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Bibliographic details for 18127235. CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- Page name: 18127235. CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 28 June 2024 05:20 UTC
- Date retrieved: 6 July 2024 22:54 UTC
- Permanent URL: http://wikipatents.org/index.php?title=18127235._CIRCUIT_BOARD,_MANUFACTURING_METHOD_THEREOF,_AND_ELECTRONIC_COMPONENT_PACKAGE_INCLUDING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRO-MECHANICS_CO.,_LTD.)&oldid=80213
- Page Version ID: 80213
Citation styles for 18127235. CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
APA style
18127235. CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.). (2024, June 28). WikiPatents, . Retrieved 22:54, July 6, 2024 from http://wikipatents.org/index.php?title=18127235._CIRCUIT_BOARD,_MANUFACTURING_METHOD_THEREOF,_AND_ELECTRONIC_COMPONENT_PACKAGE_INCLUDING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRO-MECHANICS_CO.,_LTD.)&oldid=80213.
MLA style
"18127235. CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)." WikiPatents, . 28 Jun 2024, 05:20 UTC. 6 Jul 2024, 22:54 <http://wikipatents.org/index.php?title=18127235._CIRCUIT_BOARD,_MANUFACTURING_METHOD_THEREOF,_AND_ELECTRONIC_COMPONENT_PACKAGE_INCLUDING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRO-MECHANICS_CO.,_LTD.)&oldid=80213>.
MHRA style
WikiPatents contributors, '18127235. CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)', WikiPatents, , 28 June 2024, 05:20 UTC, <http://wikipatents.org/index.php?title=18127235._CIRCUIT_BOARD,_MANUFACTURING_METHOD_THEREOF,_AND_ELECTRONIC_COMPONENT_PACKAGE_INCLUDING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRO-MECHANICS_CO.,_LTD.)&oldid=80213> [accessed 6 July 2024]
Chicago style
WikiPatents contributors, "18127235. CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)," WikiPatents, , http://wikipatents.org/index.php?title=18127235._CIRCUIT_BOARD,_MANUFACTURING_METHOD_THEREOF,_AND_ELECTRONIC_COMPONENT_PACKAGE_INCLUDING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRO-MECHANICS_CO.,_LTD.)&oldid=80213 (accessed July 6, 2024).
CBE/CSE style
WikiPatents contributors. 18127235. CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.) [Internet]. WikiPatents, ; 2024 Jun 28, 05:20 UTC [cited 2024 Jul 6]. Available from: http://wikipatents.org/index.php?title=18127235._CIRCUIT_BOARD,_MANUFACTURING_METHOD_THEREOF,_AND_ELECTRONIC_COMPONENT_PACKAGE_INCLUDING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRO-MECHANICS_CO.,_LTD.)&oldid=80213.
Bluebook style
18127235. CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.), http://wikipatents.org/index.php?title=18127235._CIRCUIT_BOARD,_MANUFACTURING_METHOD_THEREOF,_AND_ELECTRONIC_COMPONENT_PACKAGE_INCLUDING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRO-MECHANICS_CO.,_LTD.)&oldid=80213 (last visited July 6, 2024).
BibTeX entry
@misc{ wiki:xxx, author = "WikiPatents", title = "18127235. CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.) --- WikiPatents{,} ", year = "2024", url = "http://wikipatents.org/index.php?title=18127235._CIRCUIT_BOARD,_MANUFACTURING_METHOD_THEREOF,_AND_ELECTRONIC_COMPONENT_PACKAGE_INCLUDING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRO-MECHANICS_CO.,_LTD.)&oldid=80213", note = "[Online; accessed 6-July-2024]" }
When using the LaTeX package url (\usepackage{url}
somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx, author = "WikiPatents", title = "18127235. CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.) --- WikiPatents{,} ", year = "2024", url = "\url{http://wikipatents.org/index.php?title=18127235._CIRCUIT_BOARD,_MANUFACTURING_METHOD_THEREOF,_AND_ELECTRONIC_COMPONENT_PACKAGE_INCLUDING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRO-MECHANICS_CO.,_LTD.)&oldid=80213}", note = "[Online; accessed 6-July-2024]" }