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• HUAWEI TECHNOLOGIES CO., LTD. patent applications on April 11th, 2024
  IPC Code(s): F03G7/06, A61B5/00, G02B7/02, G02B27/01, G02C5/20, G02C5/22, H04R1/10 ...gory:G02B7/02]][[Category:G02B27/01]][[Category:G02C5/20]][[Category:G02C5/22]][[Category:H04R1/10]][[Category:huawei technologies co., ltd.]]
  71 KB (10,942 words) - 08:17, 12 April 2024
• INTERNATIONAL BUSINESS MACHINES CORPORATION patent applications on May 30th, 2024
  IPC Code(s): G03H1/04, G03H1/00, G03H1/08 ...lay of the 2d display.[[Category:G03H1/04]][[Category:G03H1/00]][[Category:G03H1/08]][[Category:international business machines corporation]]
  73 KB (10,346 words) - 07:51, 31 May 2024
• Patent Applications Report for 14th Jun 2024
  ...:Category:H04L9/40|H04L9/40]] (2 applications), [[:Category:F01N3/22|F01N3/22]] (2 applications) ..., [[:Category:A61K39/00|A61K39/00]] (1 applications), [[:Category:G03H1/26|G03H1/26]] (1 applications), [[:Category:H01M4/04|H01M4/04]] (1 applications), [[
  60 KB (7,670 words) - 05:19, 14 June 2024
• Samsung Electronics Co., Ltd. patent applications on June 13th, 2024
  IPC Code(s): B24B37/24, B24B37/22 ...group capable of hydrogen bonding.[[Category:B24B37/24]][[Category:B24B37/22]][[Category:CPC_B24B37/24]][[Category:samsung electronics co., ltd.]]
  252 KB (39,035 words) - 08:56, 13 June 2024
• SAMSUNG ELECTRONICS CO., LTD. patent applications on June 13th, 2024
  IPC Code(s): B24B37/24, B24B37/22 ...group capable of hydrogen bonding.[[Category:B24B37/24]][[Category:B24B37/22]][[Category:CPC_B24B37/24]][[Category:samsung electronics co., ltd.]]
  252 KB (39,035 words) - 09:05, 13 June 2024
• International Business Machines Corporation patent applications on February 29th, 2024
  ...C309/06, C07C309/19, C07C309/30, C07C309/39, C07C311/48, C07D285/16, C07F7/22, C07F9/92, C07F9/94, G03F7/004 ...C07C309/39]][[Category:C07C311/48]][[Category:C07D285/16]][[Category:C07F7/22]][[Category:C07F9/92]][[Category:C07F9/94]][[Category:G03F7/004]][[Category
  105 KB (14,980 words) - 04:59, 4 March 2024
• Samsung Electronics Co., Ltd. patent applications on February 29th, 2024
  IPC Code(s): F24F1/42, F24F11/70, F24F13/22 ...e information.[[Category:F24F1/42]][[Category:F24F11/70]][[Category:F24F13/22]][[Category:samsung electronics co., ltd.]]
  341 KB (52,649 words) - 04:58, 4 March 2024
• SAMSUNG ELECTRONICS CO., LTD. patent applications on January 25th, 2024
  IPC Code(s): G03H1/22, G06T7/55 ...litude data, and generates a cgh by using the object data.[[Category:G03H1/22]][[Category:G06T7/55]][[Category:samsung electronics co., ltd.]]
  231 KB (35,617 words) - 10:12, 30 January 2024
• Blockchain patent applications on April 18th, 2024
  .../00, A43B23/02, A43B23/04, A43C1/00, A43C1/06, A43C3/00, A43C11/00, A43C11/22 ...ory:A43C1/06]][[Category:A43C3/00]][[Category:A43C11/00]][[Category:A43C11/22]][[Category:NIKE, Inc.]]
  313 KB (44,711 words) - 16:36, 20 April 2024
• Blockchain patent applications on May 16th, 2024
  IPC Code(s): A01K67/0276, C12N9/12, C12N9/14, C12N9/22, C12N15/85, C12N15/87, C12N15/90 ...ry:A01K67/0276]][[Category:C12N9/12]][[Category:C12N9/14]][[Category:C12N9/22]][[Category:C12N15/85]][[Category:C12N15/87]][[Category:C12N15/90]][[Catego
  299 KB (42,451 words) - 02:46, 23 May 2024
• Blockchain patent applications on April 11th, 2024
  IPC Code(s): B01D69/14, B01D15/10, B01D53/04, B01D53/22, B01D63/04, B01D69/02, B01D69/08, B01D71/02 ...y:B01D69/14]][[Category:B01D15/10]][[Category:B01D53/04]][[Category:B01D53/22]][[Category:B01D63/04]][[Category:B01D69/02]][[Category:B01D69/08]][[Catego
  292 KB (41,747 words) - 07:04, 12 April 2024
• Blockchain patent applications on January 25th, 2024
  IPC Code(s): A47C9/00, F16B2/22, A47C1/14, A47C15/00 [[Category:A47C9/00]][[Category:F16B2/22]][[Category:A47C1/14]][[Category:A47C15/00]][[Category:Ledge Lounger, Inc.]
  352 KB (50,259 words) - 10:01, 30 January 2024

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