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Bibliographic details for 18089483. TSV-TYPE EMBEDDED MULTI-DIE INTERCONNECT BRIDGE ENABLING WITH THERMAL COMPRESSION NON-CONDUCTIVE FILM (TC-NCF) PROCESS simplified abstract (Intel Corporation)
- Page name: 18089483. TSV-TYPE EMBEDDED MULTI-DIE INTERCONNECT BRIDGE ENABLING WITH THERMAL COMPRESSION NON-CONDUCTIVE FILM (TC-NCF) PROCESS simplified abstract (Intel Corporation)
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 28 June 2024 04:21 UTC
- Date retrieved: 5 July 2024 04:17 UTC
- Permanent URL: http://wikipatents.org/index.php?title=18089483._TSV-TYPE_EMBEDDED_MULTI-DIE_INTERCONNECT_BRIDGE_ENABLING_WITH_THERMAL_COMPRESSION_NON-CONDUCTIVE_FILM_(TC-NCF)_PROCESS_simplified_abstract_(Intel_Corporation)&oldid=79583
- Page Version ID: 79583
Citation styles for 18089483. TSV-TYPE EMBEDDED MULTI-DIE INTERCONNECT BRIDGE ENABLING WITH THERMAL COMPRESSION NON-CONDUCTIVE FILM (TC-NCF) PROCESS simplified abstract (Intel Corporation)
APA style
18089483. TSV-TYPE EMBEDDED MULTI-DIE INTERCONNECT BRIDGE ENABLING WITH THERMAL COMPRESSION NON-CONDUCTIVE FILM (TC-NCF) PROCESS simplified abstract (Intel Corporation). (2024, June 28). WikiPatents, . Retrieved 04:17, July 5, 2024 from http://wikipatents.org/index.php?title=18089483._TSV-TYPE_EMBEDDED_MULTI-DIE_INTERCONNECT_BRIDGE_ENABLING_WITH_THERMAL_COMPRESSION_NON-CONDUCTIVE_FILM_(TC-NCF)_PROCESS_simplified_abstract_(Intel_Corporation)&oldid=79583.
MLA style
"18089483. TSV-TYPE EMBEDDED MULTI-DIE INTERCONNECT BRIDGE ENABLING WITH THERMAL COMPRESSION NON-CONDUCTIVE FILM (TC-NCF) PROCESS simplified abstract (Intel Corporation)." WikiPatents, . 28 Jun 2024, 04:21 UTC. 5 Jul 2024, 04:17 <http://wikipatents.org/index.php?title=18089483._TSV-TYPE_EMBEDDED_MULTI-DIE_INTERCONNECT_BRIDGE_ENABLING_WITH_THERMAL_COMPRESSION_NON-CONDUCTIVE_FILM_(TC-NCF)_PROCESS_simplified_abstract_(Intel_Corporation)&oldid=79583>.
MHRA style
WikiPatents contributors, '18089483. TSV-TYPE EMBEDDED MULTI-DIE INTERCONNECT BRIDGE ENABLING WITH THERMAL COMPRESSION NON-CONDUCTIVE FILM (TC-NCF) PROCESS simplified abstract (Intel Corporation)', WikiPatents, , 28 June 2024, 04:21 UTC, <http://wikipatents.org/index.php?title=18089483._TSV-TYPE_EMBEDDED_MULTI-DIE_INTERCONNECT_BRIDGE_ENABLING_WITH_THERMAL_COMPRESSION_NON-CONDUCTIVE_FILM_(TC-NCF)_PROCESS_simplified_abstract_(Intel_Corporation)&oldid=79583> [accessed 5 July 2024]
Chicago style
WikiPatents contributors, "18089483. TSV-TYPE EMBEDDED MULTI-DIE INTERCONNECT BRIDGE ENABLING WITH THERMAL COMPRESSION NON-CONDUCTIVE FILM (TC-NCF) PROCESS simplified abstract (Intel Corporation)," WikiPatents, , http://wikipatents.org/index.php?title=18089483._TSV-TYPE_EMBEDDED_MULTI-DIE_INTERCONNECT_BRIDGE_ENABLING_WITH_THERMAL_COMPRESSION_NON-CONDUCTIVE_FILM_(TC-NCF)_PROCESS_simplified_abstract_(Intel_Corporation)&oldid=79583 (accessed July 5, 2024).
CBE/CSE style
WikiPatents contributors. 18089483. TSV-TYPE EMBEDDED MULTI-DIE INTERCONNECT BRIDGE ENABLING WITH THERMAL COMPRESSION NON-CONDUCTIVE FILM (TC-NCF) PROCESS simplified abstract (Intel Corporation) [Internet]. WikiPatents, ; 2024 Jun 28, 04:21 UTC [cited 2024 Jul 5]. Available from: http://wikipatents.org/index.php?title=18089483._TSV-TYPE_EMBEDDED_MULTI-DIE_INTERCONNECT_BRIDGE_ENABLING_WITH_THERMAL_COMPRESSION_NON-CONDUCTIVE_FILM_(TC-NCF)_PROCESS_simplified_abstract_(Intel_Corporation)&oldid=79583.
Bluebook style
18089483. TSV-TYPE EMBEDDED MULTI-DIE INTERCONNECT BRIDGE ENABLING WITH THERMAL COMPRESSION NON-CONDUCTIVE FILM (TC-NCF) PROCESS simplified abstract (Intel Corporation), http://wikipatents.org/index.php?title=18089483._TSV-TYPE_EMBEDDED_MULTI-DIE_INTERCONNECT_BRIDGE_ENABLING_WITH_THERMAL_COMPRESSION_NON-CONDUCTIVE_FILM_(TC-NCF)_PROCESS_simplified_abstract_(Intel_Corporation)&oldid=79583 (last visited July 5, 2024).
BibTeX entry
@misc{ wiki:xxx, author = "WikiPatents", title = "18089483. TSV-TYPE EMBEDDED MULTI-DIE INTERCONNECT BRIDGE ENABLING WITH THERMAL COMPRESSION NON-CONDUCTIVE FILM (TC-NCF) PROCESS simplified abstract (Intel Corporation) --- WikiPatents{,} ", year = "2024", url = "http://wikipatents.org/index.php?title=18089483._TSV-TYPE_EMBEDDED_MULTI-DIE_INTERCONNECT_BRIDGE_ENABLING_WITH_THERMAL_COMPRESSION_NON-CONDUCTIVE_FILM_(TC-NCF)_PROCESS_simplified_abstract_(Intel_Corporation)&oldid=79583", note = "[Online; accessed 5-July-2024]" }
When using the LaTeX package url (\usepackage{url}
somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx, author = "WikiPatents", title = "18089483. TSV-TYPE EMBEDDED MULTI-DIE INTERCONNECT BRIDGE ENABLING WITH THERMAL COMPRESSION NON-CONDUCTIVE FILM (TC-NCF) PROCESS simplified abstract (Intel Corporation) --- WikiPatents{,} ", year = "2024", url = "\url{http://wikipatents.org/index.php?title=18089483._TSV-TYPE_EMBEDDED_MULTI-DIE_INTERCONNECT_BRIDGE_ENABLING_WITH_THERMAL_COMPRESSION_NON-CONDUCTIVE_FILM_(TC-NCF)_PROCESS_simplified_abstract_(Intel_Corporation)&oldid=79583}", note = "[Online; accessed 5-July-2024]" }