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• CANON KABUSHIKI KAISHA patent applications on February 29th, 2024
  IPC Code(s): B64U20/87, H04N23/51, H04N23/66, H04N23/69 ...y:B64U20/87]][[Category:H04N23/51]][[Category:H04N23/66]][[Category:H04N23/69]][[Category:canon kabushiki kaisha]]
  108 KB (16,553 words) - 04:58, 4 March 2024
• LG ELECTRONICS INC. patent applications on February 15th, 2024
  IPC Code(s): F24C7/08, F24C15/00, G06T7/73, H04N7/18, H04N23/69, H04N23/67 ...ory:F24C15/00]][[Category:G06T7/73]][[Category:H04N7/18]][[Category:H04N23/69]][[Category:H04N23/67]][[Category:lg electronics inc.]]
  61 KB (9,718 words) - 04:36, 20 February 2024
• Patent Applications Report for 26th Jan 2024
  [[:Category:CANON KABUSHIKI KAISHA|CANON KABUSHIKI KAISHA]]: 69 patent applications[[Category:CANON KABUSHIKI KAISHA]] ...o Technology, Inc. has filed patents in the areas of [[:Category:H04W12/06|H04W12/06]] (7 applications), [[:Category:H04L9/40|H04L9/40]] (7 applications), [[
  45 KB (5,610 words) - 10:14, 30 January 2024
• Patent Applications Report for 17th May 2024
  [[:Category:G06V10/82|G06V10/82]]: 69 [[:Category:H04W12/63|H04W12/63]] (2 applications), [[:Category:C01C1/242|C01C1/242]] (2 applications),
  47 KB (5,826 words) - 06:52, 24 May 2024
• CANON KABUSHIKI KAISHA patent applications on March 28th, 2024
  IPC Code(s): G06T17/00, G06T7/70, H04N23/69 ...e information.[[Category:G06T17/00]][[Category:G06T7/70]][[Category:H04N23/69]][[Category:canon kabushiki kaisha]]
  91 KB (13,694 words) - 04:46, 11 April 2024
• Intel Corporation patent applications on June 20th, 2024
  IPC Code(s): H04B10/50, H04B10/69 ...ts may be described and/or claimed.[[Category:H04B10/50]][[Category:H04B10/69]][[Category:CPC_H04B10/503]][[Category:intel corporation]]
  74 KB (11,374 words) - 18:27, 20 June 2024
• INTEL CORPORATION patent applications on June 20th, 2024
  IPC Code(s): H04B10/50, H04B10/69 ...ts may be described and/or claimed.[[Category:H04B10/50]][[Category:H04B10/69]][[Category:CPC_H04B10/503]][[Category:intel corporation]]
  74 KB (11,374 words) - 16:33, 21 June 2024
• Audio Technologies patent applications on April 18th, 2024
  IPC Code(s): G06Q20/34, H04W4/80, H04W12/06, H04W76/10 [[Category:G06Q20/34]][[Category:H04W4/80]][[Category:H04W12/06]][[Category:H04W76/10]][[Category:Capital One Services, LLC]]
  57 KB (7,991 words) - 16:36, 20 April 2024
• CANON KABUSHIKI KAISHA patent applications on May 30th, 2024
  IPC Code(s): G02B9/12, G02B7/02, G02B13/02, H04N23/54, H04N23/63, H04N23/69 ...y:G02B13/02]][[Category:H04N23/54]][[Category:H04N23/63]][[Category:H04N23/69]][[Category:canon kabushiki kaisha]]
  125 KB (19,222 words) - 06:46, 31 May 2024
• Samsung Electronics Co., Ltd. patent applications on April 4th, 2024
  IPC Code(s): H04N23/67, G03B13/36, H04N23/69 ...cus distance.[[Category:H04N23/67]][[Category:G03B13/36]][[Category:H04N23/69]][[Category:samsung electronics co., ltd.]]
  164 KB (25,270 words) - 04:28, 11 April 2024
• GOOGLE LLC patent applications on June 20th, 2024
  [[:Category:GOOGLE LLC|GOOGLE LLC]]: 69 patent applications[[Category:GOOGLE LLC]] ...F21/64, G06F40/226, H04L9/40, H04L67/01, H04L67/02, H04L67/568, H04W12/03, H04W12/08
  92 KB (14,460 words) - 16:08, 21 June 2024
• CANON KABUSHIKI KAISHA patent applications on February 15th, 2024
  ...arbon content of the photocurable composition after curing may be at least 69%. the photocurable composition may have a low thermal shrinkage after curin IPC Code(s): H04W12/03, H04L9/40
  82 KB (12,483 words) - 04:35, 20 February 2024
• SAMSUNG ELECTRONICS CO., LTD. patent applications on April 11th, 2024
  IPC Code(s): H04N23/69, H04N23/63 ...nd camera based on the lens moved to the second position.[[Category:H04N23/69]][[Category:H04N23/63]][[Category:samsung electronics co., ltd.]]
  223 KB (34,353 words) - 07:34, 12 April 2024
• Samsung Electronics Co., Ltd. patent applications on April 18th, 2024
  IPC Code(s): H04N23/80, H04N23/45, H04N23/60, H04N23/63, H04N23/65, H04N23/69 ...y:H04N23/60]][[Category:H04N23/63]][[Category:H04N23/65]][[Category:H04N23/69]][[Category:samsung electronics co., ltd.]]
  275 KB (42,441 words) - 17:01, 20 April 2024
• SAMSUNG ELECTRONICS CO., LTD. patent applications on January 25th, 2024
  IPC Code(s): H04W12/06, H04W12/69, H04W8/18 ...entifier from the service provider.[[Category:H04W12/06]][[Category:H04W12/69]][[Category:H04W8/18]][[Category:samsung electronics co., ltd.]]
  231 KB (35,617 words) - 10:12, 30 January 2024
• SAMSUNG ELECTRONICS CO., LTD. patent applications on March 28th, 2024
  IPC Code(s): G06T19/00, H04N23/61, H04N23/69, H04N23/695 ...ndependently.[[Category:G06T19/00]][[Category:H04N23/61]][[Category:H04N23/69]][[Category:H04N23/695]][[Category:samsung electronics co., ltd.]]
  222 KB (34,040 words) - 07:20, 10 April 2024
• SAMSUNG ELECTRONICS CO., LTD. patent applications on February 8th, 2024
  IPC Code(s): H04N23/45, H04N23/55, H04N23/69, G03B17/17, H04N23/51 ...image sensor.[[Category:H04N23/45]][[Category:H04N23/55]][[Category:H04N23/69]][[Category:G03B17/17]][[Category:H04N23/51]][[Category:samsung electronics
  286 KB (44,135 words) - 04:08, 9 February 2024
• Samsung Electronics Co., Ltd. patent applications on February 29th, 2024
  IPC Code(s): H04M1/2757, H04L65/1104, H04W12/06 ...r to a second ue.[[Category:H04M1/2757]][[Category:H04L65/1104]][[Category:H04W12/06]][[Category:samsung electronics co., ltd.]]
  341 KB (52,649 words) - 04:58, 4 March 2024
• Blockchain patent applications on April 11th, 2024
  IPC Code(s): A61K9/51, A61K31/713, A61K47/54, A61K47/69, A61K48/00 ...y:A61K9/51]][[Category:A61K31/713]][[Category:A61K47/54]][[Category:A61K47/69]][[Category:A61K48/00]][[Category:THE JOHNS HOPKINS UNIVERSITY]]
  292 KB (41,747 words) - 07:04, 12 April 2024
• Blockchain patent applications on February 15th, 2024
  ...): A01D34/00, G05D1/02, B60L50/60, B60L53/62, A01D34/84, A01D34/54, A01D34/69 ...y:B60L53/62]][[Category:A01D34/84]][[Category:A01D34/54]][[Category:A01D34/69]][[Category:TTI (MACAO COMMERCIAL OFFSHORE) LIMITED]]
  300 KB (42,769 words) - 03:16, 19 February 2024

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