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Bibliographic details for 18612949. SEMICONDUCTOR DEVICE STACK-UP WITH BULK SUBSTRATE MATERIAL TO MITIGATE HOT SPOTS simplified abstract (Intel Corporation)

Citation styles for 18612949. SEMICONDUCTOR DEVICE STACK-UP WITH BULK SUBSTRATE MATERIAL TO MITIGATE HOT SPOTS simplified abstract (Intel Corporation)

APA style

18612949. SEMICONDUCTOR DEVICE STACK-UP WITH BULK SUBSTRATE MATERIAL TO MITIGATE HOT SPOTS simplified abstract (Intel Corporation). (2024, July 11). WikiPatents, . Retrieved 17:50, September 19, 2024 from http://wikipatents.org/index.php?title=18612949._SEMICONDUCTOR_DEVICE_STACK-UP_WITH_BULK_SUBSTRATE_MATERIAL_TO_MITIGATE_HOT_SPOTS_simplified_abstract_(Intel_Corporation)&oldid=93556.

MLA style

"18612949. SEMICONDUCTOR DEVICE STACK-UP WITH BULK SUBSTRATE MATERIAL TO MITIGATE HOT SPOTS simplified abstract (Intel Corporation)." WikiPatents, . 11 Jul 2024, 16:43 UTC. 19 Sep 2024, 17:50 <http://wikipatents.org/index.php?title=18612949._SEMICONDUCTOR_DEVICE_STACK-UP_WITH_BULK_SUBSTRATE_MATERIAL_TO_MITIGATE_HOT_SPOTS_simplified_abstract_(Intel_Corporation)&oldid=93556>.

MHRA style

WikiPatents contributors, '18612949. SEMICONDUCTOR DEVICE STACK-UP WITH BULK SUBSTRATE MATERIAL TO MITIGATE HOT SPOTS simplified abstract (Intel Corporation)', WikiPatents, , 11 July 2024, 16:43 UTC, <http://wikipatents.org/index.php?title=18612949._SEMICONDUCTOR_DEVICE_STACK-UP_WITH_BULK_SUBSTRATE_MATERIAL_TO_MITIGATE_HOT_SPOTS_simplified_abstract_(Intel_Corporation)&oldid=93556> [accessed 19 September 2024]

Chicago style

WikiPatents contributors, "18612949. SEMICONDUCTOR DEVICE STACK-UP WITH BULK SUBSTRATE MATERIAL TO MITIGATE HOT SPOTS simplified abstract (Intel Corporation)," WikiPatents, , http://wikipatents.org/index.php?title=18612949._SEMICONDUCTOR_DEVICE_STACK-UP_WITH_BULK_SUBSTRATE_MATERIAL_TO_MITIGATE_HOT_SPOTS_simplified_abstract_(Intel_Corporation)&oldid=93556 (accessed September 19, 2024).

CBE/CSE style

WikiPatents contributors. 18612949. SEMICONDUCTOR DEVICE STACK-UP WITH BULK SUBSTRATE MATERIAL TO MITIGATE HOT SPOTS simplified abstract (Intel Corporation) [Internet]. WikiPatents, ; 2024 Jul 11, 16:43 UTC [cited 2024 Sep 19]. Available from: http://wikipatents.org/index.php?title=18612949._SEMICONDUCTOR_DEVICE_STACK-UP_WITH_BULK_SUBSTRATE_MATERIAL_TO_MITIGATE_HOT_SPOTS_simplified_abstract_(Intel_Corporation)&oldid=93556.

Bluebook style

18612949. SEMICONDUCTOR DEVICE STACK-UP WITH BULK SUBSTRATE MATERIAL TO MITIGATE HOT SPOTS simplified abstract (Intel Corporation), http://wikipatents.org/index.php?title=18612949._SEMICONDUCTOR_DEVICE_STACK-UP_WITH_BULK_SUBSTRATE_MATERIAL_TO_MITIGATE_HOT_SPOTS_simplified_abstract_(Intel_Corporation)&oldid=93556 (last visited September 19, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18612949. SEMICONDUCTOR DEVICE STACK-UP WITH BULK SUBSTRATE MATERIAL TO MITIGATE HOT SPOTS simplified abstract (Intel Corporation) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=18612949._SEMICONDUCTOR_DEVICE_STACK-UP_WITH_BULK_SUBSTRATE_MATERIAL_TO_MITIGATE_HOT_SPOTS_simplified_abstract_(Intel_Corporation)&oldid=93556",
   note = "[Online; accessed 19-September-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18612949. SEMICONDUCTOR DEVICE STACK-UP WITH BULK SUBSTRATE MATERIAL TO MITIGATE HOT SPOTS simplified abstract (Intel Corporation) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=18612949._SEMICONDUCTOR_DEVICE_STACK-UP_WITH_BULK_SUBSTRATE_MATERIAL_TO_MITIGATE_HOT_SPOTS_simplified_abstract_(Intel_Corporation)&oldid=93556}",
   note = "[Online; accessed 19-September-2024]"
 }


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