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Bibliographic details for Intel corporation (20240213171). ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER ASSEMBLY simplified abstract

Citation styles for Intel corporation (20240213171). ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER ASSEMBLY simplified abstract

APA style

Intel corporation (20240213171). ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER ASSEMBLY simplified abstract. (2024, June 28). WikiPatents, . Retrieved 03:33, July 3, 2024 from http://wikipatents.org/index.php?title=Intel_corporation_(20240213171)._ULTRA_SMALL_MOLDED_MODULE_INTEGRATED_WITH_DIE_BY_MODULE-ON-WAFER_ASSEMBLY_simplified_abstract&oldid=77430.

MLA style

"Intel corporation (20240213171). ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER ASSEMBLY simplified abstract." WikiPatents, . 28 Jun 2024, 00:38 UTC. 3 Jul 2024, 03:33 <http://wikipatents.org/index.php?title=Intel_corporation_(20240213171)._ULTRA_SMALL_MOLDED_MODULE_INTEGRATED_WITH_DIE_BY_MODULE-ON-WAFER_ASSEMBLY_simplified_abstract&oldid=77430>.

MHRA style

WikiPatents contributors, 'Intel corporation (20240213171). ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER ASSEMBLY simplified abstract', WikiPatents, , 28 June 2024, 00:38 UTC, <http://wikipatents.org/index.php?title=Intel_corporation_(20240213171)._ULTRA_SMALL_MOLDED_MODULE_INTEGRATED_WITH_DIE_BY_MODULE-ON-WAFER_ASSEMBLY_simplified_abstract&oldid=77430> [accessed 3 July 2024]

Chicago style

WikiPatents contributors, "Intel corporation (20240213171). ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER ASSEMBLY simplified abstract," WikiPatents, , http://wikipatents.org/index.php?title=Intel_corporation_(20240213171)._ULTRA_SMALL_MOLDED_MODULE_INTEGRATED_WITH_DIE_BY_MODULE-ON-WAFER_ASSEMBLY_simplified_abstract&oldid=77430 (accessed July 3, 2024).

CBE/CSE style

WikiPatents contributors. Intel corporation (20240213171). ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER ASSEMBLY simplified abstract [Internet]. WikiPatents, ; 2024 Jun 28, 00:38 UTC [cited 2024 Jul 3]. Available from: http://wikipatents.org/index.php?title=Intel_corporation_(20240213171)._ULTRA_SMALL_MOLDED_MODULE_INTEGRATED_WITH_DIE_BY_MODULE-ON-WAFER_ASSEMBLY_simplified_abstract&oldid=77430.

Bluebook style

Intel corporation (20240213171). ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER ASSEMBLY simplified abstract, http://wikipatents.org/index.php?title=Intel_corporation_(20240213171)._ULTRA_SMALL_MOLDED_MODULE_INTEGRATED_WITH_DIE_BY_MODULE-ON-WAFER_ASSEMBLY_simplified_abstract&oldid=77430 (last visited July 3, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "Intel corporation (20240213171). ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER ASSEMBLY simplified abstract --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=Intel_corporation_(20240213171)._ULTRA_SMALL_MOLDED_MODULE_INTEGRATED_WITH_DIE_BY_MODULE-ON-WAFER_ASSEMBLY_simplified_abstract&oldid=77430",
   note = "[Online; accessed 3-July-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "Intel corporation (20240213171). ULTRA SMALL MOLDED MODULE INTEGRATED WITH DIE BY MODULE-ON-WAFER ASSEMBLY simplified abstract --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=Intel_corporation_(20240213171)._ULTRA_SMALL_MOLDED_MODULE_INTEGRATED_WITH_DIE_BY_MODULE-ON-WAFER_ASSEMBLY_simplified_abstract&oldid=77430}",
   note = "[Online; accessed 3-July-2024]"
 }


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