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Citation styles for 18169212. SEMICONDUCTOR PACKAGING DEVICE AND HEAT DISSIPATION COVER THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)

APA style

18169212. SEMICONDUCTOR PACKAGING DEVICE AND HEAT DISSIPATION COVER THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.). (2024, June 28). WikiPatents, . Retrieved 07:01, July 4, 2024 from http://wikipatents.org/index.php?title=18169212._SEMICONDUCTOR_PACKAGING_DEVICE_AND_HEAT_DISSIPATION_COVER_THEREOF_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=79886.

MLA style

"18169212. SEMICONDUCTOR PACKAGING DEVICE AND HEAT DISSIPATION COVER THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)." WikiPatents, . 28 Jun 2024, 04:49 UTC. 4 Jul 2024, 07:01 <http://wikipatents.org/index.php?title=18169212._SEMICONDUCTOR_PACKAGING_DEVICE_AND_HEAT_DISSIPATION_COVER_THEREOF_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=79886>.

MHRA style

WikiPatents contributors, '18169212. SEMICONDUCTOR PACKAGING DEVICE AND HEAT DISSIPATION COVER THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)', WikiPatents, , 28 June 2024, 04:49 UTC, <http://wikipatents.org/index.php?title=18169212._SEMICONDUCTOR_PACKAGING_DEVICE_AND_HEAT_DISSIPATION_COVER_THEREOF_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=79886> [accessed 4 July 2024]

Chicago style

WikiPatents contributors, "18169212. SEMICONDUCTOR PACKAGING DEVICE AND HEAT DISSIPATION COVER THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)," WikiPatents, , http://wikipatents.org/index.php?title=18169212._SEMICONDUCTOR_PACKAGING_DEVICE_AND_HEAT_DISSIPATION_COVER_THEREOF_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=79886 (accessed July 4, 2024).

CBE/CSE style

WikiPatents contributors. 18169212. SEMICONDUCTOR PACKAGING DEVICE AND HEAT DISSIPATION COVER THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.) [Internet]. WikiPatents, ; 2024 Jun 28, 04:49 UTC [cited 2024 Jul 4]. Available from: http://wikipatents.org/index.php?title=18169212._SEMICONDUCTOR_PACKAGING_DEVICE_AND_HEAT_DISSIPATION_COVER_THEREOF_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=79886.

Bluebook style

18169212. SEMICONDUCTOR PACKAGING DEVICE AND HEAT DISSIPATION COVER THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.), http://wikipatents.org/index.php?title=18169212._SEMICONDUCTOR_PACKAGING_DEVICE_AND_HEAT_DISSIPATION_COVER_THEREOF_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=79886 (last visited July 4, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18169212. SEMICONDUCTOR PACKAGING DEVICE AND HEAT DISSIPATION COVER THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=18169212._SEMICONDUCTOR_PACKAGING_DEVICE_AND_HEAT_DISSIPATION_COVER_THEREOF_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=79886",
   note = "[Online; accessed 4-July-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18169212. SEMICONDUCTOR PACKAGING DEVICE AND HEAT DISSIPATION COVER THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=18169212._SEMICONDUCTOR_PACKAGING_DEVICE_AND_HEAT_DISSIPATION_COVER_THEREOF_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Company,_Ltd.)&oldid=79886}",
   note = "[Online; accessed 4-July-2024]"
 }