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Bibliographic details for 18604691. PACKAGE COMPONENT WITH STEPPED PASSIVATION LAYER simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

Citation styles for 18604691. PACKAGE COMPONENT WITH STEPPED PASSIVATION LAYER simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

APA style

18604691. PACKAGE COMPONENT WITH STEPPED PASSIVATION LAYER simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.). (2024, July 6). WikiPatents, . Retrieved 11:43, August 6, 2024 from http://wikipatents.org/index.php?title=18604691._PACKAGE_COMPONENT_WITH_STEPPED_PASSIVATION_LAYER_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=86108.

MLA style

"18604691. PACKAGE COMPONENT WITH STEPPED PASSIVATION LAYER simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)." WikiPatents, . 6 Jul 2024, 07:13 UTC. 6 Aug 2024, 11:43 <http://wikipatents.org/index.php?title=18604691._PACKAGE_COMPONENT_WITH_STEPPED_PASSIVATION_LAYER_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=86108>.

MHRA style

WikiPatents contributors, '18604691. PACKAGE COMPONENT WITH STEPPED PASSIVATION LAYER simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)', WikiPatents, , 6 July 2024, 07:13 UTC, <http://wikipatents.org/index.php?title=18604691._PACKAGE_COMPONENT_WITH_STEPPED_PASSIVATION_LAYER_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=86108> [accessed 6 August 2024]

Chicago style

WikiPatents contributors, "18604691. PACKAGE COMPONENT WITH STEPPED PASSIVATION LAYER simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)," WikiPatents, , http://wikipatents.org/index.php?title=18604691._PACKAGE_COMPONENT_WITH_STEPPED_PASSIVATION_LAYER_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=86108 (accessed August 6, 2024).

CBE/CSE style

WikiPatents contributors. 18604691. PACKAGE COMPONENT WITH STEPPED PASSIVATION LAYER simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) [Internet]. WikiPatents, ; 2024 Jul 6, 07:13 UTC [cited 2024 Aug 6]. Available from: http://wikipatents.org/index.php?title=18604691._PACKAGE_COMPONENT_WITH_STEPPED_PASSIVATION_LAYER_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=86108.

Bluebook style

18604691. PACKAGE COMPONENT WITH STEPPED PASSIVATION LAYER simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.), http://wikipatents.org/index.php?title=18604691._PACKAGE_COMPONENT_WITH_STEPPED_PASSIVATION_LAYER_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=86108 (last visited August 6, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18604691. PACKAGE COMPONENT WITH STEPPED PASSIVATION LAYER simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=18604691._PACKAGE_COMPONENT_WITH_STEPPED_PASSIVATION_LAYER_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=86108",
   note = "[Online; accessed 6-August-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18604691. PACKAGE COMPONENT WITH STEPPED PASSIVATION LAYER simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=18604691._PACKAGE_COMPONENT_WITH_STEPPED_PASSIVATION_LAYER_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=86108}",
   note = "[Online; accessed 6-August-2024]"
 }


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