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  • Patent Applications Report for 21st Apr 2023
    ...[:Category:H10K59/126|H10K59/126]] (6 applications), [[:Category:G02F1/167|G02F1/167]] (4 applications), [[:Category:G06F3/041|G06F3/041]] (4 applications) [[:Category:Cisco Technology, Inc.|Cisco Technology, Inc.]]: 31 patent applications[[Category:Cisco Technology, Inc.]]
    36 KB (4,472 words) - 18:27, 2 January 2024
  • NEC Corporation patent applications on May 16th, 2024
    IPC Code(s): G02F1/21, G02F1/01 ...rst to third monitor signals, respectively.[[Category:G02F1/21]][[Category:G02F1/01]][[Category:nec corporation]]
    56 KB (8,474 words) - 00:52, 24 May 2024
  • Patent Applications Report for 21st Jun 2024
    ...9), [[:Category:H01L25/065|H01L25/065]] (19), [[:Category:H01L23/31|H01L23/31]] (11), [[:Category:H01L23/48|H01L23/48]] (9), [[:Category:H01L29/06|H01L29 ...ry:H01L25/065|H01L25/065]] (19 applications), [[:Category:H01L23/31|H01L23/31]] (11 applications), [[:Category:H01L23/48|H01L23/48]] (9 applications), [[
    62 KB (7,827 words) - 16:59, 21 June 2024
  • Microsoft Technology Licensing, LLC patent applications on April 18th, 2024
    IPC Code(s): G01S17/894, G02F1/31 ...d second modulatable laser sources.[[Category:G01S17/894]][[Category:G02F1/31]][[Category:microsoft technology licensing, llc]]
    52 KB (7,640 words) - 04:13, 26 April 2024
  • Patent Applications Report for 1st Dec 2023
    ...TD. has filed patents in the areas of [[:Category:H10K59/131|H10K59/131]] (31 applications), [[:Category:G09G3/3233|G09G3/3233]] (16 applications), [[:Ca ...s), [[:Category:H04R3/14|H04R3/14]] (2 applications), [[:Category:G02F1/29|G02F1/29]] (2 applications), [[:Category:H04R17/00|H04R17/00]] (2 applications),
    37 KB (4,614 words) - 06:35, 7 December 2023
  • HUAWEI TECHNOLOGIES CO., LTD. patent applications on June 13th, 2024
    IPC Code(s): G02F1/035, G02B6/122, G02B6/42 CPC Code(s): G02F1/035
    62 KB (9,608 words) - 04:56, 14 June 2024
  • Patent Applications Report for 14th Apr 2023
    [[:Category:BOE Technology Group Co., Ltd.|BOE Technology Group Co., Ltd.]]: 31 patent applications[[Category:BOE Technology Group Co., Ltd.]] ...[[:Category:H10K71/00|H10K71/00]] (5 applications), [[:Category:G02F1/1333|G02F1/1333]] (4 applications), [[:Category:G09G3/3291|G09G3/3291]] (4 application
    36 KB (4,381 words) - 18:22, 2 January 2024
  • Intel Corporation patent applications on January 25th, 2024
    IPC Code(s): G02F1/313, G02F1/29, G01S7/481 ...eguides and/or one or more beam splitters.[[Category:G02F1/313]][[Category:G02F1/29]][[Category:G01S7/481]][[Category:intel corporation]]
    82 KB (12,470 words) - 10:13, 30 January 2024
  • Samsung Display Co., Ltd. patent applications on March 28th, 2024
    IPC Code(s): G06F3/041, G02F1/1333, G06F3/044, H01L27/12, H01L27/15, H10K59/121, H10K59/122, H10K59/123, ...ch the touch sensor electrode is disposed.[[Category:G06F3/041]][[Category:G02F1/1333]][[Category:G06F3/044]][[Category:H01L27/12]][[Category:H01L27/15]][[C
    118 KB (18,673 words) - 04:29, 11 April 2024
  • Microsoft Technology Licensing, LLC patent applications on April 11th, 2024
    IPC Code(s): G06F21/31, G06N20/00, H04L9/40 ...y generate and modify the corresponding user risk scores.[[Category:G06F21/31]][[Category:G06N20/00]][[Category:H04L9/40]][[Category:microsoft technology
    52 KB (7,740 words) - 09:06, 12 April 2024
  • Dell Products L.P. patent applications on April 18th, 2024
    IPC Code(s): G02F1/1335, G02B5/30, G02F1/1333, G02F1/13357, G06F3/041 ...ategory:G02F1/1335]][[Category:G02B5/30]][[Category:G02F1/1333]][[Category:G02F1/13357]][[Category:G06F3/041]][[Category:dell products l.p.]]
    85 KB (13,610 words) - 02:34, 26 April 2024
  • Intel Corporation patent applications on May 30th, 2024
    IPC Code(s): G02F1/01, G02B6/125 ...and an optical phase change material over the optical waveguide.[[Category:G02F1/01]][[Category:G02B6/125]][[Category:intel corporation]]
    61 KB (9,294 words) - 07:57, 31 May 2024
  • NEC Corporation patent applications on February 15th, 2024
    IPC Code(s): H01S3/067, H01S3/094, H01S3/0941, H01S3/00, G02F1/31, H01S3/13, H04B10/25 ...ry:H01S3/094]][[Category:H01S3/0941]][[Category:H01S3/00]][[Category:G02F1/31]][[Category:H01S3/13]][[Category:H04B10/25]][[Category:nec corporation]]
    77 KB (11,586 words) - 04:35, 20 February 2024
  • Patent Applications Report for 7th Jun 2024
    ...1), [[:Category:CPC_G02C7/027|G02C7/027]] (1), [[:Category:CPC_G02F1/13345|G02F1/13345]] (1), [[:Category:CPC_G04G17/04|G04G17/04]] (1) ...egory:B01L3/00|B01L3/00]] (1 applications), [[:Category:C07C255/31|C07C255/31]] (1 applications), [[:Category:G10L17/26|G10L17/26]] (1 applications), [[:
    60 KB (7,485 words) - 02:41, 11 June 2024
  • Huawei Technologies Co., Ltd. patent applications on February 15th, 2024
    IPC Code(s): H01L23/31, H01L23/367, H01L23/498, H01L23/00, H01L21/56 ...rst portion of the encapsulant and the at least one lead.[[Category:H01L23/31]][[Category:H01L23/367]][[Category:H01L23/498]][[Category:H01L23/00]][[Cate
    112 KB (17,140 words) - 04:35, 20 February 2024
  • SAMSUNG ELECTRONICS CO., LTD. patent applications on February 1st, 2024
    IPC Code(s): G02B7/28, G02B27/01, G02F1/29 ...us adjustment region.[[Category:G02B7/28]][[Category:G02B27/01]][[Category:G02F1/29]][[Category:samsung electronics co., ltd.]]
    244 KB (37,693 words) - 04:25, 2 February 2024
  • International Business Machines Corporation patent applications on June 13th, 2024
    IPC Code(s): H01L23/31, H01L23/29, H01L23/48 ...nd-of-line region and the second back-end-of-line region.[[Category:H01L23/31]][[Category:H01L23/29]][[Category:H01L23/48]][[Category:CPC_H01L23/3192]][[
    104 KB (15,054 words) - 04:11, 14 June 2024
  • Samsung Electronics Co., Ltd. patent applications on June 20th, 2024
    ...9), [[:Category:H01L25/065|H01L25/065]] (19), [[:Category:H01L23/31|H01L23/31]] (11), [[:Category:H01L23/48|H01L23/48]] (9), [[:Category:H01L29/06|H01L29 .../02, F25D27/00, G02F1/1335, G02F1/1339, G02F1/1345, G02F1/167, G02F1/1677, G02F1/1685, G09G3/34
    294 KB (45,616 words) - 07:21, 21 June 2024
  • SAMSUNG ELECTRONICS CO., LTD. patent applications on June 20th, 2024
    ...9), [[:Category:H01L25/065|H01L25/065]] (19), [[:Category:H01L23/31|H01L23/31]] (11), [[:Category:H01L23/48|H01L23/48]] (9), [[:Category:H01L29/06|H01L29 .../02, F25D27/00, G02F1/1335, G02F1/1339, G02F1/1345, G02F1/167, G02F1/1677, G02F1/1685, G09G3/34
    294 KB (45,616 words) - 07:29, 21 June 2024
  • SAMSUNG ELECTRONICS CO., LTD. patent applications on June 6th, 2024
    IPC Code(s): G01N21/95, G01N21/88, G02F1/35, G02F1/355, G02F1/37, H01L21/66 ...[Category:G01N21/88]][[Category:G02F1/35]][[Category:G02F1/355]][[Category:G02F1/37]][[Category:H01L21/66]][[Category:samsung electronics co., ltd.]]
    213 KB (32,841 words) - 17:39, 9 June 2024

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