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Bibliographic details for Huawei technologies co., ltd. (20240222367). Three-Dimensional Memory, Chip Package Structure, and Electronic Device simplified abstract

Citation styles for Huawei technologies co., ltd. (20240222367). Three-Dimensional Memory, Chip Package Structure, and Electronic Device simplified abstract

APA style

Huawei technologies co., ltd. (20240222367). Three-Dimensional Memory, Chip Package Structure, and Electronic Device simplified abstract. (2024, July 4). WikiPatents, . Retrieved 10:55, July 20, 2024 from http://wikipatents.org/index.php?title=Huawei_technologies_co.,_ltd._(20240222367)._Three-Dimensional_Memory,_Chip_Package_Structure,_and_Electronic_Device_simplified_abstract&oldid=84281.

MLA style

"Huawei technologies co., ltd. (20240222367). Three-Dimensional Memory, Chip Package Structure, and Electronic Device simplified abstract." WikiPatents, . 4 Jul 2024, 16:20 UTC. 20 Jul 2024, 10:55 <http://wikipatents.org/index.php?title=Huawei_technologies_co.,_ltd._(20240222367)._Three-Dimensional_Memory,_Chip_Package_Structure,_and_Electronic_Device_simplified_abstract&oldid=84281>.

MHRA style

WikiPatents contributors, 'Huawei technologies co., ltd. (20240222367). Three-Dimensional Memory, Chip Package Structure, and Electronic Device simplified abstract', WikiPatents, , 4 July 2024, 16:20 UTC, <http://wikipatents.org/index.php?title=Huawei_technologies_co.,_ltd._(20240222367)._Three-Dimensional_Memory,_Chip_Package_Structure,_and_Electronic_Device_simplified_abstract&oldid=84281> [accessed 20 July 2024]

Chicago style

WikiPatents contributors, "Huawei technologies co., ltd. (20240222367). Three-Dimensional Memory, Chip Package Structure, and Electronic Device simplified abstract," WikiPatents, , http://wikipatents.org/index.php?title=Huawei_technologies_co.,_ltd._(20240222367)._Three-Dimensional_Memory,_Chip_Package_Structure,_and_Electronic_Device_simplified_abstract&oldid=84281 (accessed July 20, 2024).

CBE/CSE style

WikiPatents contributors. Huawei technologies co., ltd. (20240222367). Three-Dimensional Memory, Chip Package Structure, and Electronic Device simplified abstract [Internet]. WikiPatents, ; 2024 Jul 4, 16:20 UTC [cited 2024 Jul 20]. Available from: http://wikipatents.org/index.php?title=Huawei_technologies_co.,_ltd._(20240222367)._Three-Dimensional_Memory,_Chip_Package_Structure,_and_Electronic_Device_simplified_abstract&oldid=84281.

Bluebook style

Huawei technologies co., ltd. (20240222367). Three-Dimensional Memory, Chip Package Structure, and Electronic Device simplified abstract, http://wikipatents.org/index.php?title=Huawei_technologies_co.,_ltd._(20240222367)._Three-Dimensional_Memory,_Chip_Package_Structure,_and_Electronic_Device_simplified_abstract&oldid=84281 (last visited July 20, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "Huawei technologies co., ltd. (20240222367). Three-Dimensional Memory, Chip Package Structure, and Electronic Device simplified abstract --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=Huawei_technologies_co.,_ltd._(20240222367)._Three-Dimensional_Memory,_Chip_Package_Structure,_and_Electronic_Device_simplified_abstract&oldid=84281",
   note = "[Online; accessed 20-July-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "Huawei technologies co., ltd. (20240222367). Three-Dimensional Memory, Chip Package Structure, and Electronic Device simplified abstract --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=Huawei_technologies_co.,_ltd._(20240222367)._Three-Dimensional_Memory,_Chip_Package_Structure,_and_Electronic_Device_simplified_abstract&oldid=84281}",
   note = "[Online; accessed 20-July-2024]"
 }


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