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Bibliographic details for 18604542. BONDED WAFER DEVICE STRUCTURE AND METHODS FOR MAKING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company Limited)

Citation styles for 18604542. BONDED WAFER DEVICE STRUCTURE AND METHODS FOR MAKING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company Limited)

APA style

18604542. BONDED WAFER DEVICE STRUCTURE AND METHODS FOR MAKING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company Limited). (2024, July 8). WikiPatents, . Retrieved 17:42, September 19, 2024 from http://wikipatents.org/index.php?title=18604542._BONDED_WAFER_DEVICE_STRUCTURE_AND_METHODS_FOR_MAKING_THE_SAME_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company_Limited)&oldid=89116.

MLA style

"18604542. BONDED WAFER DEVICE STRUCTURE AND METHODS FOR MAKING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company Limited)." WikiPatents, . 8 Jul 2024, 06:14 UTC. 19 Sep 2024, 17:42 <http://wikipatents.org/index.php?title=18604542._BONDED_WAFER_DEVICE_STRUCTURE_AND_METHODS_FOR_MAKING_THE_SAME_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company_Limited)&oldid=89116>.

MHRA style

WikiPatents contributors, '18604542. BONDED WAFER DEVICE STRUCTURE AND METHODS FOR MAKING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company Limited)', WikiPatents, , 8 July 2024, 06:14 UTC, <http://wikipatents.org/index.php?title=18604542._BONDED_WAFER_DEVICE_STRUCTURE_AND_METHODS_FOR_MAKING_THE_SAME_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company_Limited)&oldid=89116> [accessed 19 September 2024]

Chicago style

WikiPatents contributors, "18604542. BONDED WAFER DEVICE STRUCTURE AND METHODS FOR MAKING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company Limited)," WikiPatents, , http://wikipatents.org/index.php?title=18604542._BONDED_WAFER_DEVICE_STRUCTURE_AND_METHODS_FOR_MAKING_THE_SAME_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company_Limited)&oldid=89116 (accessed September 19, 2024).

CBE/CSE style

WikiPatents contributors. 18604542. BONDED WAFER DEVICE STRUCTURE AND METHODS FOR MAKING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company Limited) [Internet]. WikiPatents, ; 2024 Jul 8, 06:14 UTC [cited 2024 Sep 19]. Available from: http://wikipatents.org/index.php?title=18604542._BONDED_WAFER_DEVICE_STRUCTURE_AND_METHODS_FOR_MAKING_THE_SAME_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company_Limited)&oldid=89116.

Bluebook style

18604542. BONDED WAFER DEVICE STRUCTURE AND METHODS FOR MAKING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company Limited), http://wikipatents.org/index.php?title=18604542._BONDED_WAFER_DEVICE_STRUCTURE_AND_METHODS_FOR_MAKING_THE_SAME_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company_Limited)&oldid=89116 (last visited September 19, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18604542. BONDED WAFER DEVICE STRUCTURE AND METHODS FOR MAKING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company Limited) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=18604542._BONDED_WAFER_DEVICE_STRUCTURE_AND_METHODS_FOR_MAKING_THE_SAME_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company_Limited)&oldid=89116",
   note = "[Online; accessed 19-September-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18604542. BONDED WAFER DEVICE STRUCTURE AND METHODS FOR MAKING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company Limited) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=18604542._BONDED_WAFER_DEVICE_STRUCTURE_AND_METHODS_FOR_MAKING_THE_SAME_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company_Limited)&oldid=89116}",
   note = "[Online; accessed 19-September-2024]"
 }


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