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Bibliographic details for 18602533. INFO PACKAGES INCLUDING THERMAL DISSIPATION BLOCKS simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)

Citation styles for 18602533. INFO PACKAGES INCLUDING THERMAL DISSIPATION BLOCKS simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)

APA style

18602533. INFO PACKAGES INCLUDING THERMAL DISSIPATION BLOCKS simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.). (2024, June 28). WikiPatents, . Retrieved 09:40, July 3, 2024 from http://wikipatents.org/index.php?title=18602533._INFO_PACKAGES_INCLUDING_THERMAL_DISSIPATION_BLOCKS_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=79899.

MLA style

"18602533. INFO PACKAGES INCLUDING THERMAL DISSIPATION BLOCKS simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)." WikiPatents, . 28 Jun 2024, 04:51 UTC. 3 Jul 2024, 09:40 <http://wikipatents.org/index.php?title=18602533._INFO_PACKAGES_INCLUDING_THERMAL_DISSIPATION_BLOCKS_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=79899>.

MHRA style

WikiPatents contributors, '18602533. INFO PACKAGES INCLUDING THERMAL DISSIPATION BLOCKS simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)', WikiPatents, , 28 June 2024, 04:51 UTC, <http://wikipatents.org/index.php?title=18602533._INFO_PACKAGES_INCLUDING_THERMAL_DISSIPATION_BLOCKS_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=79899> [accessed 3 July 2024]

Chicago style

WikiPatents contributors, "18602533. INFO PACKAGES INCLUDING THERMAL DISSIPATION BLOCKS simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)," WikiPatents, , http://wikipatents.org/index.php?title=18602533._INFO_PACKAGES_INCLUDING_THERMAL_DISSIPATION_BLOCKS_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=79899 (accessed July 3, 2024).

CBE/CSE style

WikiPatents contributors. 18602533. INFO PACKAGES INCLUDING THERMAL DISSIPATION BLOCKS simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.) [Internet]. WikiPatents, ; 2024 Jun 28, 04:51 UTC [cited 2024 Jul 3]. Available from: http://wikipatents.org/index.php?title=18602533._INFO_PACKAGES_INCLUDING_THERMAL_DISSIPATION_BLOCKS_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=79899.

Bluebook style

18602533. INFO PACKAGES INCLUDING THERMAL DISSIPATION BLOCKS simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.), http://wikipatents.org/index.php?title=18602533._INFO_PACKAGES_INCLUDING_THERMAL_DISSIPATION_BLOCKS_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=79899 (last visited July 3, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18602533. INFO PACKAGES INCLUDING THERMAL DISSIPATION BLOCKS simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=18602533._INFO_PACKAGES_INCLUDING_THERMAL_DISSIPATION_BLOCKS_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=79899",
   note = "[Online; accessed 3-July-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18602533. INFO PACKAGES INCLUDING THERMAL DISSIPATION BLOCKS simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=18602533._INFO_PACKAGES_INCLUDING_THERMAL_DISSIPATION_BLOCKS_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=79899}",
   note = "[Online; accessed 3-July-2024]"
 }


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