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Bibliographic details for US Patent Application 18447871. Semiconductor Device Having Backside Interconnect Structure on Through Substrate Via simplified abstract

Citation styles for US Patent Application 18447871. Semiconductor Device Having Backside Interconnect Structure on Through Substrate Via simplified abstract

APA style

US Patent Application 18447871. Semiconductor Device Having Backside Interconnect Structure on Through Substrate Via simplified abstract. (2023, December 1). WikiPatents, . Retrieved 15:10, June 20, 2024 from http://wikipatents.org/index.php?title=US_Patent_Application_18447871._Semiconductor_Device_Having_Backside_Interconnect_Structure_on_Through_Substrate_Via_simplified_abstract&oldid=8954.

MLA style

"US Patent Application 18447871. Semiconductor Device Having Backside Interconnect Structure on Through Substrate Via simplified abstract." WikiPatents, . 1 Dec 2023, 10:11 UTC. 20 Jun 2024, 15:10 <http://wikipatents.org/index.php?title=US_Patent_Application_18447871._Semiconductor_Device_Having_Backside_Interconnect_Structure_on_Through_Substrate_Via_simplified_abstract&oldid=8954>.

MHRA style

WikiPatents contributors, 'US Patent Application 18447871. Semiconductor Device Having Backside Interconnect Structure on Through Substrate Via simplified abstract', WikiPatents, , 1 December 2023, 10:11 UTC, <http://wikipatents.org/index.php?title=US_Patent_Application_18447871._Semiconductor_Device_Having_Backside_Interconnect_Structure_on_Through_Substrate_Via_simplified_abstract&oldid=8954> [accessed 20 June 2024]

Chicago style

WikiPatents contributors, "US Patent Application 18447871. Semiconductor Device Having Backside Interconnect Structure on Through Substrate Via simplified abstract," WikiPatents, , http://wikipatents.org/index.php?title=US_Patent_Application_18447871._Semiconductor_Device_Having_Backside_Interconnect_Structure_on_Through_Substrate_Via_simplified_abstract&oldid=8954 (accessed June 20, 2024).

CBE/CSE style

WikiPatents contributors. US Patent Application 18447871. Semiconductor Device Having Backside Interconnect Structure on Through Substrate Via simplified abstract [Internet]. WikiPatents, ; 2023 Dec 1, 10:11 UTC [cited 2024 Jun 20]. Available from: http://wikipatents.org/index.php?title=US_Patent_Application_18447871._Semiconductor_Device_Having_Backside_Interconnect_Structure_on_Through_Substrate_Via_simplified_abstract&oldid=8954.

Bluebook style

US Patent Application 18447871. Semiconductor Device Having Backside Interconnect Structure on Through Substrate Via simplified abstract, http://wikipatents.org/index.php?title=US_Patent_Application_18447871._Semiconductor_Device_Having_Backside_Interconnect_Structure_on_Through_Substrate_Via_simplified_abstract&oldid=8954 (last visited June 20, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "US Patent Application 18447871. Semiconductor Device Having Backside Interconnect Structure on Through Substrate Via simplified abstract --- WikiPatents{,} ",
   year = "2023",
   url = "http://wikipatents.org/index.php?title=US_Patent_Application_18447871._Semiconductor_Device_Having_Backside_Interconnect_Structure_on_Through_Substrate_Via_simplified_abstract&oldid=8954",
   note = "[Online; accessed 20-June-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "US Patent Application 18447871. Semiconductor Device Having Backside Interconnect Structure on Through Substrate Via simplified abstract --- WikiPatents{,} ",
   year = "2023",
   url = "\url{http://wikipatents.org/index.php?title=US_Patent_Application_18447871._Semiconductor_Device_Having_Backside_Interconnect_Structure_on_Through_Substrate_Via_simplified_abstract&oldid=8954}",
   note = "[Online; accessed 20-June-2024]"
 }


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