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  • NEC Corporation patent applications on April 25th, 2024
    IPC Code(s): G06V10/75, G06V10/46 ...oint pairs and derived point pairs.[[Category:G06V10/75]][[Category:G06V10/46]][[Category:nec corporation]]
    39 KB (5,885 words) - 04:57, 26 April 2024
  • SAMSUNG ELECTRO-MECHANICS CO., LTD. patent applications on June 27th, 2024
    IPC Code(s): H01L23/00, H01L21/48, H01L23/498 ...the conductive pad.[[Category:H01L23/00]][[Category:H01L21/48]][[Category:H01L23/498]][[Category:CPC_H01L24/26]][[Category:samsung electro-mechanics co., lt
    47 KB (7,324 words) - 02:48, 28 June 2024
  • LG Electronics Inc. patent applications on January 25th, 2024
    IPC Code(s): F04D25/08, F04D25/06, F04D25/10, F04D29/46, F04F5/16 ...y:F04D25/08]][[Category:F04D25/06]][[Category:F04D25/10]][[Category:F04D29/46]][[Category:F04F5/16]][[Category:lg electronics inc.]]
    50 KB (7,872 words) - 10:14, 30 January 2024
  • Mitsubishi Electric Corporation patent applications on April 25th, 2024
    IPC Code(s): B66B5/00, B66B1/34, B66B1/46, G06F21/31 ...anagement table.[[Category:B66B5/00]][[Category:B66B1/34]][[Category:B66B1/46]][[Category:G06F21/31]][[Category:mitsubishi electric corporation]]
    46 KB (6,672 words) - 05:01, 26 April 2024
  • Patent Applications Report for 26th Apr 2024
    ...e areas of [[:Category:H01L23/544|H01L23/544]] (1), [[:Category:H01L23/367|H01L23/367]] (1) [[:Category:CPC_H01L23/544|H01L23/544]] (1)
    61 KB (7,727 words) - 00:23, 11 June 2024
  • Patent Applications Report for 23rd Aug 2024
    ...Category:H01L21/768|H01L21/768]] (14 applications), [[:Category:H01L23/522|H01L23/522]] (11 applications), [[:Category:H01L27/092|H01L27/092]] (11 applicatio ...[:Category:H01L23/498|H01L23/498]] (5 applications), [[:Category:H01L23/00|H01L23/00]] (5 applications)
    86 KB (10,804 words) - 09:41, 22 August 2024
  • Rohm Co., Ltd. Patent Application Trends in 2024
    * [[:Category:CPC_H01L23/49575|H01L23/49575]] (Lead-frames {or other flat leads () * [[:Category:CPC_H01L23/49562|H01L23/49562]] (Lead-frames {or other flat leads ()
    35 KB (4,778 words) - 16:51, 22 July 2024
  • Intel Corporation patent applications on February 29th, 2024
    ...8]] (6), [[:Category:H01L23/498|H01L23/498]] (6), [[:Category:H01L23/49822|H01L23/49822]] (5) IPC Code(s): G06F30/392, H01L23/498
    65 KB (9,904 words) - 04:59, 4 March 2024
  • Intel Corporation patent applications on March 14th, 2024
    IPC Code(s): G06F9/38, G06F9/46, G06F9/48, G06F9/50, G06F9/52, G06F9/54, G06F12/0842, G06F12/0866, G06F12/0 ...sors based on the barrier usage data.[[Category:G06F9/38]][[Category:G06F9/46]][[Category:G06F9/48]][[Category:G06F9/50]][[Category:G06F9/52]][[Category:
    75 KB (11,533 words) - 03:04, 19 March 2024
  • Intel Corporation patent applications on January 25th, 2024
    .../538]] (7), [[:Category:G06N3/084|G06N3/084]] (6), [[:Category:H01L23/5386|H01L23/5386]] (5), [[:Category:H01L24/16|H01L24/16]] (5) ...: G06F1/26, G06F1/3287, G06F13/42, G06F1/32, G06F1/3203, G06F1/3296, G06F9/46, G06F1/3234, G06F30/00
    82 KB (12,470 words) - 10:13, 30 January 2024
  • Patent Applications Report for 20th Sep 2024
    ...23/367]] (1), [[:Category:H01L21/48|H01L21/48]] (1), [[:Category:H01L23/40|H01L23/40]] (1), [[:Category:H05K7/20|H05K7/20]] (1), [[:Category:H05K1/02|H05K1/0 [[:Category:CPC_H01L23/3675|H01L23/3675]] (1), [[:Category:CPC_H05K7/20454|H05K7/20454]] (1)
    86 KB (10,634 words) - 09:37, 19 September 2024
  • Realtek Semiconductor Corp. Patent Application Trends in 2024
    * [[:Category:CPC_H01L23/49816|H01L23/49816]] (Leads, {i.e. metallisations or lead-frames} on insulating substrat [[Category:CPC_H04N19/46]]
    13 KB (1,661 words) - 03:22, 30 July 2024
  • Patent Applications Report for 9th Aug 2024
    ...23/495]] (1), [[:Category:H01L25/00|H01L25/00]] (1), [[:Category:H01L23/00|H01L23/00]] (1), [[:Category:H01L27/092|H01L27/092]] (1) .../06]] (8), [[:Category:H01L25/065|H01L25/065]] (8), [[:Category:H01L23/498|H01L23/498]] (7), [[:Category:H01L29/775|H01L29/775]] (7)
    86 KB (10,787 words) - 05:50, 13 August 2024
  • Mitsubishi Electric Corporation patent applications on July 11th, 2024
    ...3/00]] (4), [[:Category:H02M7/5387|H02M7/5387]] (3), [[:Category:H01L23/31|H01L23/31]] (3), [[:Category:H02M1/00|H02M1/00]] (3), [[:Category:H01L29/78|H01L29 IPC Code(s): B66B5/00, B66B1/34, B66B1/46, G06F21/31
    68 KB (10,058 words) - 09:31, 11 July 2024
  • Texas Instruments Incorporated patent applications on September 26th, 2024
    IPC Code(s): G01R15/20, H01L23/495, H10B61/00, H10N52/00, H10N52/80, H10N59/00 ...aps at least partially with the conductor.[[Category:G01R15/20]][[Category:H01L23/495]][[Category:H10B61/00]][[Category:H10N52/00]][[Category:H10N52/80]][[Ca
    40 KB (5,949 words) - 08:46, 27 September 2024
  • Patent Applications Report for 16th Jun 2023
    ...[[:Category:H04W76/14|H04W76/14]] (8 applications), [[:Category:H01L23/00|H01L23/00]] (8 applications), [[:Category:G06F3/06|G06F3/06]] (8 applications) [[:Category:H01L23/00|H01L23/00]]: 74
    37 KB (4,510 words) - 08:58, 4 January 2024
  • Patent Applications Report for 28th Jun 2024
    ...0]] (10), [[:Category:H01L23/498|H01L23/498]] (10), [[:Category:H01L23/538|H01L23/538]] (9), [[:Category:H01L25/065|H01L25/065]] (8), [[:Category:G06F9/30|G0 [[:Category:CPC_H01L23/5389|H01L23/5389]] (3), [[:Category:CPC_G06F9/30145|G06F9/30145]] (2), [[:Category:CPC_
    60 KB (7,598 words) - 05:42, 2 July 2024
  • Patent Applications Report for 26th Jul 2024
    ...] (2), [[:Category:G06F9/455|G06F9/455]] (1), [[:Category:H04L12/46|H04L12/46]] (1), [[:Category:H04L41/082|H04L41/082]] (1), [[:Category:H04L45/74|H04L4 ...), [[:Category:CPC_A63F13/355|A63F13/355]] (1), [[:Category:CPC_H01L23/562|H01L23/562]] (1), [[:Category:CPC_H04W72/1268|H04W72/1268]] (1), [[:Category:CPC_H
    84 KB (10,597 words) - 08:29, 25 July 2024
  • Lam Research Corporation Patent Application Trends in 2024
    * [[:Category:CPC_H01L23/53295|H01L23/53295]] (No explanation available) [[Category:CPC_C23C16/46]]
    16 KB (2,093 words) - 08:19, 16 July 2024
  • Micron Technology, Inc. patent applications on May 30th, 2024
    IPC Code(s): G11C29/46, G11C29/12, G11C29/42 [[Category:G11C29/46]][[Category:G11C29/12]][[Category:G11C29/42]][[Category:micron technology,
    57 KB (8,986 words) - 08:03, 31 May 2024

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