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  • Patent Applications Report for 7th Apr 2023
    [[:Category:CANON KABUSHIKI KAISHA|CANON KABUSHIKI KAISHA]]: 48 patent applications[[Category:CANON KABUSHIKI KAISHA]] ...s), [[:Category:H03H3/02|H03H3/02]] (6 applications), [[:Category:H04B1/18|H04B1/18]] (6 applications), [[:Category:H03H9/25|H03H9/25]] (6 applications)
    35 KB (4,315 words) - 17:46, 2 January 2024
  • Apple Inc. patent applications on April 25th, 2024
    ...06F3/0482, G06F3/0488, G06F3/16, G06F16/332, G06F16/438, G06F16/45, G06F16/48, G06F16/483, G06F16/487, G06F16/9032, G06F40/40, H04N21/41, H04N21/422, H04 ...G06F16/332]][[Category:G06F16/438]][[Category:G06F16/45]][[Category:G06F16/48]][[Category:G06F16/483]][[Category:G06F16/487]][[Category:G06F16/9032]][[Ca
    42 KB (6,668 words) - 02:20, 26 April 2024
  • Patent Applications Report for 23rd Jun 2023
    ...ktiebolaget LM Ericsson (publ)|Telefonaktiebolaget LM Ericsson (publ)]]: 48 patent applications[[Category:Telefonaktiebolaget LM Ericsson (publ)]] [[:Category:Google LLC|Google LLC]]: 48 patent applications[[Category:Google LLC]]
    36 KB (4,442 words) - 02:33, 5 January 2024
  • Patent Applications Report for 20th Jan 2023
    [[:Category:Kia Corporation|Kia Corporation]]: 48 patent applications[[Category:Kia Corporation]] ...Hyundai Motor Company]] and [[:Category:Kia Corporation|Kia Corporation]]: 48 patent applications.
    38 KB (4,621 words) - 01:18, 2 January 2024
  • TEXAS INSTRUMENTS INCORPORATED patent applications on April 4th, 2024
    IPC Code(s): H01L23/498, H01L21/48, H01L23/00 ...ast 10% in at least one dimension.[[Category:H01L23/498]][[Category:H01L21/48]][[Category:H01L23/00]][[Category:texas instruments incorporated]]
    55 KB (8,096 words) - 08:52, 11 April 2024
  • Apple Inc. patent applications on April 4th, 2024
    ...6F3/04842, G06F3/0488, G06F3/04883, G06F3/04892, G06F3/14, G06F3/16, G06F9/48, G06F21/31, H04L67/025 ...ry:G06F3/04892]][[Category:G06F3/14]][[Category:G06F3/16]][[Category:G06F9/48]][[Category:G06F21/31]][[Category:H04L67/025]][[Category:apple inc.]]
    51 KB (8,114 words) - 07:30, 10 April 2024
  • Microsoft Technology Licensing, LLC patent applications on April 4th, 2024
    ...(4), [[:Category:H04L65/1069|H04L65/1069]] (4), [[:Category:G06F9/48|G06F9/48]] (4), [[:Category:G06F8/71|G06F8/71]] (4) IPC Code(s): G06F9/48, G06F9/38, G06F9/50
    61 KB (9,028 words) - 08:47, 11 April 2024
  • NEC Corporation patent applications on February 29th, 2024
    [[:Category:NEC Corporation|NEC Corporation]]: 48 patent applications[[Category:NEC Corporation]] IPC Code(s): G01S17/89, G01S7/48, G01S17/933
    57 KB (8,554 words) - 04:59, 4 March 2024
  • HUAWEI TECHNOLOGIES CO., LTD. patent applications on June 13th, 2024
    IPC Code(s): H01L23/42, H01L21/48, H01L23/31, H01L23/538 ...surface of the first package body.[[Category:H01L23/42]][[Category:H01L21/48]][[Category:H01L23/31]][[Category:H01L23/538]][[Category:CPC_H01L23/42]][[C
    62 KB (9,608 words) - 04:56, 14 June 2024
  • INTERNATIONAL BUSINESS MACHINES CORPORATION patent applications on May 16th, 2024
    IPC Code(s): H01L23/48, H01L23/528, H01L27/092, H01L29/06, H01L29/423, H01L29/775 ...kside metal level that includes the backside signal line.[[Category:H01L23/48]][[Category:H01L23/528]][[Category:H01L27/092]][[Category:H01L29/06]][[Cate
    92 KB (13,163 words) - 09:01, 23 May 2024
  • Apple Inc. patent applications on March 14th, 2024
    IPC Code(s): C03C15/00, C03C17/00, C03C21/00, H04B1/3827 ...Category:C03C15/00]][[Category:C03C17/00]][[Category:C03C21/00]][[Category:H04B1/3827]][[Category:apple inc.]]
    109 KB (17,410 words) - 03:26, 19 March 2024
  • Intel Corporation patent applications on April 25th, 2024
    ...e areas of [[:Category:G06T1/20|G06T1/20]] (6), [[:Category:G06F9/48|G06F9/48]] (5), [[:Category:G06N5/04|G06N5/04]] (4), [[:Category:H01L23/00|H01L23/00 IPC Code(s): G06F1/329, G06F9/48
    73 KB (11,058 words) - 03:59, 26 April 2024
  • QUALCOMM Incorporated patent applications on June 20th, 2024
    IPC Code(s): H01L23/498, H01L21/48, H01L23/00, H01L23/64 ...ther along the diagonal direction.[[Category:H01L23/498]][[Category:H01L21/48]][[Category:H01L23/00]][[Category:H01L23/64]][[Category:CPC_H01L23/49838]][
    134 KB (20,559 words) - 08:06, 21 June 2024
  • QUALCOMM Incorporated patent applications on March 28th, 2024
    IPC Code(s): H01L23/498, H01L21/48, H01L23/00, H01L25/16 ...er and the third dielectric layer.[[Category:H01L23/498]][[Category:H01L21/48]][[Category:H01L23/00]][[Category:H01L25/16]][[Category:qualcomm incorporat
    184 KB (28,156 words) - 04:09, 11 April 2024
  • QUALCOMM Incorporated patent applications on February 15th, 2024
    IPC Code(s): G01R31/392, G01R31/389, G01R31/367, G01R31/3835, H04B1/40 ...gory:G01R31/389]][[Category:G01R31/367]][[Category:G01R31/3835]][[Category:H04B1/40]][[Category:qualcomm incorporated]]
    168 KB (25,541 words) - 04:34, 20 February 2024
  • Audio Technologies patent applications on February 15th, 2024
    IPC Code(s): G06F3/16, H04B1/3827 [[Category:G06F3/16]][[Category:H04B1/3827]][[Category:Motorola Solutions, Inc.]]
    50 KB (7,001 words) - 03:12, 16 February 2024
  • QUALCOMM Incorporated patent applications on February 8th, 2024
    IPC Code(s): H01L23/498, H01L25/16, H01L21/48, H01L21/56 ...terconnects.[[Category:H01L23/498]][[Category:H01L25/16]][[Category:H01L21/48]][[Category:H01L21/56]][[Category:qualcomm incorporated]]
    160 KB (24,378 words) - 04:08, 9 February 2024
  • HUAWEI TECHNOLOGIES CO., LTD. patent applications on May 16th, 2024
    IPC Code(s): H01Q9/04, H01Q1/38, H01Q1/48 ...metal connector.[[Category:H01Q9/04]][[Category:H01Q1/38]][[Category:H01Q1/48]][[Category:huawei technologies co., ltd.]]
    75 KB (11,603 words) - 00:33, 24 May 2024
  • HUAWEI TECHNOLOGIES CO., LTD. patent applications on January 25th, 2024
    IPC Code(s): H01Q9/04, H01Q1/22, H01Q1/48, H01Q1/50, G06F1/16 ...e first housing.[[Category:H01Q9/04]][[Category:H01Q1/22]][[Category:H01Q1/48]][[Category:H01Q1/50]][[Category:G06F1/16]][[Category:huawei technologies c
    121 KB (18,479 words) - 10:12, 30 January 2024
  • Micron Technology, Inc. patent applications on May 16th, 2024
    [[:Category:Micron Technology, Inc.|Micron Technology, Inc.]]: 48 patent applications[[Category:Micron Technology, Inc.]] IPC Code(s): H04B1/69
    58 KB (8,954 words) - 01:40, 24 May 2024

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