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Bibliographic details for 18432061. ADHESIVE AND THERMAL INTERFACE MATERIAL ON A PLURALITY OF DIES COVERED BY A LID simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)

Citation styles for 18432061. ADHESIVE AND THERMAL INTERFACE MATERIAL ON A PLURALITY OF DIES COVERED BY A LID simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)

APA style

18432061. ADHESIVE AND THERMAL INTERFACE MATERIAL ON A PLURALITY OF DIES COVERED BY A LID simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.). (2024, July 12). WikiPatents, . Retrieved 05:39, September 17, 2024 from http://wikipatents.org/index.php?title=18432061._ADHESIVE_AND_THERMAL_INTERFACE_MATERIAL_ON_A_PLURALITY_OF_DIES_COVERED_BY_A_LID_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=93922.

MLA style

"18432061. ADHESIVE AND THERMAL INTERFACE MATERIAL ON A PLURALITY OF DIES COVERED BY A LID simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)." WikiPatents, . 12 Jul 2024, 04:51 UTC. 17 Sep 2024, 05:39 <http://wikipatents.org/index.php?title=18432061._ADHESIVE_AND_THERMAL_INTERFACE_MATERIAL_ON_A_PLURALITY_OF_DIES_COVERED_BY_A_LID_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=93922>.

MHRA style

WikiPatents contributors, '18432061. ADHESIVE AND THERMAL INTERFACE MATERIAL ON A PLURALITY OF DIES COVERED BY A LID simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)', WikiPatents, , 12 July 2024, 04:51 UTC, <http://wikipatents.org/index.php?title=18432061._ADHESIVE_AND_THERMAL_INTERFACE_MATERIAL_ON_A_PLURALITY_OF_DIES_COVERED_BY_A_LID_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=93922> [accessed 17 September 2024]

Chicago style

WikiPatents contributors, "18432061. ADHESIVE AND THERMAL INTERFACE MATERIAL ON A PLURALITY OF DIES COVERED BY A LID simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)," WikiPatents, , http://wikipatents.org/index.php?title=18432061._ADHESIVE_AND_THERMAL_INTERFACE_MATERIAL_ON_A_PLURALITY_OF_DIES_COVERED_BY_A_LID_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=93922 (accessed September 17, 2024).

CBE/CSE style

WikiPatents contributors. 18432061. ADHESIVE AND THERMAL INTERFACE MATERIAL ON A PLURALITY OF DIES COVERED BY A LID simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.) [Internet]. WikiPatents, ; 2024 Jul 12, 04:51 UTC [cited 2024 Sep 17]. Available from: http://wikipatents.org/index.php?title=18432061._ADHESIVE_AND_THERMAL_INTERFACE_MATERIAL_ON_A_PLURALITY_OF_DIES_COVERED_BY_A_LID_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=93922.

Bluebook style

18432061. ADHESIVE AND THERMAL INTERFACE MATERIAL ON A PLURALITY OF DIES COVERED BY A LID simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.), http://wikipatents.org/index.php?title=18432061._ADHESIVE_AND_THERMAL_INTERFACE_MATERIAL_ON_A_PLURALITY_OF_DIES_COVERED_BY_A_LID_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=93922 (last visited September 17, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18432061. ADHESIVE AND THERMAL INTERFACE MATERIAL ON A PLURALITY OF DIES COVERED BY A LID simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=18432061._ADHESIVE_AND_THERMAL_INTERFACE_MATERIAL_ON_A_PLURALITY_OF_DIES_COVERED_BY_A_LID_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=93922",
   note = "[Online; accessed 17-September-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18432061. ADHESIVE AND THERMAL INTERFACE MATERIAL ON A PLURALITY OF DIES COVERED BY A LID simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=18432061._ADHESIVE_AND_THERMAL_INTERFACE_MATERIAL_ON_A_PLURALITY_OF_DIES_COVERED_BY_A_LID_simplified_abstract_(TAIWAN_SEMICONDUCTOR_MANUFACTURING_COMPANY,_LTD.)&oldid=93922}",
   note = "[Online; accessed 17-September-2024]"
 }


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