695 ...ndependently.[[Category:G06T19/00]][[Category:H04N23/61]][[Category:H04N23/69]][[Category:H04N23/695]][[Category:samsung electronics co., ltd.]]
  222 KB (34,040 words) - 07:20, 10 April 2024
• SAMSUNG ELECTRONICS CO., LTD. patent applications on February 8th, 2024
  IPC Code(s): H04N23/45, H04N23/55, H04N23/69, G03B17/17, H04N23/51 ...image sensor.[[Category:H04N23/45]][[Category:H04N23/55]][[Category:H04N23/69]][[Category:G03B17/17]][[Category:H04N23/51]][[Category:samsung electronics
  286 KB (44,135 words) - 04:08, 9 February 2024
• Samsung Electronics Co., Ltd. patent applications on February 29th, 2024
  IPC Code(s): H04M1/2757, H04L65/1104, H04W12/06 ...r to a second ue.[[Category:H04M1/2757]][[Category:H04L65/1104]][[Category:H04W12/06]][[Category:samsung electronics co., ltd.]]
  341 KB (52,649 words) - 04:58, 4 March 2024
• Blockchain patent applications on April 11th, 2024
  IPC Code(s): A61K9/51, A61K31/713, A61K47/54, A61K47/69, A61K48/00 ...y:A61K9/51]][[Category:A61K31/713]][[Category:A61K47/54]][[Category:A61K47/69]][[Category:A61K48/00]][[Category:THE JOHNS HOPKINS UNIVERSITY]]
  292 KB (41,747 words) - 07:04, 12 April 2024
• Blockchain patent applications on February 15th, 2024
  ...): A01D34/00, G05D1/02, B60L50/60, B60L53/62, A01D34/84, A01D34/54, A01D34/69 ...y:B60L53/62]][[Category:A01D34/84]][[Category:A01D34/54]][[Category:A01D34/69]][[Category:TTI (MACAO COMMERCIAL OFFSHORE) LIMITED]]
  300 KB (42,769 words) - 03:16, 19 February 2024
• Blockchain patent applications on February 8th, 2024
  IPC Code(s): A63F13/69, A63F13/79 [[Category:A63F13/69]][[Category:A63F13/79]][[Category:Galiant Arts, LLC]]
  338 KB (47,968 words) - 03:59, 9 February 2024
• Blockchain patent applications on April 18th, 2024
  IPC Code(s): A61K31/5575, A61K8/69, A61K9/00, A61K9/06, A61K31/165, A61K31/191, A61K31/216, A61K31/25, A61Q19/ [[Category:A61K31/5575]][[Category:A61K8/69]][[Category:A61K9/00]][[Category:A61K9/06]][[Category:A61K31/165]][[Categor
  313 KB (44,711 words) - 16:36, 20 April 2024
• Blockchain patent applications on February 22nd, 2024
  IPC Code(s): G06F21/32, H04W12/06, G06Q20/32, G06F21/34, G06Q20/40, G06V40/50, G06V40/60, G06V40/70, G06V4 [[Category:G06F21/32]][[Category:H04W12/06]][[Category:G06Q20/32]][[Category:G06F21/34]][[Category:G06Q20/40]][[Cat
  281 KB (40,348 words) - 07:08, 22 February 2024
• Blockchain patent applications on March 21st, 2024
  IPC Code(s): A63F13/792, A63F13/69, A63F13/87 [[Category:A63F13/792]][[Category:A63F13/69]][[Category:A63F13/87]][[Category:Sony Interactive Entertainment LLC]]
  354 KB (50,663 words) - 09:14, 21 March 2024
• Blockchain patent applications on 22nd Mar 2024
  IPC Code(s): A63F13/792, A63F13/69, A63F13/87 [[Category:A63F13/792]][[Category:A63F13/69]][[Category:A63F13/87]][[Category:Sony Interactive Entertainment LLC]]
  354 KB (50,663 words) - 10:49, 25 March 2024
• Blockchain patent applications on January 25th, 2024
  IPC Code(s): A61K31/704, A61K31/175, A61K31/198, A61K31/5377, A61K31/69, A61K31/138, A61K35/28, A61K38/05, A61K38/07 ...1K31/175]][[Category:A61K31/198]][[Category:A61K31/5377]][[Category:A61K31/69]][[Category:A61K31/138]][[Category:A61K35/28]][[Category:A61K38/05]][[Categ
  352 KB (50,259 words) - 10:01, 30 January 2024
• Blockchain patent applications on March 14th, 2024
  ...e(s): B60R1/02, G06T7/60, G06T7/73, G06V10/25, G06V20/56, H04N7/18, H04N23/69, H04N23/695 ...ry:G06V10/25]][[Category:G06V20/56]][[Category:H04N7/18]][[Category:H04N23/69]][[Category:H04N23/695]][[Category:Stoneridge, Inc.]]
  369 KB (52,527 words) - 02:32, 20 March 2024

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