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Bibliographic details for 18226065. SEMICONDUCTOR PACKAGE HAVING DUMMY SOLDERS AND MANUFACTURING METHOD THEREOF simplified abstract (Samsung Electronics Co., Ltd.)

Citation styles for 18226065. SEMICONDUCTOR PACKAGE HAVING DUMMY SOLDERS AND MANUFACTURING METHOD THEREOF simplified abstract (Samsung Electronics Co., Ltd.)

APA style

18226065. SEMICONDUCTOR PACKAGE HAVING DUMMY SOLDERS AND MANUFACTURING METHOD THEREOF simplified abstract (Samsung Electronics Co., Ltd.). (2024, July 11). WikiPatents, . Retrieved 20:58, September 9, 2024 from http://wikipatents.org/index.php?title=18226065._SEMICONDUCTOR_PACKAGE_HAVING_DUMMY_SOLDERS_AND_MANUFACTURING_METHOD_THEREOF_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=92943.

MLA style

"18226065. SEMICONDUCTOR PACKAGE HAVING DUMMY SOLDERS AND MANUFACTURING METHOD THEREOF simplified abstract (Samsung Electronics Co., Ltd.)." WikiPatents, . 11 Jul 2024, 15:44 UTC. 9 Sep 2024, 20:58 <http://wikipatents.org/index.php?title=18226065._SEMICONDUCTOR_PACKAGE_HAVING_DUMMY_SOLDERS_AND_MANUFACTURING_METHOD_THEREOF_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=92943>.

MHRA style

WikiPatents contributors, '18226065. SEMICONDUCTOR PACKAGE HAVING DUMMY SOLDERS AND MANUFACTURING METHOD THEREOF simplified abstract (Samsung Electronics Co., Ltd.)', WikiPatents, , 11 July 2024, 15:44 UTC, <http://wikipatents.org/index.php?title=18226065._SEMICONDUCTOR_PACKAGE_HAVING_DUMMY_SOLDERS_AND_MANUFACTURING_METHOD_THEREOF_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=92943> [accessed 9 September 2024]

Chicago style

WikiPatents contributors, "18226065. SEMICONDUCTOR PACKAGE HAVING DUMMY SOLDERS AND MANUFACTURING METHOD THEREOF simplified abstract (Samsung Electronics Co., Ltd.)," WikiPatents, , http://wikipatents.org/index.php?title=18226065._SEMICONDUCTOR_PACKAGE_HAVING_DUMMY_SOLDERS_AND_MANUFACTURING_METHOD_THEREOF_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=92943 (accessed September 9, 2024).

CBE/CSE style

WikiPatents contributors. 18226065. SEMICONDUCTOR PACKAGE HAVING DUMMY SOLDERS AND MANUFACTURING METHOD THEREOF simplified abstract (Samsung Electronics Co., Ltd.) [Internet]. WikiPatents, ; 2024 Jul 11, 15:44 UTC [cited 2024 Sep 9]. Available from: http://wikipatents.org/index.php?title=18226065._SEMICONDUCTOR_PACKAGE_HAVING_DUMMY_SOLDERS_AND_MANUFACTURING_METHOD_THEREOF_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=92943.

Bluebook style

18226065. SEMICONDUCTOR PACKAGE HAVING DUMMY SOLDERS AND MANUFACTURING METHOD THEREOF simplified abstract (Samsung Electronics Co., Ltd.), http://wikipatents.org/index.php?title=18226065._SEMICONDUCTOR_PACKAGE_HAVING_DUMMY_SOLDERS_AND_MANUFACTURING_METHOD_THEREOF_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=92943 (last visited September 9, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18226065. SEMICONDUCTOR PACKAGE HAVING DUMMY SOLDERS AND MANUFACTURING METHOD THEREOF simplified abstract (Samsung Electronics Co., Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=18226065._SEMICONDUCTOR_PACKAGE_HAVING_DUMMY_SOLDERS_AND_MANUFACTURING_METHOD_THEREOF_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=92943",
   note = "[Online; accessed 9-September-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18226065. SEMICONDUCTOR PACKAGE HAVING DUMMY SOLDERS AND MANUFACTURING METHOD THEREOF simplified abstract (Samsung Electronics Co., Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=18226065._SEMICONDUCTOR_PACKAGE_HAVING_DUMMY_SOLDERS_AND_MANUFACTURING_METHOD_THEREOF_simplified_abstract_(Samsung_Electronics_Co.,_Ltd.)&oldid=92943}",
   note = "[Online; accessed 9-September-2024]"
 }


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