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Create the page "H01L23/46" on this wiki! See also the search results found.

  • Patent Applications Report for 12th Jul 2024
    ...23/373]] (1), [[:Category:H01L21/48|H01L21/48]] (1), [[:Category:H01L23/00|H01L23/00]] (1) ...[[:Category:CPC_H01L23/3735|H01L23/3735]] (1), [[:Category:CPC_H01L23/544|H01L23/544]] (1)
    61 KB (7,778 words) - 09:36, 11 July 2024
  • Patent Applications Report for 5th Apr 2024
    ...Category:H01L27/088|H01L27/088]] (19 applications), [[:Category:H01L23/498|H01L23/498]] (18 applications), [[:Category:H01L21/48|H01L21/48]] (15 applications ...[[:Category:H04W72/23|H04W72/23]] (9 applications), [[:Category:H01L23/00|H01L23/00]] (8 applications), [[:Category:H04L5/00|H04L5/00]] (7 applications), [[
    48 KB (5,854 words) - 07:18, 12 April 2024
  • Patent Applications Report for 28th Apr 2023
    ...:Category:H01L51/00|H01L51/00]] (9 applications), [[:Category:H01L23/49838|H01L23/49838]] (9 applications), [[:Category:H01L24/16|H01L24/16]] (9 applications ...Category:A01H5/10|A01H5/10]] (78 applications), [[:Category:A01H6/46|A01H6/46]] (39 applications), [[:Category:A01H6/4684|A01H6/4684]] (39 applications),
    35 KB (4,354 words) - 01:42, 3 January 2024
  • Micron Technology, Inc. patent applications on February 8th, 2024
    ...(12), [[:Category:H01L27/11582|H01L27/11582]] (8), [[:Category:H01L23/528|H01L23/528]] (7), [[:Category:G06F3/0679|G06F3/0679]] (7), [[:Category:G06F3/0659| IPC Code(s): G11C29/46, G11C29/12, G11C7/10
    54 KB (8,372 words) - 04:09, 9 February 2024
  • Tokyo Electron Limited Patent Application Trends in 2024
    * [[:Category:CPC_H05H1/46|H05H1/46]] (using applied electromagnetic fields, e.g. high frequency or microwave e * [[:Category:CPC_H01L23/5226|H01L23/5226]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS)
    30 KB (4,070 words) - 09:05, 19 July 2024
  • HUAWEI TECHNOLOGIES CO., LTD. patent applications on June 13th, 2024
    IPC Code(s): H01L23/42, H01L21/48, H01L23/31, H01L23/538 CPC Code(s): H01L23/42
    62 KB (9,608 words) - 04:56, 14 June 2024
  • Patent Applications Report for 8th Mar 2024
    ...[[:Category:H10B80/00|H10B80/00]] (23 applications), [[:Category:H01L23/00|H01L23/00]] (19 applications), [[:Category:H01L25/065|H01L25/065]] (15 application ...[[:Category:H01L29/66|H01L29/66]] (12 applications), [[:Category:H01L23/00|H01L23/00]] (10 applications), [[:Category:H01L29/775|H01L29/775]] (10 application
    46 KB (5,670 words) - 04:12, 19 March 2024
  • Patent Applications Report for 27th Jan 2023
    ..., [[:Category:H04L5/00|H04L5/00]] (11 applications), [[:Category:H01L23/00|H01L23/00]] (11 applications) ...[[:Category:H01L29/66|H01L29/66]] (16 applications), [[:Category:H01L23/00|H01L23/00]] (12 applications), [[:Category:H01L29/06|H01L29/06]] (12 applications)
    37 KB (4,657 words) - 02:13, 2 January 2024
  • Cisco Technology, Inc. patent applications on September 12th, 2024
    IPC Code(s): H01L23/367, G02B6/38, H01L23/50 CPC Code(s): H01L23/367
    27 KB (4,201 words) - 03:50, 19 September 2024
  • Patent Applications Report for 12th Apr 2024
    ...[[:Category:H04W24/10|H04W24/10]] (8 applications), [[:Category:H01L23/00|H01L23/00]] (8 applications) ...td. has filed patents in the areas of [[:Category:H10K59/131|H10K59/131]] (46 applications), [[:Category:H10K59/122|H10K59/122]] (35 applications), [[:Ca
    48 KB (5,904 words) - 09:33, 12 April 2024
  • Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on August 22nd, 2024
    ...6]] (14), [[:Category:H01L21/768|H01L21/768]] (14), [[:Category:H01L23/522|H01L23/522]] (11), [[:Category:H01L27/092|H01L27/092]] (11), [[:Category:H01L29/06 ...), [[:Category:CPC_H10B10/125|H10B10/125]] (2), [[:Category:CPC_H01L23/562|H01L23/562]] (2)
    105 KB (15,373 words) - 07:11, 22 August 2024
  • Patent Applications Report for 19th May 2023
    ...ategory:H01L23/522|H01L23/522]] (13 applications), [[:Category:H01L23/5226|H01L23/5226]] (13 applications) ...Category:A01H5/10|A01H5/10]] (62 applications), [[:Category:A01H6/46|A01H6/46]] (31 applications), [[:Category:A01H6/4678|A01H6/4678]] (31 applications),
    37 KB (4,509 words) - 00:28, 4 January 2024
  • Patent Applications Report for 12th May 2023
    [[:Category:Apple Inc.|Apple Inc.]]: 46 patent applications[[Category:Apple Inc.]] ...[[:Category:G11C16/08|G11C16/08]] (16 applications), [[:Category:H01L23/00|H01L23/00]] (15 applications), [[:Category:G06F1/16|G06F1/16]] (10 applications)
    36 KB (4,424 words) - 02:20, 3 January 2024
  • NXP B.V. Patent Application Trends in 2024
    * [[:Category:CPC_H01L23/49838|H01L23/49838]] (Leads, {i.e. metallisations or lead-frames} on insulating substrat * [[:Category:CPC_H01L23/3157|H01L23/3157]] ({Partial encapsulation or coating (mask layer used as insulation l
    22 KB (3,082 words) - 15:41, 26 July 2024
  • Intel Corporation patent applications on September 26th, 2024
    ...9/423]] (5), [[:Category:H01L29/66|H01L29/66]] (4), [[:Category:H01L23/498|H01L23/498]] (4) ...2), [[:Category:CPC_G06F21/53|G06F21/53]] (2), [[:Category:CPC_H01L23/5283|H01L23/5283]] (2), [[:Category:CPC_H04W72/1273|H04W72/1273]] (1)
    76 KB (11,570 words) - 08:22, 26 September 2024
  • Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on August 8th, 2024
    ...9/66]] (19), [[:Category:H01L29/06|H01L29/06]] (17), [[:Category:H01L23/00|H01L23/00]] (12), [[:Category:H01L21/8234|H01L21/8234]] (12), [[:Category:H01L21/0 ...2), [[:Category:CPC_H01L25/50|H01L25/50]] (2), [[:Category:CPC_H01L23/5226|H01L23/5226]] (2)
    109 KB (15,779 words) - 08:18, 8 August 2024
  • NEC Corporation patent applications on April 25th, 2024
    IPC Code(s): G06V10/75, G06V10/46 ...oint pairs and derived point pairs.[[Category:G06V10/75]][[Category:G06V10/46]][[Category:nec corporation]]
    39 KB (5,885 words) - 04:57, 26 April 2024
  • SAMSUNG ELECTRO-MECHANICS CO., LTD. patent applications on June 27th, 2024
    IPC Code(s): H01L23/00, H01L21/48, H01L23/498 ...the conductive pad.[[Category:H01L23/00]][[Category:H01L21/48]][[Category:H01L23/498]][[Category:CPC_H01L24/26]][[Category:samsung electro-mechanics co., lt
    47 KB (7,324 words) - 02:48, 28 June 2024
  • LG Electronics Inc. patent applications on January 25th, 2024
    IPC Code(s): F04D25/08, F04D25/06, F04D25/10, F04D29/46, F04F5/16 ...y:F04D25/08]][[Category:F04D25/06]][[Category:F04D25/10]][[Category:F04D29/46]][[Category:F04F5/16]][[Category:lg electronics inc.]]
    50 KB (7,872 words) - 10:14, 30 January 2024
  • Mitsubishi Electric Corporation patent applications on April 25th, 2024
    IPC Code(s): B66B5/00, B66B1/34, B66B1/46, G06F21/31 ...anagement table.[[Category:B66B5/00]][[Category:B66B1/34]][[Category:B66B1/46]][[Category:G06F21/31]][[Category:mitsubishi electric corporation]]
    46 KB (6,672 words) - 05:01, 26 April 2024

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