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Bibliographic details for 18601774. PACKAGE STACKING USING CHIP TO WAFER BONDING simplified abstract (Intel Corporation)
- Page name: 18601774. PACKAGE STACKING USING CHIP TO WAFER BONDING simplified abstract (Intel Corporation)
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 28 June 2024 04:22 UTC
- Date retrieved: 6 July 2024 22:26 UTC
- Permanent URL: http://wikipatents.org/index.php?title=18601774._PACKAGE_STACKING_USING_CHIP_TO_WAFER_BONDING_simplified_abstract_(Intel_Corporation)&oldid=79590
- Page Version ID: 79590
Citation styles for 18601774. PACKAGE STACKING USING CHIP TO WAFER BONDING simplified abstract (Intel Corporation)
APA style
18601774. PACKAGE STACKING USING CHIP TO WAFER BONDING simplified abstract (Intel Corporation). (2024, June 28). WikiPatents, . Retrieved 22:26, July 6, 2024 from http://wikipatents.org/index.php?title=18601774._PACKAGE_STACKING_USING_CHIP_TO_WAFER_BONDING_simplified_abstract_(Intel_Corporation)&oldid=79590.
MLA style
"18601774. PACKAGE STACKING USING CHIP TO WAFER BONDING simplified abstract (Intel Corporation)." WikiPatents, . 28 Jun 2024, 04:22 UTC. 6 Jul 2024, 22:26 <http://wikipatents.org/index.php?title=18601774._PACKAGE_STACKING_USING_CHIP_TO_WAFER_BONDING_simplified_abstract_(Intel_Corporation)&oldid=79590>.
MHRA style
WikiPatents contributors, '18601774. PACKAGE STACKING USING CHIP TO WAFER BONDING simplified abstract (Intel Corporation)', WikiPatents, , 28 June 2024, 04:22 UTC, <http://wikipatents.org/index.php?title=18601774._PACKAGE_STACKING_USING_CHIP_TO_WAFER_BONDING_simplified_abstract_(Intel_Corporation)&oldid=79590> [accessed 6 July 2024]
Chicago style
WikiPatents contributors, "18601774. PACKAGE STACKING USING CHIP TO WAFER BONDING simplified abstract (Intel Corporation)," WikiPatents, , http://wikipatents.org/index.php?title=18601774._PACKAGE_STACKING_USING_CHIP_TO_WAFER_BONDING_simplified_abstract_(Intel_Corporation)&oldid=79590 (accessed July 6, 2024).
CBE/CSE style
WikiPatents contributors. 18601774. PACKAGE STACKING USING CHIP TO WAFER BONDING simplified abstract (Intel Corporation) [Internet]. WikiPatents, ; 2024 Jun 28, 04:22 UTC [cited 2024 Jul 6]. Available from: http://wikipatents.org/index.php?title=18601774._PACKAGE_STACKING_USING_CHIP_TO_WAFER_BONDING_simplified_abstract_(Intel_Corporation)&oldid=79590.
Bluebook style
18601774. PACKAGE STACKING USING CHIP TO WAFER BONDING simplified abstract (Intel Corporation), http://wikipatents.org/index.php?title=18601774._PACKAGE_STACKING_USING_CHIP_TO_WAFER_BONDING_simplified_abstract_(Intel_Corporation)&oldid=79590 (last visited July 6, 2024).
BibTeX entry
@misc{ wiki:xxx,
author = "WikiPatents",
title = "18601774. PACKAGE STACKING USING CHIP TO WAFER BONDING simplified abstract (Intel Corporation) --- WikiPatents{,} ",
year = "2024",
url = "http://wikipatents.org/index.php?title=18601774._PACKAGE_STACKING_USING_CHIP_TO_WAFER_BONDING_simplified_abstract_(Intel_Corporation)&oldid=79590",
note = "[Online; accessed 6-July-2024]"
}
When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx,
author = "WikiPatents",
title = "18601774. PACKAGE STACKING USING CHIP TO WAFER BONDING simplified abstract (Intel Corporation) --- WikiPatents{,} ",
year = "2024",
url = "\url{http://wikipatents.org/index.php?title=18601774._PACKAGE_STACKING_USING_CHIP_TO_WAFER_BONDING_simplified_abstract_(Intel_Corporation)&oldid=79590}",
note = "[Online; accessed 6-July-2024]"
}
