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Bibliographic details for 18593381. SEMICONDUCTOR PACKAGE INCLUDING HIGH THERMAL CONDUCTIVITY LAYER simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

Citation styles for 18593381. SEMICONDUCTOR PACKAGE INCLUDING HIGH THERMAL CONDUCTIVITY LAYER simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

APA style

18593381. SEMICONDUCTOR PACKAGE INCLUDING HIGH THERMAL CONDUCTIVITY LAYER simplified abstract (SAMSUNG ELECTRONICS CO., LTD.). (2024, July 5). WikiPatents, . Retrieved 08:51, July 25, 2024 from http://wikipatents.org/index.php?title=18593381._SEMICONDUCTOR_PACKAGE_INCLUDING_HIGH_THERMAL_CONDUCTIVITY_LAYER_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=85405.

MLA style

"18593381. SEMICONDUCTOR PACKAGE INCLUDING HIGH THERMAL CONDUCTIVITY LAYER simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)." WikiPatents, . 5 Jul 2024, 06:37 UTC. 25 Jul 2024, 08:51 <http://wikipatents.org/index.php?title=18593381._SEMICONDUCTOR_PACKAGE_INCLUDING_HIGH_THERMAL_CONDUCTIVITY_LAYER_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=85405>.

MHRA style

WikiPatents contributors, '18593381. SEMICONDUCTOR PACKAGE INCLUDING HIGH THERMAL CONDUCTIVITY LAYER simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)', WikiPatents, , 5 July 2024, 06:37 UTC, <http://wikipatents.org/index.php?title=18593381._SEMICONDUCTOR_PACKAGE_INCLUDING_HIGH_THERMAL_CONDUCTIVITY_LAYER_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=85405> [accessed 25 July 2024]

Chicago style

WikiPatents contributors, "18593381. SEMICONDUCTOR PACKAGE INCLUDING HIGH THERMAL CONDUCTIVITY LAYER simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)," WikiPatents, , http://wikipatents.org/index.php?title=18593381._SEMICONDUCTOR_PACKAGE_INCLUDING_HIGH_THERMAL_CONDUCTIVITY_LAYER_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=85405 (accessed July 25, 2024).

CBE/CSE style

WikiPatents contributors. 18593381. SEMICONDUCTOR PACKAGE INCLUDING HIGH THERMAL CONDUCTIVITY LAYER simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) [Internet]. WikiPatents, ; 2024 Jul 5, 06:37 UTC [cited 2024 Jul 25]. Available from: http://wikipatents.org/index.php?title=18593381._SEMICONDUCTOR_PACKAGE_INCLUDING_HIGH_THERMAL_CONDUCTIVITY_LAYER_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=85405.

Bluebook style

18593381. SEMICONDUCTOR PACKAGE INCLUDING HIGH THERMAL CONDUCTIVITY LAYER simplified abstract (SAMSUNG ELECTRONICS CO., LTD.), http://wikipatents.org/index.php?title=18593381._SEMICONDUCTOR_PACKAGE_INCLUDING_HIGH_THERMAL_CONDUCTIVITY_LAYER_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=85405 (last visited July 25, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18593381. SEMICONDUCTOR PACKAGE INCLUDING HIGH THERMAL CONDUCTIVITY LAYER simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=18593381._SEMICONDUCTOR_PACKAGE_INCLUDING_HIGH_THERMAL_CONDUCTIVITY_LAYER_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=85405",
   note = "[Online; accessed 25-July-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18593381. SEMICONDUCTOR PACKAGE INCLUDING HIGH THERMAL CONDUCTIVITY LAYER simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=18593381._SEMICONDUCTOR_PACKAGE_INCLUDING_HIGH_THERMAL_CONDUCTIVITY_LAYER_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=85405}",
   note = "[Online; accessed 25-July-2024]"
 }


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