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Bibliographic details for 18397505. EMBEDDED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND METHODS OF MANUFACTURING THE SAME simplified abstract (ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.)

Citation styles for 18397505. EMBEDDED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND METHODS OF MANUFACTURING THE SAME simplified abstract (ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.)

APA style

18397505. EMBEDDED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND METHODS OF MANUFACTURING THE SAME simplified abstract (ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.). (2024, July 8). WikiPatents, . Retrieved 04:15, September 12, 2024 from http://wikipatents.org/index.php?title=18397505._EMBEDDED_COOLING_ASSEMBLIES_FOR_ADVANCED_DEVICE_PACKAGING_AND_METHODS_OF_MANUFACTURING_THE_SAME_simplified_abstract_(ADEIA_SEMICONDUCTOR_BONDING_TECHNOLOGIES_INC.)&oldid=89479.

MLA style

"18397505. EMBEDDED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND METHODS OF MANUFACTURING THE SAME simplified abstract (ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.)." WikiPatents, . 8 Jul 2024, 06:48 UTC. 12 Sep 2024, 04:15 <http://wikipatents.org/index.php?title=18397505._EMBEDDED_COOLING_ASSEMBLIES_FOR_ADVANCED_DEVICE_PACKAGING_AND_METHODS_OF_MANUFACTURING_THE_SAME_simplified_abstract_(ADEIA_SEMICONDUCTOR_BONDING_TECHNOLOGIES_INC.)&oldid=89479>.

MHRA style

WikiPatents contributors, '18397505. EMBEDDED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND METHODS OF MANUFACTURING THE SAME simplified abstract (ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.)', WikiPatents, , 8 July 2024, 06:48 UTC, <http://wikipatents.org/index.php?title=18397505._EMBEDDED_COOLING_ASSEMBLIES_FOR_ADVANCED_DEVICE_PACKAGING_AND_METHODS_OF_MANUFACTURING_THE_SAME_simplified_abstract_(ADEIA_SEMICONDUCTOR_BONDING_TECHNOLOGIES_INC.)&oldid=89479> [accessed 12 September 2024]

Chicago style

WikiPatents contributors, "18397505. EMBEDDED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND METHODS OF MANUFACTURING THE SAME simplified abstract (ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.)," WikiPatents, , http://wikipatents.org/index.php?title=18397505._EMBEDDED_COOLING_ASSEMBLIES_FOR_ADVANCED_DEVICE_PACKAGING_AND_METHODS_OF_MANUFACTURING_THE_SAME_simplified_abstract_(ADEIA_SEMICONDUCTOR_BONDING_TECHNOLOGIES_INC.)&oldid=89479 (accessed September 12, 2024).

CBE/CSE style

WikiPatents contributors. 18397505. EMBEDDED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND METHODS OF MANUFACTURING THE SAME simplified abstract (ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.) [Internet]. WikiPatents, ; 2024 Jul 8, 06:48 UTC [cited 2024 Sep 12]. Available from: http://wikipatents.org/index.php?title=18397505._EMBEDDED_COOLING_ASSEMBLIES_FOR_ADVANCED_DEVICE_PACKAGING_AND_METHODS_OF_MANUFACTURING_THE_SAME_simplified_abstract_(ADEIA_SEMICONDUCTOR_BONDING_TECHNOLOGIES_INC.)&oldid=89479.

Bluebook style

18397505. EMBEDDED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND METHODS OF MANUFACTURING THE SAME simplified abstract (ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.), http://wikipatents.org/index.php?title=18397505._EMBEDDED_COOLING_ASSEMBLIES_FOR_ADVANCED_DEVICE_PACKAGING_AND_METHODS_OF_MANUFACTURING_THE_SAME_simplified_abstract_(ADEIA_SEMICONDUCTOR_BONDING_TECHNOLOGIES_INC.)&oldid=89479 (last visited September 12, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18397505. EMBEDDED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND METHODS OF MANUFACTURING THE SAME simplified abstract (ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=18397505._EMBEDDED_COOLING_ASSEMBLIES_FOR_ADVANCED_DEVICE_PACKAGING_AND_METHODS_OF_MANUFACTURING_THE_SAME_simplified_abstract_(ADEIA_SEMICONDUCTOR_BONDING_TECHNOLOGIES_INC.)&oldid=89479",
   note = "[Online; accessed 12-September-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18397505. EMBEDDED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND METHODS OF MANUFACTURING THE SAME simplified abstract (ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=18397505._EMBEDDED_COOLING_ASSEMBLIES_FOR_ADVANCED_DEVICE_PACKAGING_AND_METHODS_OF_MANUFACTURING_THE_SAME_simplified_abstract_(ADEIA_SEMICONDUCTOR_BONDING_TECHNOLOGIES_INC.)&oldid=89479}",
   note = "[Online; accessed 12-September-2024]"
 }


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