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• Intel Corporation patent applications on May 16th, 2024
  ...1L21/02, H01L21/033, H01L21/28, H01L21/285, H01L21/308, H01L21/311, H01L21/762, H01L21/768, H01L21/8234, H01L21/8238, H01L23/522, H01L23/528, H01L23/532, ...01L21/285]][[Category:H01L21/308]][[Category:H01L21/311]][[Category:H01L21/762]][[Category:H01L21/768]][[Category:H01L21/8234]][[Category:H01L21/8238]][[C
  59 KB (9,008 words) - 01:21, 24 May 2024
• International Business Machines Corporation patent applications on April 18th, 2024
  IPC Code(s): H01L29/417, H01L21/762, H01L29/40, H01L29/66, H01L29/775 ...and thus improves process margin.[[Category:H01L29/417]][[Category:H01L21/762]][[Category:H01L29/40]][[Category:H01L29/66]][[Category:H01L29/775]][[Categ
  77 KB (10,865 words) - 03:36, 26 April 2024
• Intel Corporation patent applications on April 4th, 2024
  IPC Code(s): H01L27/088, H01L21/762, H01L23/522, H01L29/06, H01L29/423, H01L29/786 ...the gate cuts of different widths.[[Category:H01L27/088]][[Category:H01L21/762]][[Category:H01L23/522]][[Category:H01L29/06]][[Category:H01L29/423]][[Cate
  166 KB (25,609 words) - 08:05, 11 April 2024
• Intel Corporation patent applications on March 28th, 2024
  ...21/8234, H01L21/033, H01L21/28, H01L21/285, H01L21/308, H01L21/311, H01L21/762, H01L21/768, H01L21/8238, H01L23/522, H01L23/528, H01L23/532, H01L27/088, H ...01L21/285]][[Category:H01L21/308]][[Category:H01L21/311]][[Category:H01L21/762]][[Category:H01L21/768]][[Category:H01L21/8238]][[Category:H01L23/522]][[Ca
  130 KB (19,844 words) - 04:19, 11 April 2024
• SAMSUNG ELECTRONICS CO., LTD. patent applications on February 8th, 2024
  IPC Code(s): H01L29/06, H01L27/088, H01L21/8234, H01L21/762 ...01L29/06]][[Category:H01L27/088]][[Category:H01L21/8234]][[Category:H01L21/762]][[Category:samsung electronics co., ltd.]]
  286 KB (44,135 words) - 04:08, 9 February 2024
• QUALCOMM Incorporated patent applications on March 21st, 2024
  IPC Code(s): H01L23/48, H01L21/762, H01L21/768, H01L23/528, H01L27/12, H01L29/417 ...w for more flexible wiring options.[[Category:H01L23/48]][[Category:H01L21/762]][[Category:H01L21/768]][[Category:H01L23/528]][[Category:H01L27/12]][[Cate
  204 KB (30,965 words) - 07:40, 22 March 2024
• SAMSUNG ELECTRONICS CO., LTD. patent applications on April 25th, 2024
  IPC Code(s): H01L23/48, H01L21/762, H01L21/768, H01L27/088 ...with one end of the via power rail.[[Category:H01L23/48]][[Category:H01L21/762]][[Category:H01L21/768]][[Category:H01L27/088]][[Category:samsung electroni
  233 KB (35,896 words) - 02:47, 26 April 2024
• Samsung Electronics Co., Ltd. patent applications on April 25th, 2024
  IPC Code(s): H01L23/48, H01L21/762, H01L21/768, H01L27/088 ...with one end of the via power rail.[[Category:H01L23/48]][[Category:H01L21/762]][[Category:H01L21/768]][[Category:H01L27/088]][[Category:samsung electroni
  236 KB (36,460 words) - 00:08, 11 June 2024
• Blockchain patent applications on February 1st, 2024
  IPC Code(s): G06Q20/38, H04L47/10, H04L67/125 [[Category:G06Q20/38]][[Category:H04L47/10]][[Category:H04L67/125]][[Category:BehavioSec Inc]]
  313 KB (44,738 words) - 04:14, 2 February 2024
• Blockchain patent applications on February 8th, 2024
  IPC Code(s): G06T19/20, G06T7/194, G06T7/70, G06V10/24, G06V10/25, G06V10/762 ...ry:G06T7/70]][[Category:G06V10/24]][[Category:G06V10/25]][[Category:G06V10/762]][[Category:LUXOTTICA GROUP S.P.A.]]
  338 KB (47,968 words) - 03:59, 9 February 2024
• Blockchain patent applications on February 22nd, 2024
  IPC Code(s): H04L47/762, H04L47/78, H04L47/783, H04L47/80 ...tegory:H04L47/762]][[Category:H04L47/78]][[Category:H04L47/783]][[Category:H04L47/80]][[Category:The Toronto-Dominion Bank]]
  281 KB (40,348 words) - 07:08, 22 February 2024
• Blockchain patent applications on April 4th, 2024
  IPC Code(s): G06V10/762, G06V10/764, G06V10/96 [[Category:G06V10/762]][[Category:G06V10/764]][[Category:G06V10/96]][[Category:SHANGHAITECH UNIVE
  300 KB (42,649 words) - 04:05, 11 April 2024
• Blockchain patent applications on May 16th, 2024
  IPC Code(s): H01L27/146, H01L21/762 [[Category:H01L27/146]][[Category:H01L21/762]][[Category:Taiwan Semiconductor Manufacturing Co., Ltd.]]
  299 KB (42,451 words) - 02:46, 23 May 2024
• Blockchain patent applications on January 11th, 2024
  IPC Code(s): B81C1/00, H01L21/762 [[Category:B81C1/00]][[Category:H01L21/762]][[Category:Soitec]]
  320 KB (45,726 words) - 05:36, 12 January 2024
• Blockchain patent applications on February 29th, 2024
  IPC Code(s): G06V40/10, G06T7/70, G06V10/14, G06V10/22, G06V10/26, G06V10/762 ...y:G06V10/14]][[Category:G06V10/22]][[Category:G06V10/26]][[Category:G06V10/762]][[Category:SIGNIFY HOLDING B.V.]]
  386 KB (55,261 words) - 03:15, 4 March 2024
• Blockchain patent applications on March 14th, 2024
  IPC Code(s): H01L27/02, H01L21/762, H01L27/06 [[Category:H01L27/02]][[Category:H01L21/762]][[Category:H01L27/06]][[Category:TAIWAN SEMICONDUCTOR MANUFACTURING COMPAN
  369 KB (52,527 words) - 02:32, 20 March 2024
• Blockchain patent applications on March 28th, 2024
  IPC Code(s): G01N27/414, G01N33/569, H01L21/762 [[Category:G01N27/414]][[Category:G01N33/569]][[Category:H01L21/762]][[Category:TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.]]
  330 KB (47,230 words) - 07:00, 10 April 2024

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