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  • IPC Code(s): H01L23/427, H01L25/16, H01L23/00 ...idic channel layer.[[Category:H01L23/427]][[Category:H01L25/16]][[Category:H01L23/00]][[Category:nokia technologies oy]]
    49 KB (7,284 words) - 04:36, 20 February 2024
  • ...[:Category:H02J50/12|H02J50/12]] (10 applications), [[:Category:H01L23/528|H01L23/528]] (10 applications), [[:Category:H04W72/0446|H04W72/0446]] (8 applicati [[:Category:H01L23/00|H01L23/00]]: 55
    38 KB (4,609 words) - 16:39, 1 January 2024
  • ...[[:Category:H04W76/14|H04W76/14]] (8 applications), [[:Category:H01L23/00|H01L23/00]] (8 applications), [[:Category:G06F3/06|G06F3/06]] (8 applications) [[:Category:H01L23/00|H01L23/00]]: 74
    37 KB (4,510 words) - 08:58, 4 January 2024
  • ...ectric Corporation has filed patents in the areas of [[:Category:H01L23/66|H01L23/66]] (2 applications), [[:Category:H02P27/06|H02P27/06]] (2 applications), ...l Corporation has filed patents in the areas of [[:Category:G06T1/60|G06T1/60]] (6 applications), [[:Category:G06F9/30|G06F9/30]] (5 applications), [[:Ca
    39 KB (4,793 words) - 04:41, 2 January 2024
  • IPC Code(s): G06T1/60 ...of the input tile and padded data for the receptive field.[[Category:G06T1/60]][[Category:advanced micro devices, inc.]]
    61 KB (9,394 words) - 08:32, 11 April 2024
  • IPC Code(s): G06F8/71, G06F8/10, G06F8/60 ...ion environment.[[Category:G06F8/71]][[Category:G06F8/10]][[Category:G06F8/60]][[Category:international business machines corporation]]
    73 KB (10,346 words) - 07:51, 31 May 2024
  • ...ut 75 �m to about 100 �m, and the second thickness is about 30 �m to about 60 �m.[[Category:G06F3/046]][[Category:H10K59/126]][[Category:H10K59/40]][[C IPC Code(s): H01L25/16, H01L21/67, H01L21/683, H01L23/00
    106 KB (16,873 words) - 04:58, 4 March 2024
  • ..., [[:Category:H04M1/02|H04M1/02]] (10 applications), [[:Category:H01L23/00|H01L23/00]] (10 applications) ...:Category:G06N3/08|G06N3/08]] (5 applications), [[:Category:G06T1/60|G06T1/60]] (4 applications), [[:Category:G06F9/455|G06F9/455]] (4 applications), [[:
    39 KB (4,888 words) - 04:21, 2 January 2024
  • IPC Code(s): G06T5/50, G06T7/194, G06V10/56, G06V10/60, H04N5/272 ...ry:G06T5/50]][[Category:G06T7/194]][[Category:G06V10/56]][[Category:G06V10/60]][[Category:H04N5/272]][[Category:CPC_G06T5/50]][[Category:google llc]]
    61 KB (9,683 words) - 02:27, 28 June 2024
  • [[:Category:Intel Corporation|Intel Corporation]]: 60 patent applications[[Category:Intel Corporation]] ...G06F9/48]] (5), [[:Category:G06N5/04|G06N5/04]] (4), [[:Category:H01L23/00|H01L23/00]] (4), [[:Category:H04W72/232|H04W72/232]] (4)
    73 KB (11,058 words) - 03:59, 26 April 2024
  • ...[[:Category:H10B80/00|H10B80/00]] (21 applications), [[:Category:H01L23/00|H01L23/00]] (21 applications), [[:Category:H01L25/065|H01L25/065]] (16 application [[:Category:H01L23/00|H01L23/00]]: 85
    46 KB (5,662 words) - 06:55, 21 February 2024
  • IPC Code(s): H01L23/13, H01L25/16, H10K59/80 ...with an opening defined therein to overlap the bending portion.[[Category:H01L23/13]][[Category:H01L25/16]][[Category:H10K59/80]][[Category:samsung display
    118 KB (18,673 words) - 04:29, 11 April 2024
  • IPC Code(s): A61B5/00, A61B5/024, A61B5/08, A61B5/11, G16H10/60 ...ory:A61B5/024]][[Category:A61B5/08]][[Category:A61B5/11]][[Category:G16H10/60]][[Category:apple inc.]]
    51 KB (8,427 words) - 02:42, 23 May 2024
  • ...8]] (6), [[:Category:H01L23/498|H01L23/498]] (6), [[:Category:H01L23/49822|H01L23/49822]] (5) IPC Code(s): G06F30/392, H01L23/498
    65 KB (9,904 words) - 04:59, 4 March 2024
  • IPC Code(s): G06F21/60 ...f mpc devices are transmitted to the content distributor.[[Category:G06F21/60]][[Category:google llc]]
    48 KB (7,445 words) - 08:57, 11 April 2024
  • IPC Code(s): H01L23/367, H01L23/373, H01L23/40, H01L23/495 ...tegory:H01L23/367]][[Category:H01L23/373]][[Category:H01L23/40]][[Category:H01L23/495]][[Category:hyundai motor company seoul]]
    51 KB (8,023 words) - 05:00, 4 March 2024
  • ...] (11), [[:Category:H01L29/0673|H01L29/0673]] (10), [[:Category:H01L23/528|H01L23/528]] (9), [[:Category:H01L29/66|H01L29/66]] (9) IPC Code(s): G06F16/2458, G06F16/248, G06F16/901, G16H10/60
    89 KB (12,726 words) - 08:06, 11 April 2024
  • ...Corporation has applied for patents in the areas of [[:Category:H01L23/528|H01L23/528]] (7), [[:Category:H01L29/06|H01L29/06]] (5), [[:Category:H01L29/423|H0 IPC Code(s): B29C64/188, B22F10/60, B22F10/73, B22F10/85, B23K26/16, B23K26/361, B29C64/357, B29C64/393, B33Y1
    69 KB (9,892 words) - 02:23, 28 June 2024
  • IPC Code(s): H01L23/00, H01L23/373, H02M7/00 ...o the metal plates of the first substrate.[[Category:H01L23/00]][[Category:H01L23/373]][[Category:H02M7/00]][[Category:lg electronics inc.]]
    50 KB (7,872 words) - 10:14, 30 January 2024
  • IPC Code(s): B60L8/00, B60L53/60 ...or greater than the first threshold.[[Category:B60L8/00]][[Category:B60L53/60]][[Category:kabushiki kaisha toshiba]]
    110 KB (16,569 words) - 07:41, 22 March 2024

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