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Bibliographic details for Intel corporation (20240217122). ENHANCED SUBSTRATE TRANSFER ARM (STA) AND PEDESTAL OF THERMAL COMPRESSION BONDING (TCB) AND INTEGRATED PROCESS USING THEREOF simplified abstract
- Page name: Intel corporation (20240217122). ENHANCED SUBSTRATE TRANSFER ARM (STA) AND PEDESTAL OF THERMAL COMPRESSION BONDING (TCB) AND INTEGRATED PROCESS USING THEREOF simplified abstract
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 4 July 2024 05:30 UTC
- Date retrieved: 21 July 2024 03:02 UTC
- Permanent URL: http://wikipatents.org/index.php?title=Intel_corporation_(20240217122)._ENHANCED_SUBSTRATE_TRANSFER_ARM_(STA)_AND_PEDESTAL_OF_THERMAL_COMPRESSION_BONDING_(TCB)_AND_INTEGRATED_PROCESS_USING_THEREOF_simplified_abstract&oldid=83157
- Page Version ID: 83157
Citation styles for Intel corporation (20240217122). ENHANCED SUBSTRATE TRANSFER ARM (STA) AND PEDESTAL OF THERMAL COMPRESSION BONDING (TCB) AND INTEGRATED PROCESS USING THEREOF simplified abstract
APA style
Intel corporation (20240217122). ENHANCED SUBSTRATE TRANSFER ARM (STA) AND PEDESTAL OF THERMAL COMPRESSION BONDING (TCB) AND INTEGRATED PROCESS USING THEREOF simplified abstract. (2024, July 4). WikiPatents, . Retrieved 03:02, July 21, 2024 from http://wikipatents.org/index.php?title=Intel_corporation_(20240217122)._ENHANCED_SUBSTRATE_TRANSFER_ARM_(STA)_AND_PEDESTAL_OF_THERMAL_COMPRESSION_BONDING_(TCB)_AND_INTEGRATED_PROCESS_USING_THEREOF_simplified_abstract&oldid=83157.
MLA style
"Intel corporation (20240217122). ENHANCED SUBSTRATE TRANSFER ARM (STA) AND PEDESTAL OF THERMAL COMPRESSION BONDING (TCB) AND INTEGRATED PROCESS USING THEREOF simplified abstract." WikiPatents, . 4 Jul 2024, 05:30 UTC. 21 Jul 2024, 03:02 <http://wikipatents.org/index.php?title=Intel_corporation_(20240217122)._ENHANCED_SUBSTRATE_TRANSFER_ARM_(STA)_AND_PEDESTAL_OF_THERMAL_COMPRESSION_BONDING_(TCB)_AND_INTEGRATED_PROCESS_USING_THEREOF_simplified_abstract&oldid=83157>.
MHRA style
WikiPatents contributors, 'Intel corporation (20240217122). ENHANCED SUBSTRATE TRANSFER ARM (STA) AND PEDESTAL OF THERMAL COMPRESSION BONDING (TCB) AND INTEGRATED PROCESS USING THEREOF simplified abstract', WikiPatents, , 4 July 2024, 05:30 UTC, <http://wikipatents.org/index.php?title=Intel_corporation_(20240217122)._ENHANCED_SUBSTRATE_TRANSFER_ARM_(STA)_AND_PEDESTAL_OF_THERMAL_COMPRESSION_BONDING_(TCB)_AND_INTEGRATED_PROCESS_USING_THEREOF_simplified_abstract&oldid=83157> [accessed 21 July 2024]
Chicago style
WikiPatents contributors, "Intel corporation (20240217122). ENHANCED SUBSTRATE TRANSFER ARM (STA) AND PEDESTAL OF THERMAL COMPRESSION BONDING (TCB) AND INTEGRATED PROCESS USING THEREOF simplified abstract," WikiPatents, , http://wikipatents.org/index.php?title=Intel_corporation_(20240217122)._ENHANCED_SUBSTRATE_TRANSFER_ARM_(STA)_AND_PEDESTAL_OF_THERMAL_COMPRESSION_BONDING_(TCB)_AND_INTEGRATED_PROCESS_USING_THEREOF_simplified_abstract&oldid=83157 (accessed July 21, 2024).
CBE/CSE style
WikiPatents contributors. Intel corporation (20240217122). ENHANCED SUBSTRATE TRANSFER ARM (STA) AND PEDESTAL OF THERMAL COMPRESSION BONDING (TCB) AND INTEGRATED PROCESS USING THEREOF simplified abstract [Internet]. WikiPatents, ; 2024 Jul 4, 05:30 UTC [cited 2024 Jul 21]. Available from: http://wikipatents.org/index.php?title=Intel_corporation_(20240217122)._ENHANCED_SUBSTRATE_TRANSFER_ARM_(STA)_AND_PEDESTAL_OF_THERMAL_COMPRESSION_BONDING_(TCB)_AND_INTEGRATED_PROCESS_USING_THEREOF_simplified_abstract&oldid=83157.
Bluebook style
Intel corporation (20240217122). ENHANCED SUBSTRATE TRANSFER ARM (STA) AND PEDESTAL OF THERMAL COMPRESSION BONDING (TCB) AND INTEGRATED PROCESS USING THEREOF simplified abstract, http://wikipatents.org/index.php?title=Intel_corporation_(20240217122)._ENHANCED_SUBSTRATE_TRANSFER_ARM_(STA)_AND_PEDESTAL_OF_THERMAL_COMPRESSION_BONDING_(TCB)_AND_INTEGRATED_PROCESS_USING_THEREOF_simplified_abstract&oldid=83157 (last visited July 21, 2024).
BibTeX entry
@misc{ wiki:xxx, author = "WikiPatents", title = "Intel corporation (20240217122). ENHANCED SUBSTRATE TRANSFER ARM (STA) AND PEDESTAL OF THERMAL COMPRESSION BONDING (TCB) AND INTEGRATED PROCESS USING THEREOF simplified abstract --- WikiPatents{,} ", year = "2024", url = "http://wikipatents.org/index.php?title=Intel_corporation_(20240217122)._ENHANCED_SUBSTRATE_TRANSFER_ARM_(STA)_AND_PEDESTAL_OF_THERMAL_COMPRESSION_BONDING_(TCB)_AND_INTEGRATED_PROCESS_USING_THEREOF_simplified_abstract&oldid=83157", note = "[Online; accessed 21-July-2024]" }
When using the LaTeX package url (\usepackage{url}
somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx, author = "WikiPatents", title = "Intel corporation (20240217122). ENHANCED SUBSTRATE TRANSFER ARM (STA) AND PEDESTAL OF THERMAL COMPRESSION BONDING (TCB) AND INTEGRATED PROCESS USING THEREOF simplified abstract --- WikiPatents{,} ", year = "2024", url = "\url{http://wikipatents.org/index.php?title=Intel_corporation_(20240217122)._ENHANCED_SUBSTRATE_TRANSFER_ARM_(STA)_AND_PEDESTAL_OF_THERMAL_COMPRESSION_BONDING_(TCB)_AND_INTEGRATED_PROCESS_USING_THEREOF_simplified_abstract&oldid=83157}", note = "[Online; accessed 21-July-2024]" }