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Citation styles for 18609836. GIGA INTERPOSER INTEGRATION THROUGH CHIP-ON-WAFER-ON-SUBSTRATE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

APA style

18609836. GIGA INTERPOSER INTEGRATION THROUGH CHIP-ON-WAFER-ON-SUBSTRATE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.). (2024, July 6). WikiPatents, . Retrieved 22:57, August 6, 2024 from http://wikipatents.org/index.php?title=18609836._GIGA_INTERPOSER_INTEGRATION_THROUGH_CHIP-ON-WAFER-ON-SUBSTRATE_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=86112.

MLA style

"18609836. GIGA INTERPOSER INTEGRATION THROUGH CHIP-ON-WAFER-ON-SUBSTRATE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)." WikiPatents, . 6 Jul 2024, 07:14 UTC. 6 Aug 2024, 22:57 <http://wikipatents.org/index.php?title=18609836._GIGA_INTERPOSER_INTEGRATION_THROUGH_CHIP-ON-WAFER-ON-SUBSTRATE_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=86112>.

MHRA style

WikiPatents contributors, '18609836. GIGA INTERPOSER INTEGRATION THROUGH CHIP-ON-WAFER-ON-SUBSTRATE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)', WikiPatents, , 6 July 2024, 07:14 UTC, <http://wikipatents.org/index.php?title=18609836._GIGA_INTERPOSER_INTEGRATION_THROUGH_CHIP-ON-WAFER-ON-SUBSTRATE_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=86112> [accessed 6 August 2024]

Chicago style

WikiPatents contributors, "18609836. GIGA INTERPOSER INTEGRATION THROUGH CHIP-ON-WAFER-ON-SUBSTRATE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)," WikiPatents, , http://wikipatents.org/index.php?title=18609836._GIGA_INTERPOSER_INTEGRATION_THROUGH_CHIP-ON-WAFER-ON-SUBSTRATE_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=86112 (accessed August 6, 2024).

CBE/CSE style

WikiPatents contributors. 18609836. GIGA INTERPOSER INTEGRATION THROUGH CHIP-ON-WAFER-ON-SUBSTRATE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) [Internet]. WikiPatents, ; 2024 Jul 6, 07:14 UTC [cited 2024 Aug 6]. Available from: http://wikipatents.org/index.php?title=18609836._GIGA_INTERPOSER_INTEGRATION_THROUGH_CHIP-ON-WAFER-ON-SUBSTRATE_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=86112.

Bluebook style

18609836. GIGA INTERPOSER INTEGRATION THROUGH CHIP-ON-WAFER-ON-SUBSTRATE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.), http://wikipatents.org/index.php?title=18609836._GIGA_INTERPOSER_INTEGRATION_THROUGH_CHIP-ON-WAFER-ON-SUBSTRATE_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=86112 (last visited August 6, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18609836. GIGA INTERPOSER INTEGRATION THROUGH CHIP-ON-WAFER-ON-SUBSTRATE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=18609836._GIGA_INTERPOSER_INTEGRATION_THROUGH_CHIP-ON-WAFER-ON-SUBSTRATE_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=86112",
   note = "[Online; accessed 6-August-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18609836. GIGA INTERPOSER INTEGRATION THROUGH CHIP-ON-WAFER-ON-SUBSTRATE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=18609836._GIGA_INTERPOSER_INTEGRATION_THROUGH_CHIP-ON-WAFER-ON-SUBSTRATE_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=86112}",
   note = "[Online; accessed 6-August-2024]"
 }