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Bibliographic details for 18089483. TSV-TYPE EMBEDDED MULTI-DIE INTERCONNECT BRIDGE ENABLING WITH THERMAL COMPRESSION NON-CONDUCTIVE FILM (TC-NCF) PROCESS simplified abstract (Intel Corporation)

Citation styles for 18089483. TSV-TYPE EMBEDDED MULTI-DIE INTERCONNECT BRIDGE ENABLING WITH THERMAL COMPRESSION NON-CONDUCTIVE FILM (TC-NCF) PROCESS simplified abstract (Intel Corporation)

APA style

18089483. TSV-TYPE EMBEDDED MULTI-DIE INTERCONNECT BRIDGE ENABLING WITH THERMAL COMPRESSION NON-CONDUCTIVE FILM (TC-NCF) PROCESS simplified abstract (Intel Corporation). (2024, June 28). WikiPatents, . Retrieved 23:29, July 2, 2024 from http://wikipatents.org/index.php?title=18089483._TSV-TYPE_EMBEDDED_MULTI-DIE_INTERCONNECT_BRIDGE_ENABLING_WITH_THERMAL_COMPRESSION_NON-CONDUCTIVE_FILM_(TC-NCF)_PROCESS_simplified_abstract_(Intel_Corporation)&oldid=79583.

MLA style

"18089483. TSV-TYPE EMBEDDED MULTI-DIE INTERCONNECT BRIDGE ENABLING WITH THERMAL COMPRESSION NON-CONDUCTIVE FILM (TC-NCF) PROCESS simplified abstract (Intel Corporation)." WikiPatents, . 28 Jun 2024, 04:21 UTC. 2 Jul 2024, 23:29 <http://wikipatents.org/index.php?title=18089483._TSV-TYPE_EMBEDDED_MULTI-DIE_INTERCONNECT_BRIDGE_ENABLING_WITH_THERMAL_COMPRESSION_NON-CONDUCTIVE_FILM_(TC-NCF)_PROCESS_simplified_abstract_(Intel_Corporation)&oldid=79583>.

MHRA style

WikiPatents contributors, '18089483. TSV-TYPE EMBEDDED MULTI-DIE INTERCONNECT BRIDGE ENABLING WITH THERMAL COMPRESSION NON-CONDUCTIVE FILM (TC-NCF) PROCESS simplified abstract (Intel Corporation)', WikiPatents, , 28 June 2024, 04:21 UTC, <http://wikipatents.org/index.php?title=18089483._TSV-TYPE_EMBEDDED_MULTI-DIE_INTERCONNECT_BRIDGE_ENABLING_WITH_THERMAL_COMPRESSION_NON-CONDUCTIVE_FILM_(TC-NCF)_PROCESS_simplified_abstract_(Intel_Corporation)&oldid=79583> [accessed 2 July 2024]

Chicago style

WikiPatents contributors, "18089483. TSV-TYPE EMBEDDED MULTI-DIE INTERCONNECT BRIDGE ENABLING WITH THERMAL COMPRESSION NON-CONDUCTIVE FILM (TC-NCF) PROCESS simplified abstract (Intel Corporation)," WikiPatents, , http://wikipatents.org/index.php?title=18089483._TSV-TYPE_EMBEDDED_MULTI-DIE_INTERCONNECT_BRIDGE_ENABLING_WITH_THERMAL_COMPRESSION_NON-CONDUCTIVE_FILM_(TC-NCF)_PROCESS_simplified_abstract_(Intel_Corporation)&oldid=79583 (accessed July 2, 2024).

CBE/CSE style

WikiPatents contributors. 18089483. TSV-TYPE EMBEDDED MULTI-DIE INTERCONNECT BRIDGE ENABLING WITH THERMAL COMPRESSION NON-CONDUCTIVE FILM (TC-NCF) PROCESS simplified abstract (Intel Corporation) [Internet]. WikiPatents, ; 2024 Jun 28, 04:21 UTC [cited 2024 Jul 2]. Available from: http://wikipatents.org/index.php?title=18089483._TSV-TYPE_EMBEDDED_MULTI-DIE_INTERCONNECT_BRIDGE_ENABLING_WITH_THERMAL_COMPRESSION_NON-CONDUCTIVE_FILM_(TC-NCF)_PROCESS_simplified_abstract_(Intel_Corporation)&oldid=79583.

Bluebook style

18089483. TSV-TYPE EMBEDDED MULTI-DIE INTERCONNECT BRIDGE ENABLING WITH THERMAL COMPRESSION NON-CONDUCTIVE FILM (TC-NCF) PROCESS simplified abstract (Intel Corporation), http://wikipatents.org/index.php?title=18089483._TSV-TYPE_EMBEDDED_MULTI-DIE_INTERCONNECT_BRIDGE_ENABLING_WITH_THERMAL_COMPRESSION_NON-CONDUCTIVE_FILM_(TC-NCF)_PROCESS_simplified_abstract_(Intel_Corporation)&oldid=79583 (last visited July 2, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18089483. TSV-TYPE EMBEDDED MULTI-DIE INTERCONNECT BRIDGE ENABLING WITH THERMAL COMPRESSION NON-CONDUCTIVE FILM (TC-NCF) PROCESS simplified abstract (Intel Corporation) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=18089483._TSV-TYPE_EMBEDDED_MULTI-DIE_INTERCONNECT_BRIDGE_ENABLING_WITH_THERMAL_COMPRESSION_NON-CONDUCTIVE_FILM_(TC-NCF)_PROCESS_simplified_abstract_(Intel_Corporation)&oldid=79583",
   note = "[Online; accessed 2-July-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18089483. TSV-TYPE EMBEDDED MULTI-DIE INTERCONNECT BRIDGE ENABLING WITH THERMAL COMPRESSION NON-CONDUCTIVE FILM (TC-NCF) PROCESS simplified abstract (Intel Corporation) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=18089483._TSV-TYPE_EMBEDDED_MULTI-DIE_INTERCONNECT_BRIDGE_ENABLING_WITH_THERMAL_COMPRESSION_NON-CONDUCTIVE_FILM_(TC-NCF)_PROCESS_simplified_abstract_(Intel_Corporation)&oldid=79583}",
   note = "[Online; accessed 2-July-2024]"
 }


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