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Create the page "H01L23/46" on this wiki! See also the search results found.

  • 18372885. THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FABRICATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
    [[Category:H01L23/522]] [[Category:H10B41/46]]
    4 KB (579 words) - 06:04, 12 January 2024
  • 17570647. Temperature Control Element Utilized in Device Die Packages simplified abstract (GOOGLE LLC)
    [[Category:H01L23/46]]
    4 KB (546 words) - 05:37, 4 January 2024
  • Taiwan semiconductor manufacturing company, ltd. (20240105901). SEMICONDUCTOR DEVICE AND METHOD simplified abstract
    [[Category:H01L23/522]] [[Category:H01L33/46]]
    4 KB (572 words) - 04:52, 11 April 2024
  • 20240015970. THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FABRICATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
    [[Category:H01L23/522]] [[Category:H10B41/46]]
    5 KB (649 words) - 05:32, 12 January 2024
  • Patent Applications Report for 10th Nov 2023
    [[:Category:Google LLC|Google LLC]]: 46 patent applications[[Category:Google LLC]] ...[[:Category:H01L23/00|H01L23/00]] (5 applications), [[:Category:H01L23/535|H01L23/535]] (4 applications), [[:Category:H01L21/768|H01L21/768]] (4 applications
    28 KB (3,504 words) - 04:04, 4 December 2023
  • Patent Applications Report for 17th Nov 2023
    ...[:Category:H01L29/06|H01L29/06]] (20 applications), [[:Category:H01L23/528|H01L23/528]] (19 applications) [[:Category:Intel Corporation|Intel Corporation]]: 46 patent applications[[Category:Intel Corporation]]
    28 KB (3,469 words) - 04:01, 4 December 2023
  • SK hynix Inc. patent applications on April 11th, 2024
    ...43/27]] (6), [[:Category:H10B41/27|H10B41/27]] (6), [[:Category:H01L23/528|H01L23/528]] (5), [[:Category:G06F12/06|G06F12/06]] (4), [[:Category:H03K5/24|H03K IPC Code(s): G11C11/408, H01L23/528, H10B12/00
    31 KB (5,001 words) - 09:21, 12 April 2024
  • SK hynix Inc. patent applications on May 16th, 2024
    ...16/08]] (6), [[:Category:G11C16/10|G11C16/10]] (6), [[:Category:H01L23/528|H01L23/528]] (5), [[:Category:H10B43/27|H10B43/27]] (5) IPC Code(s): G01R31/28, H01L23/00, H01L23/522, H01L23/528, H01L25/065, H10B80/00
    40 KB (6,505 words) - 02:04, 24 May 2024
  • Patent Applications Report for 5th May 2023
    ...[[:Category:H01L25/18|H01L25/18]] (11 applications), [[:Category:H01L23/00|H01L23/00]] (9 applications), [[:Category:G06F3/06|G06F3/06]] (9 applications), [[ ...[[:Category:H01L25/18|H01L25/18]] (9 applications), [[:Category:H01L23/31|H01L23/31]] (8 applications), [[:Category:H01L24/16|H01L24/16]] (8 applications)
    38 KB (4,550 words) - 01:48, 3 January 2024
  • Micron Technology, Inc. patent applications on April 18th, 2024
    IPC Code(s): G11C29/46, G11C29/12, G11C29/44 ...ure of the memory device exceeds a temperature threshold.[[Category:G11C29/46]][[Category:G11C29/12]][[Category:G11C29/44]][[Category:micron technology,
    42 KB (6,492 words) - 04:18, 26 April 2024
  • Samsung Electronics Co., Ltd. patent applications on January 18th, 2024
    ...00]] (13), [[:Category:H01L29/775|H01L29/775]] (12), [[:Category:H01L23/00|H01L23/00]] (10), [[:Category:H04W72/23|H04W72/23]] (10), [[:Category:H10B43/27|H1 IPC Code(s): G05F3/26, G05F1/46
    93 KB (13,664 words) - 08:59, 30 January 2024
  • Patent Applications Report for 6th Jan 2023
    ...egory:H01L27/11565|H01L27/11565]] (10 applications), [[:Category:H01L23/00|H01L23/00]] (10 applications) ...[:Category:H01L27/108|H01L27/108]] (9 applications), [[:Category:H01L23/00|H01L23/00]] (9 applications), [[:Category:G11C29/42|G11C29/42]] (8 applications)
    38 KB (4,652 words) - 00:59, 2 January 2024
  • Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on April 25th, 2024
    ...acturing Company, Ltd.|Taiwan Semiconductor Manufacturing Company, Ltd.]]: 46 patent applications[[Category:Taiwan Semiconductor Manufacturing Company, L .../02]] (9), [[:Category:H01L21/768|H01L21/768]] (9), [[:Category:H01L23/522|H01L23/522]] (7)
    65 KB (9,346 words) - 04:20, 26 April 2024
  • Patent Applications Report for 5th Jan 2024
    ...[:Category:H01L23/00|H01L23/00]] (11 applications), [[:Category:H01L23/498|H01L23/498]] (10 applications), [[:Category:H01L29/775|H01L29/775]] (10 applicatio Intel Corporation has filed patents in the areas of [[:Category:H01L23/498|H01L23/498]] (21 applications), [[:Category:H01L21/48|H01L21/48]] (18 applications
    38 KB (4,598 words) - 11:03, 5 January 2024
  • Patent Applications Report for 17th Mar 2023
    ...IKI KAISHA TOSHIBA has filed patents in the areas of [[:Category:H01L23/00|H01L23/00]] (7 applications), [[:Category:H01L29/78|H01L29/78]] (6 applications), ...nagement Co., Ltd.|Panasonic Intellectual Property Management Co., Ltd.]]: 46 patent applications[[Category:Panasonic Intellectual Property Management Co
    37 KB (4,476 words) - 06:16, 2 January 2024
  • Patent Applications Report for 24th Mar 2023
    ...[[:Category:H04W72/12|H04W72/12]] (9 applications), [[:Category:H01L23/00|H01L23/00]] (9 applications), [[:Category:H01L24/16|H01L24/16]] (6 applications) ...Category:H01L23/498|H01L23/498]] (14 applications), [[:Category:H01L23/538|H01L23/538]] (12 applications), [[:Category:G02B6/42|G02B6/42]] (11 applications)
    37 KB (4,520 words) - 11:04, 2 January 2024
  • Patent Applications Report for 31st Mar 2023
    ...f [[:Category:G06F1/16|G06F1/16]] (10 applications), [[:Category:H01L23/00|H01L23/00]] (10 applications), [[:Category:H04W72/04|H04W72/04]] (9 applications), ...[[:Category:H01L29/66|H01L29/66]] (16 applications), [[:Category:H01L23/00|H01L23/00]] (14 applications), [[:Category:H01L29/786|H01L29/786]] (14 application
    36 KB (4,396 words) - 17:07, 2 January 2024
  • Patent Applications Report for 26th May 2023
    ...egory:H01L27/11582|H01L27/11582]] (14 applications), [[:Category:H01L23/00|H01L23/00]] (10 applications), [[:Category:H01L27/11556|H01L27/11556]] (10 applica ...naktiebolaget LM Ericsson (publ)|Telefonaktiebolaget LM Ericsson (publ)]]: 46 patent applications[[Category:Telefonaktiebolaget LM Ericsson (publ)]]
    36 KB (4,410 words) - 03:45, 4 January 2024
  • Patent Applications Report for 29th Dec 2023
    ...[[:Category:H10B80/00|H10B80/00]] (11 applications), [[:Category:H01L23/00|H01L23/00]] (10 applications), [[:Category:H10B43/27|H10B43/27]] (10 applications) ...[:Category:H01L23/00|H01L23/00]] (17 applications), [[:Category:H01L23/498|H01L23/498]] (17 applications), [[:Category:H01L29/06|H01L29/06]] (16 applications
    37 KB (4,537 words) - 05:46, 2 January 2024
  • Patent Applications Report for 15th Mar 2024
    ...[[:Category:H10B43/27|H10B43/27]] (12 applications), [[:Category:H01L23/00|H01L23/00]] (12 applications), [[:Category:H01L24/16|H01L24/16]] (11 applications) ...Category:H01L27/092|H01L27/092]] (23 applications), [[:Category:H01L23/522|H01L23/522]] (23 applications)
    47 KB (5,694 words) - 03:06, 19 March 2024

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