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Bibliographic details for Intel corporation (20240213164). TSV-TYPE EMBEDDED MULTI-DIE INTERCONNECT BRIDGE ENABLING WITH THERMAL COMPRESSION NON-CONDUCTIVE FILM (TC-NCF) PROCESS simplified abstract
- Page name: Intel corporation (20240213164). TSV-TYPE EMBEDDED MULTI-DIE INTERCONNECT BRIDGE ENABLING WITH THERMAL COMPRESSION NON-CONDUCTIVE FILM (TC-NCF) PROCESS simplified abstract
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 28 June 2024 00:38 UTC
- Date retrieved: 2 July 2024 23:48 UTC
- Permanent URL: http://wikipatents.org/index.php?title=Intel_corporation_(20240213164)._TSV-TYPE_EMBEDDED_MULTI-DIE_INTERCONNECT_BRIDGE_ENABLING_WITH_THERMAL_COMPRESSION_NON-CONDUCTIVE_FILM_(TC-NCF)_PROCESS_simplified_abstract&oldid=77427
- Page Version ID: 77427
Citation styles for Intel corporation (20240213164). TSV-TYPE EMBEDDED MULTI-DIE INTERCONNECT BRIDGE ENABLING WITH THERMAL COMPRESSION NON-CONDUCTIVE FILM (TC-NCF) PROCESS simplified abstract
APA style
Intel corporation (20240213164). TSV-TYPE EMBEDDED MULTI-DIE INTERCONNECT BRIDGE ENABLING WITH THERMAL COMPRESSION NON-CONDUCTIVE FILM (TC-NCF) PROCESS simplified abstract. (2024, June 28). WikiPatents, . Retrieved 23:48, July 2, 2024 from http://wikipatents.org/index.php?title=Intel_corporation_(20240213164)._TSV-TYPE_EMBEDDED_MULTI-DIE_INTERCONNECT_BRIDGE_ENABLING_WITH_THERMAL_COMPRESSION_NON-CONDUCTIVE_FILM_(TC-NCF)_PROCESS_simplified_abstract&oldid=77427.
MLA style
"Intel corporation (20240213164). TSV-TYPE EMBEDDED MULTI-DIE INTERCONNECT BRIDGE ENABLING WITH THERMAL COMPRESSION NON-CONDUCTIVE FILM (TC-NCF) PROCESS simplified abstract." WikiPatents, . 28 Jun 2024, 00:38 UTC. 2 Jul 2024, 23:48 <http://wikipatents.org/index.php?title=Intel_corporation_(20240213164)._TSV-TYPE_EMBEDDED_MULTI-DIE_INTERCONNECT_BRIDGE_ENABLING_WITH_THERMAL_COMPRESSION_NON-CONDUCTIVE_FILM_(TC-NCF)_PROCESS_simplified_abstract&oldid=77427>.
MHRA style
WikiPatents contributors, 'Intel corporation (20240213164). TSV-TYPE EMBEDDED MULTI-DIE INTERCONNECT BRIDGE ENABLING WITH THERMAL COMPRESSION NON-CONDUCTIVE FILM (TC-NCF) PROCESS simplified abstract', WikiPatents, , 28 June 2024, 00:38 UTC, <http://wikipatents.org/index.php?title=Intel_corporation_(20240213164)._TSV-TYPE_EMBEDDED_MULTI-DIE_INTERCONNECT_BRIDGE_ENABLING_WITH_THERMAL_COMPRESSION_NON-CONDUCTIVE_FILM_(TC-NCF)_PROCESS_simplified_abstract&oldid=77427> [accessed 2 July 2024]
Chicago style
WikiPatents contributors, "Intel corporation (20240213164). TSV-TYPE EMBEDDED MULTI-DIE INTERCONNECT BRIDGE ENABLING WITH THERMAL COMPRESSION NON-CONDUCTIVE FILM (TC-NCF) PROCESS simplified abstract," WikiPatents, , http://wikipatents.org/index.php?title=Intel_corporation_(20240213164)._TSV-TYPE_EMBEDDED_MULTI-DIE_INTERCONNECT_BRIDGE_ENABLING_WITH_THERMAL_COMPRESSION_NON-CONDUCTIVE_FILM_(TC-NCF)_PROCESS_simplified_abstract&oldid=77427 (accessed July 2, 2024).
CBE/CSE style
WikiPatents contributors. Intel corporation (20240213164). TSV-TYPE EMBEDDED MULTI-DIE INTERCONNECT BRIDGE ENABLING WITH THERMAL COMPRESSION NON-CONDUCTIVE FILM (TC-NCF) PROCESS simplified abstract [Internet]. WikiPatents, ; 2024 Jun 28, 00:38 UTC [cited 2024 Jul 2]. Available from: http://wikipatents.org/index.php?title=Intel_corporation_(20240213164)._TSV-TYPE_EMBEDDED_MULTI-DIE_INTERCONNECT_BRIDGE_ENABLING_WITH_THERMAL_COMPRESSION_NON-CONDUCTIVE_FILM_(TC-NCF)_PROCESS_simplified_abstract&oldid=77427.
Bluebook style
Intel corporation (20240213164). TSV-TYPE EMBEDDED MULTI-DIE INTERCONNECT BRIDGE ENABLING WITH THERMAL COMPRESSION NON-CONDUCTIVE FILM (TC-NCF) PROCESS simplified abstract, http://wikipatents.org/index.php?title=Intel_corporation_(20240213164)._TSV-TYPE_EMBEDDED_MULTI-DIE_INTERCONNECT_BRIDGE_ENABLING_WITH_THERMAL_COMPRESSION_NON-CONDUCTIVE_FILM_(TC-NCF)_PROCESS_simplified_abstract&oldid=77427 (last visited July 2, 2024).
BibTeX entry
@misc{ wiki:xxx, author = "WikiPatents", title = "Intel corporation (20240213164). TSV-TYPE EMBEDDED MULTI-DIE INTERCONNECT BRIDGE ENABLING WITH THERMAL COMPRESSION NON-CONDUCTIVE FILM (TC-NCF) PROCESS simplified abstract --- WikiPatents{,} ", year = "2024", url = "http://wikipatents.org/index.php?title=Intel_corporation_(20240213164)._TSV-TYPE_EMBEDDED_MULTI-DIE_INTERCONNECT_BRIDGE_ENABLING_WITH_THERMAL_COMPRESSION_NON-CONDUCTIVE_FILM_(TC-NCF)_PROCESS_simplified_abstract&oldid=77427", note = "[Online; accessed 2-July-2024]" }
When using the LaTeX package url (\usepackage{url}
somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx, author = "WikiPatents", title = "Intel corporation (20240213164). TSV-TYPE EMBEDDED MULTI-DIE INTERCONNECT BRIDGE ENABLING WITH THERMAL COMPRESSION NON-CONDUCTIVE FILM (TC-NCF) PROCESS simplified abstract --- WikiPatents{,} ", year = "2024", url = "\url{http://wikipatents.org/index.php?title=Intel_corporation_(20240213164)._TSV-TYPE_EMBEDDED_MULTI-DIE_INTERCONNECT_BRIDGE_ENABLING_WITH_THERMAL_COMPRESSION_NON-CONDUCTIVE_FILM_(TC-NCF)_PROCESS_simplified_abstract&oldid=77427}", note = "[Online; accessed 2-July-2024]" }