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Bibliographic details for Samsung electro-mechanics co., ltd. (20240213204). CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME simplified abstract

Citation styles for Samsung electro-mechanics co., ltd. (20240213204). CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME simplified abstract

APA style

Samsung electro-mechanics co., ltd. (20240213204). CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME simplified abstract. (2024, June 28). WikiPatents, . Retrieved 07:41, July 7, 2024 from http://wikipatents.org/index.php?title=Samsung_electro-mechanics_co.,_ltd._(20240213204)._CIRCUIT_BOARD,_MANUFACTURING_METHOD_THEREOF,_AND_ELECTRONIC_COMPONENT_PACKAGE_INCLUDING_THE_SAME_simplified_abstract&oldid=78699.

MLA style

"Samsung electro-mechanics co., ltd. (20240213204). CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME simplified abstract." WikiPatents, . 28 Jun 2024, 02:47 UTC. 7 Jul 2024, 07:41 <http://wikipatents.org/index.php?title=Samsung_electro-mechanics_co.,_ltd._(20240213204)._CIRCUIT_BOARD,_MANUFACTURING_METHOD_THEREOF,_AND_ELECTRONIC_COMPONENT_PACKAGE_INCLUDING_THE_SAME_simplified_abstract&oldid=78699>.

MHRA style

WikiPatents contributors, 'Samsung electro-mechanics co., ltd. (20240213204). CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME simplified abstract', WikiPatents, , 28 June 2024, 02:47 UTC, <http://wikipatents.org/index.php?title=Samsung_electro-mechanics_co.,_ltd._(20240213204)._CIRCUIT_BOARD,_MANUFACTURING_METHOD_THEREOF,_AND_ELECTRONIC_COMPONENT_PACKAGE_INCLUDING_THE_SAME_simplified_abstract&oldid=78699> [accessed 7 July 2024]

Chicago style

WikiPatents contributors, "Samsung electro-mechanics co., ltd. (20240213204). CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME simplified abstract," WikiPatents, , http://wikipatents.org/index.php?title=Samsung_electro-mechanics_co.,_ltd._(20240213204)._CIRCUIT_BOARD,_MANUFACTURING_METHOD_THEREOF,_AND_ELECTRONIC_COMPONENT_PACKAGE_INCLUDING_THE_SAME_simplified_abstract&oldid=78699 (accessed July 7, 2024).

CBE/CSE style

WikiPatents contributors. Samsung electro-mechanics co., ltd. (20240213204). CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME simplified abstract [Internet]. WikiPatents, ; 2024 Jun 28, 02:47 UTC [cited 2024 Jul 7]. Available from: http://wikipatents.org/index.php?title=Samsung_electro-mechanics_co.,_ltd._(20240213204)._CIRCUIT_BOARD,_MANUFACTURING_METHOD_THEREOF,_AND_ELECTRONIC_COMPONENT_PACKAGE_INCLUDING_THE_SAME_simplified_abstract&oldid=78699.

Bluebook style

Samsung electro-mechanics co., ltd. (20240213204). CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME simplified abstract, http://wikipatents.org/index.php?title=Samsung_electro-mechanics_co.,_ltd._(20240213204)._CIRCUIT_BOARD,_MANUFACTURING_METHOD_THEREOF,_AND_ELECTRONIC_COMPONENT_PACKAGE_INCLUDING_THE_SAME_simplified_abstract&oldid=78699 (last visited July 7, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "Samsung electro-mechanics co., ltd. (20240213204). CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME simplified abstract --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=Samsung_electro-mechanics_co.,_ltd._(20240213204)._CIRCUIT_BOARD,_MANUFACTURING_METHOD_THEREOF,_AND_ELECTRONIC_COMPONENT_PACKAGE_INCLUDING_THE_SAME_simplified_abstract&oldid=78699",
   note = "[Online; accessed 7-July-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "Samsung electro-mechanics co., ltd. (20240213204). CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME simplified abstract --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=Samsung_electro-mechanics_co.,_ltd._(20240213204)._CIRCUIT_BOARD,_MANUFACTURING_METHOD_THEREOF,_AND_ELECTRONIC_COMPONENT_PACKAGE_INCLUDING_THE_SAME_simplified_abstract&oldid=78699}",
   note = "[Online; accessed 7-July-2024]"
 }


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