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Bibliographic details for Intel corporation (20240213198). UNDER BUMP METALLIZATIONS, SOLDER COMPOSITIONS, AND STRUCTURES FOR DIE INTERCONNECTS ON INTEGRATED CIRCUIT PACKAGING simplified abstract

Citation styles for Intel corporation (20240213198). UNDER BUMP METALLIZATIONS, SOLDER COMPOSITIONS, AND STRUCTURES FOR DIE INTERCONNECTS ON INTEGRATED CIRCUIT PACKAGING simplified abstract

APA style

Intel corporation (20240213198). UNDER BUMP METALLIZATIONS, SOLDER COMPOSITIONS, AND STRUCTURES FOR DIE INTERCONNECTS ON INTEGRATED CIRCUIT PACKAGING simplified abstract. (2024, June 28). WikiPatents, . Retrieved 23:19, July 2, 2024 from http://wikipatents.org/index.php?title=Intel_corporation_(20240213198)._UNDER_BUMP_METALLIZATIONS,_SOLDER_COMPOSITIONS,_AND_STRUCTURES_FOR_DIE_INTERCONNECTS_ON_INTEGRATED_CIRCUIT_PACKAGING_simplified_abstract&oldid=77431.

MLA style

"Intel corporation (20240213198). UNDER BUMP METALLIZATIONS, SOLDER COMPOSITIONS, AND STRUCTURES FOR DIE INTERCONNECTS ON INTEGRATED CIRCUIT PACKAGING simplified abstract." WikiPatents, . 28 Jun 2024, 00:38 UTC. 2 Jul 2024, 23:19 <http://wikipatents.org/index.php?title=Intel_corporation_(20240213198)._UNDER_BUMP_METALLIZATIONS,_SOLDER_COMPOSITIONS,_AND_STRUCTURES_FOR_DIE_INTERCONNECTS_ON_INTEGRATED_CIRCUIT_PACKAGING_simplified_abstract&oldid=77431>.

MHRA style

WikiPatents contributors, 'Intel corporation (20240213198). UNDER BUMP METALLIZATIONS, SOLDER COMPOSITIONS, AND STRUCTURES FOR DIE INTERCONNECTS ON INTEGRATED CIRCUIT PACKAGING simplified abstract', WikiPatents, , 28 June 2024, 00:38 UTC, <http://wikipatents.org/index.php?title=Intel_corporation_(20240213198)._UNDER_BUMP_METALLIZATIONS,_SOLDER_COMPOSITIONS,_AND_STRUCTURES_FOR_DIE_INTERCONNECTS_ON_INTEGRATED_CIRCUIT_PACKAGING_simplified_abstract&oldid=77431> [accessed 2 July 2024]

Chicago style

WikiPatents contributors, "Intel corporation (20240213198). UNDER BUMP METALLIZATIONS, SOLDER COMPOSITIONS, AND STRUCTURES FOR DIE INTERCONNECTS ON INTEGRATED CIRCUIT PACKAGING simplified abstract," WikiPatents, , http://wikipatents.org/index.php?title=Intel_corporation_(20240213198)._UNDER_BUMP_METALLIZATIONS,_SOLDER_COMPOSITIONS,_AND_STRUCTURES_FOR_DIE_INTERCONNECTS_ON_INTEGRATED_CIRCUIT_PACKAGING_simplified_abstract&oldid=77431 (accessed July 2, 2024).

CBE/CSE style

WikiPatents contributors. Intel corporation (20240213198). UNDER BUMP METALLIZATIONS, SOLDER COMPOSITIONS, AND STRUCTURES FOR DIE INTERCONNECTS ON INTEGRATED CIRCUIT PACKAGING simplified abstract [Internet]. WikiPatents, ; 2024 Jun 28, 00:38 UTC [cited 2024 Jul 2]. Available from: http://wikipatents.org/index.php?title=Intel_corporation_(20240213198)._UNDER_BUMP_METALLIZATIONS,_SOLDER_COMPOSITIONS,_AND_STRUCTURES_FOR_DIE_INTERCONNECTS_ON_INTEGRATED_CIRCUIT_PACKAGING_simplified_abstract&oldid=77431.

Bluebook style

Intel corporation (20240213198). UNDER BUMP METALLIZATIONS, SOLDER COMPOSITIONS, AND STRUCTURES FOR DIE INTERCONNECTS ON INTEGRATED CIRCUIT PACKAGING simplified abstract, http://wikipatents.org/index.php?title=Intel_corporation_(20240213198)._UNDER_BUMP_METALLIZATIONS,_SOLDER_COMPOSITIONS,_AND_STRUCTURES_FOR_DIE_INTERCONNECTS_ON_INTEGRATED_CIRCUIT_PACKAGING_simplified_abstract&oldid=77431 (last visited July 2, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "Intel corporation (20240213198). UNDER BUMP METALLIZATIONS, SOLDER COMPOSITIONS, AND STRUCTURES FOR DIE INTERCONNECTS ON INTEGRATED CIRCUIT PACKAGING simplified abstract --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=Intel_corporation_(20240213198)._UNDER_BUMP_METALLIZATIONS,_SOLDER_COMPOSITIONS,_AND_STRUCTURES_FOR_DIE_INTERCONNECTS_ON_INTEGRATED_CIRCUIT_PACKAGING_simplified_abstract&oldid=77431",
   note = "[Online; accessed 2-July-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "Intel corporation (20240213198). UNDER BUMP METALLIZATIONS, SOLDER COMPOSITIONS, AND STRUCTURES FOR DIE INTERCONNECTS ON INTEGRATED CIRCUIT PACKAGING simplified abstract --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=Intel_corporation_(20240213198)._UNDER_BUMP_METALLIZATIONS,_SOLDER_COMPOSITIONS,_AND_STRUCTURES_FOR_DIE_INTERCONNECTS_ON_INTEGRATED_CIRCUIT_PACKAGING_simplified_abstract&oldid=77431}",
   note = "[Online; accessed 2-July-2024]"
 }


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