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Bibliographic details for US Patent Application 17664727. INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING ON-PACKAGE TUNABLE INDUCTOR FORMED IN REDISTRIBUTION LAYER (RDL) FOR IMPEDANCE TUNER CIRCUIT, AND RELATED METHODS simplified abstract

Citation styles for US Patent Application 17664727. INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING ON-PACKAGE TUNABLE INDUCTOR FORMED IN REDISTRIBUTION LAYER (RDL) FOR IMPEDANCE TUNER CIRCUIT, AND RELATED METHODS simplified abstract

APA style

US Patent Application 17664727. INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING ON-PACKAGE TUNABLE INDUCTOR FORMED IN REDISTRIBUTION LAYER (RDL) FOR IMPEDANCE TUNER CIRCUIT, AND RELATED METHODS simplified abstract. (2023, December 3). WikiPatents, . Retrieved 03:07, June 20, 2024 from http://wikipatents.org/index.php?title=US_Patent_Application_17664727._INTEGRATED_CIRCUIT_(IC)_PACKAGE_EMPLOYING_ON-PACKAGE_TUNABLE_INDUCTOR_FORMED_IN_REDISTRIBUTION_LAYER_(RDL)_FOR_IMPEDANCE_TUNER_CIRCUIT,_AND_RELATED_METHODS_simplified_abstract&oldid=9485.

MLA style

"US Patent Application 17664727. INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING ON-PACKAGE TUNABLE INDUCTOR FORMED IN REDISTRIBUTION LAYER (RDL) FOR IMPEDANCE TUNER CIRCUIT, AND RELATED METHODS simplified abstract." WikiPatents, . 3 Dec 2023, 15:15 UTC. 20 Jun 2024, 03:07 <http://wikipatents.org/index.php?title=US_Patent_Application_17664727._INTEGRATED_CIRCUIT_(IC)_PACKAGE_EMPLOYING_ON-PACKAGE_TUNABLE_INDUCTOR_FORMED_IN_REDISTRIBUTION_LAYER_(RDL)_FOR_IMPEDANCE_TUNER_CIRCUIT,_AND_RELATED_METHODS_simplified_abstract&oldid=9485>.

MHRA style

WikiPatents contributors, 'US Patent Application 17664727. INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING ON-PACKAGE TUNABLE INDUCTOR FORMED IN REDISTRIBUTION LAYER (RDL) FOR IMPEDANCE TUNER CIRCUIT, AND RELATED METHODS simplified abstract', WikiPatents, , 3 December 2023, 15:15 UTC, <http://wikipatents.org/index.php?title=US_Patent_Application_17664727._INTEGRATED_CIRCUIT_(IC)_PACKAGE_EMPLOYING_ON-PACKAGE_TUNABLE_INDUCTOR_FORMED_IN_REDISTRIBUTION_LAYER_(RDL)_FOR_IMPEDANCE_TUNER_CIRCUIT,_AND_RELATED_METHODS_simplified_abstract&oldid=9485> [accessed 20 June 2024]

Chicago style

WikiPatents contributors, "US Patent Application 17664727. INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING ON-PACKAGE TUNABLE INDUCTOR FORMED IN REDISTRIBUTION LAYER (RDL) FOR IMPEDANCE TUNER CIRCUIT, AND RELATED METHODS simplified abstract," WikiPatents, , http://wikipatents.org/index.php?title=US_Patent_Application_17664727._INTEGRATED_CIRCUIT_(IC)_PACKAGE_EMPLOYING_ON-PACKAGE_TUNABLE_INDUCTOR_FORMED_IN_REDISTRIBUTION_LAYER_(RDL)_FOR_IMPEDANCE_TUNER_CIRCUIT,_AND_RELATED_METHODS_simplified_abstract&oldid=9485 (accessed June 20, 2024).

CBE/CSE style

WikiPatents contributors. US Patent Application 17664727. INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING ON-PACKAGE TUNABLE INDUCTOR FORMED IN REDISTRIBUTION LAYER (RDL) FOR IMPEDANCE TUNER CIRCUIT, AND RELATED METHODS simplified abstract [Internet]. WikiPatents, ; 2023 Dec 3, 15:15 UTC [cited 2024 Jun 20]. Available from: http://wikipatents.org/index.php?title=US_Patent_Application_17664727._INTEGRATED_CIRCUIT_(IC)_PACKAGE_EMPLOYING_ON-PACKAGE_TUNABLE_INDUCTOR_FORMED_IN_REDISTRIBUTION_LAYER_(RDL)_FOR_IMPEDANCE_TUNER_CIRCUIT,_AND_RELATED_METHODS_simplified_abstract&oldid=9485.

Bluebook style

US Patent Application 17664727. INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING ON-PACKAGE TUNABLE INDUCTOR FORMED IN REDISTRIBUTION LAYER (RDL) FOR IMPEDANCE TUNER CIRCUIT, AND RELATED METHODS simplified abstract, http://wikipatents.org/index.php?title=US_Patent_Application_17664727._INTEGRATED_CIRCUIT_(IC)_PACKAGE_EMPLOYING_ON-PACKAGE_TUNABLE_INDUCTOR_FORMED_IN_REDISTRIBUTION_LAYER_(RDL)_FOR_IMPEDANCE_TUNER_CIRCUIT,_AND_RELATED_METHODS_simplified_abstract&oldid=9485 (last visited June 20, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "US Patent Application 17664727. INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING ON-PACKAGE TUNABLE INDUCTOR FORMED IN REDISTRIBUTION LAYER (RDL) FOR IMPEDANCE TUNER CIRCUIT, AND RELATED METHODS simplified abstract --- WikiPatents{,} ",
   year = "2023",
   url = "http://wikipatents.org/index.php?title=US_Patent_Application_17664727._INTEGRATED_CIRCUIT_(IC)_PACKAGE_EMPLOYING_ON-PACKAGE_TUNABLE_INDUCTOR_FORMED_IN_REDISTRIBUTION_LAYER_(RDL)_FOR_IMPEDANCE_TUNER_CIRCUIT,_AND_RELATED_METHODS_simplified_abstract&oldid=9485",
   note = "[Online; accessed 20-June-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "US Patent Application 17664727. INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING ON-PACKAGE TUNABLE INDUCTOR FORMED IN REDISTRIBUTION LAYER (RDL) FOR IMPEDANCE TUNER CIRCUIT, AND RELATED METHODS simplified abstract --- WikiPatents{,} ",
   year = "2023",
   url = "\url{http://wikipatents.org/index.php?title=US_Patent_Application_17664727._INTEGRATED_CIRCUIT_(IC)_PACKAGE_EMPLOYING_ON-PACKAGE_TUNABLE_INDUCTOR_FORMED_IN_REDISTRIBUTION_LAYER_(RDL)_FOR_IMPEDANCE_TUNER_CIRCUIT,_AND_RELATED_METHODS_simplified_abstract&oldid=9485}",
   note = "[Online; accessed 20-June-2024]"
 }


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