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Bibliographic details for 18067207. HEAT DISSIPATION STRUCTURES FOR BONDED WAFERS simplified abstract (International Business Machines Corporation)

Citation styles for 18067207. HEAT DISSIPATION STRUCTURES FOR BONDED WAFERS simplified abstract (International Business Machines Corporation)

APA style

18067207. HEAT DISSIPATION STRUCTURES FOR BONDED WAFERS simplified abstract (International Business Machines Corporation). (2024, June 22). WikiPatents, . Retrieved 14:59, June 30, 2024 from http://wikipatents.org/index.php?title=18067207._HEAT_DISSIPATION_STRUCTURES_FOR_BONDED_WAFERS_simplified_abstract_(International_Business_Machines_Corporation)&oldid=76886.

MLA style

"18067207. HEAT DISSIPATION STRUCTURES FOR BONDED WAFERS simplified abstract (International Business Machines Corporation)." WikiPatents, . 22 Jun 2024, 06:31 UTC. 30 Jun 2024, 14:59 <http://wikipatents.org/index.php?title=18067207._HEAT_DISSIPATION_STRUCTURES_FOR_BONDED_WAFERS_simplified_abstract_(International_Business_Machines_Corporation)&oldid=76886>.

MHRA style

WikiPatents contributors, '18067207. HEAT DISSIPATION STRUCTURES FOR BONDED WAFERS simplified abstract (International Business Machines Corporation)', WikiPatents, , 22 June 2024, 06:31 UTC, <http://wikipatents.org/index.php?title=18067207._HEAT_DISSIPATION_STRUCTURES_FOR_BONDED_WAFERS_simplified_abstract_(International_Business_Machines_Corporation)&oldid=76886> [accessed 30 June 2024]

Chicago style

WikiPatents contributors, "18067207. HEAT DISSIPATION STRUCTURES FOR BONDED WAFERS simplified abstract (International Business Machines Corporation)," WikiPatents, , http://wikipatents.org/index.php?title=18067207._HEAT_DISSIPATION_STRUCTURES_FOR_BONDED_WAFERS_simplified_abstract_(International_Business_Machines_Corporation)&oldid=76886 (accessed June 30, 2024).

CBE/CSE style

WikiPatents contributors. 18067207. HEAT DISSIPATION STRUCTURES FOR BONDED WAFERS simplified abstract (International Business Machines Corporation) [Internet]. WikiPatents, ; 2024 Jun 22, 06:31 UTC [cited 2024 Jun 30]. Available from: http://wikipatents.org/index.php?title=18067207._HEAT_DISSIPATION_STRUCTURES_FOR_BONDED_WAFERS_simplified_abstract_(International_Business_Machines_Corporation)&oldid=76886.

Bluebook style

18067207. HEAT DISSIPATION STRUCTURES FOR BONDED WAFERS simplified abstract (International Business Machines Corporation), http://wikipatents.org/index.php?title=18067207._HEAT_DISSIPATION_STRUCTURES_FOR_BONDED_WAFERS_simplified_abstract_(International_Business_Machines_Corporation)&oldid=76886 (last visited June 30, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18067207. HEAT DISSIPATION STRUCTURES FOR BONDED WAFERS simplified abstract (International Business Machines Corporation) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=18067207._HEAT_DISSIPATION_STRUCTURES_FOR_BONDED_WAFERS_simplified_abstract_(International_Business_Machines_Corporation)&oldid=76886",
   note = "[Online; accessed 30-June-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18067207. HEAT DISSIPATION STRUCTURES FOR BONDED WAFERS simplified abstract (International Business Machines Corporation) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=18067207._HEAT_DISSIPATION_STRUCTURES_FOR_BONDED_WAFERS_simplified_abstract_(International_Business_Machines_Corporation)&oldid=76886}",
   note = "[Online; accessed 30-June-2024]"
 }


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