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Bibliographic details for 18127235. CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)

Citation styles for 18127235. CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)

APA style

18127235. CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.). (2024, June 28). WikiPatents, . Retrieved 07:49, July 4, 2024 from http://wikipatents.org/index.php?title=18127235._CIRCUIT_BOARD,_MANUFACTURING_METHOD_THEREOF,_AND_ELECTRONIC_COMPONENT_PACKAGE_INCLUDING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRO-MECHANICS_CO.,_LTD.)&oldid=80213.

MLA style

"18127235. CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)." WikiPatents, . 28 Jun 2024, 05:20 UTC. 4 Jul 2024, 07:49 <http://wikipatents.org/index.php?title=18127235._CIRCUIT_BOARD,_MANUFACTURING_METHOD_THEREOF,_AND_ELECTRONIC_COMPONENT_PACKAGE_INCLUDING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRO-MECHANICS_CO.,_LTD.)&oldid=80213>.

MHRA style

WikiPatents contributors, '18127235. CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)', WikiPatents, , 28 June 2024, 05:20 UTC, <http://wikipatents.org/index.php?title=18127235._CIRCUIT_BOARD,_MANUFACTURING_METHOD_THEREOF,_AND_ELECTRONIC_COMPONENT_PACKAGE_INCLUDING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRO-MECHANICS_CO.,_LTD.)&oldid=80213> [accessed 4 July 2024]

Chicago style

WikiPatents contributors, "18127235. CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)," WikiPatents, , http://wikipatents.org/index.php?title=18127235._CIRCUIT_BOARD,_MANUFACTURING_METHOD_THEREOF,_AND_ELECTRONIC_COMPONENT_PACKAGE_INCLUDING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRO-MECHANICS_CO.,_LTD.)&oldid=80213 (accessed July 4, 2024).

CBE/CSE style

WikiPatents contributors. 18127235. CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.) [Internet]. WikiPatents, ; 2024 Jun 28, 05:20 UTC [cited 2024 Jul 4]. Available from: http://wikipatents.org/index.php?title=18127235._CIRCUIT_BOARD,_MANUFACTURING_METHOD_THEREOF,_AND_ELECTRONIC_COMPONENT_PACKAGE_INCLUDING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRO-MECHANICS_CO.,_LTD.)&oldid=80213.

Bluebook style

18127235. CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.), http://wikipatents.org/index.php?title=18127235._CIRCUIT_BOARD,_MANUFACTURING_METHOD_THEREOF,_AND_ELECTRONIC_COMPONENT_PACKAGE_INCLUDING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRO-MECHANICS_CO.,_LTD.)&oldid=80213 (last visited July 4, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18127235. CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=18127235._CIRCUIT_BOARD,_MANUFACTURING_METHOD_THEREOF,_AND_ELECTRONIC_COMPONENT_PACKAGE_INCLUDING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRO-MECHANICS_CO.,_LTD.)&oldid=80213",
   note = "[Online; accessed 4-July-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18127235. CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=18127235._CIRCUIT_BOARD,_MANUFACTURING_METHOD_THEREOF,_AND_ELECTRONIC_COMPONENT_PACKAGE_INCLUDING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRO-MECHANICS_CO.,_LTD.)&oldid=80213}",
   note = "[Online; accessed 4-July-2024]"
 }


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