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Bibliographic details for 18083554. THERMAL EXPANSION MATCHED CHIP MODULE WITH INTEGRATED LIQUID COOLING simplified abstract (International Business Machines Corporation)
- Page name: 18083554. THERMAL EXPANSION MATCHED CHIP MODULE WITH INTEGRATED LIQUID COOLING simplified abstract (International Business Machines Corporation)
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 22 June 2024 06:32 UTC
- Date retrieved: 2 July 2024 13:48 UTC
- Permanent URL: http://wikipatents.org/index.php?title=18083554._THERMAL_EXPANSION_MATCHED_CHIP_MODULE_WITH_INTEGRATED_LIQUID_COOLING_simplified_abstract_(International_Business_Machines_Corporation)&oldid=76887
- Page Version ID: 76887
Citation styles for 18083554. THERMAL EXPANSION MATCHED CHIP MODULE WITH INTEGRATED LIQUID COOLING simplified abstract (International Business Machines Corporation)
APA style
18083554. THERMAL EXPANSION MATCHED CHIP MODULE WITH INTEGRATED LIQUID COOLING simplified abstract (International Business Machines Corporation). (2024, June 22). WikiPatents, . Retrieved 13:48, July 2, 2024 from http://wikipatents.org/index.php?title=18083554._THERMAL_EXPANSION_MATCHED_CHIP_MODULE_WITH_INTEGRATED_LIQUID_COOLING_simplified_abstract_(International_Business_Machines_Corporation)&oldid=76887.
MLA style
"18083554. THERMAL EXPANSION MATCHED CHIP MODULE WITH INTEGRATED LIQUID COOLING simplified abstract (International Business Machines Corporation)." WikiPatents, . 22 Jun 2024, 06:32 UTC. 2 Jul 2024, 13:48 <http://wikipatents.org/index.php?title=18083554._THERMAL_EXPANSION_MATCHED_CHIP_MODULE_WITH_INTEGRATED_LIQUID_COOLING_simplified_abstract_(International_Business_Machines_Corporation)&oldid=76887>.
MHRA style
WikiPatents contributors, '18083554. THERMAL EXPANSION MATCHED CHIP MODULE WITH INTEGRATED LIQUID COOLING simplified abstract (International Business Machines Corporation)', WikiPatents, , 22 June 2024, 06:32 UTC, <http://wikipatents.org/index.php?title=18083554._THERMAL_EXPANSION_MATCHED_CHIP_MODULE_WITH_INTEGRATED_LIQUID_COOLING_simplified_abstract_(International_Business_Machines_Corporation)&oldid=76887> [accessed 2 July 2024]
Chicago style
WikiPatents contributors, "18083554. THERMAL EXPANSION MATCHED CHIP MODULE WITH INTEGRATED LIQUID COOLING simplified abstract (International Business Machines Corporation)," WikiPatents, , http://wikipatents.org/index.php?title=18083554._THERMAL_EXPANSION_MATCHED_CHIP_MODULE_WITH_INTEGRATED_LIQUID_COOLING_simplified_abstract_(International_Business_Machines_Corporation)&oldid=76887 (accessed July 2, 2024).
CBE/CSE style
WikiPatents contributors. 18083554. THERMAL EXPANSION MATCHED CHIP MODULE WITH INTEGRATED LIQUID COOLING simplified abstract (International Business Machines Corporation) [Internet]. WikiPatents, ; 2024 Jun 22, 06:32 UTC [cited 2024 Jul 2]. Available from: http://wikipatents.org/index.php?title=18083554._THERMAL_EXPANSION_MATCHED_CHIP_MODULE_WITH_INTEGRATED_LIQUID_COOLING_simplified_abstract_(International_Business_Machines_Corporation)&oldid=76887.
Bluebook style
18083554. THERMAL EXPANSION MATCHED CHIP MODULE WITH INTEGRATED LIQUID COOLING simplified abstract (International Business Machines Corporation), http://wikipatents.org/index.php?title=18083554._THERMAL_EXPANSION_MATCHED_CHIP_MODULE_WITH_INTEGRATED_LIQUID_COOLING_simplified_abstract_(International_Business_Machines_Corporation)&oldid=76887 (last visited July 2, 2024).
BibTeX entry
@misc{ wiki:xxx, author = "WikiPatents", title = "18083554. THERMAL EXPANSION MATCHED CHIP MODULE WITH INTEGRATED LIQUID COOLING simplified abstract (International Business Machines Corporation) --- WikiPatents{,} ", year = "2024", url = "http://wikipatents.org/index.php?title=18083554._THERMAL_EXPANSION_MATCHED_CHIP_MODULE_WITH_INTEGRATED_LIQUID_COOLING_simplified_abstract_(International_Business_Machines_Corporation)&oldid=76887", note = "[Online; accessed 2-July-2024]" }
When using the LaTeX package url (\usepackage{url}
somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx, author = "WikiPatents", title = "18083554. THERMAL EXPANSION MATCHED CHIP MODULE WITH INTEGRATED LIQUID COOLING simplified abstract (International Business Machines Corporation) --- WikiPatents{,} ", year = "2024", url = "\url{http://wikipatents.org/index.php?title=18083554._THERMAL_EXPANSION_MATCHED_CHIP_MODULE_WITH_INTEGRATED_LIQUID_COOLING_simplified_abstract_(International_Business_Machines_Corporation)&oldid=76887}", note = "[Online; accessed 2-July-2024]" }