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Bibliographic details for 18223788. WAFER-TO-WAFER BONDING STRUCTURE AND IMAGE SENSOR INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

Citation styles for 18223788. WAFER-TO-WAFER BONDING STRUCTURE AND IMAGE SENSOR INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

APA style

18223788. WAFER-TO-WAFER BONDING STRUCTURE AND IMAGE SENSOR INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.). (2024, June 21). WikiPatents, . Retrieved 22:52, July 1, 2024 from http://wikipatents.org/index.php?title=18223788._WAFER-TO-WAFER_BONDING_STRUCTURE_AND_IMAGE_SENSOR_INCLUDING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=76728.

MLA style

"18223788. WAFER-TO-WAFER BONDING STRUCTURE AND IMAGE SENSOR INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)." WikiPatents, . 21 Jun 2024, 17:14 UTC. 1 Jul 2024, 22:52 <http://wikipatents.org/index.php?title=18223788._WAFER-TO-WAFER_BONDING_STRUCTURE_AND_IMAGE_SENSOR_INCLUDING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=76728>.

MHRA style

WikiPatents contributors, '18223788. WAFER-TO-WAFER BONDING STRUCTURE AND IMAGE SENSOR INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)', WikiPatents, , 21 June 2024, 17:14 UTC, <http://wikipatents.org/index.php?title=18223788._WAFER-TO-WAFER_BONDING_STRUCTURE_AND_IMAGE_SENSOR_INCLUDING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=76728> [accessed 1 July 2024]

Chicago style

WikiPatents contributors, "18223788. WAFER-TO-WAFER BONDING STRUCTURE AND IMAGE SENSOR INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)," WikiPatents, , http://wikipatents.org/index.php?title=18223788._WAFER-TO-WAFER_BONDING_STRUCTURE_AND_IMAGE_SENSOR_INCLUDING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=76728 (accessed July 1, 2024).

CBE/CSE style

WikiPatents contributors. 18223788. WAFER-TO-WAFER BONDING STRUCTURE AND IMAGE SENSOR INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) [Internet]. WikiPatents, ; 2024 Jun 21, 17:14 UTC [cited 2024 Jul 1]. Available from: http://wikipatents.org/index.php?title=18223788._WAFER-TO-WAFER_BONDING_STRUCTURE_AND_IMAGE_SENSOR_INCLUDING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=76728.

Bluebook style

18223788. WAFER-TO-WAFER BONDING STRUCTURE AND IMAGE SENSOR INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.), http://wikipatents.org/index.php?title=18223788._WAFER-TO-WAFER_BONDING_STRUCTURE_AND_IMAGE_SENSOR_INCLUDING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=76728 (last visited July 1, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18223788. WAFER-TO-WAFER BONDING STRUCTURE AND IMAGE SENSOR INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=18223788._WAFER-TO-WAFER_BONDING_STRUCTURE_AND_IMAGE_SENSOR_INCLUDING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=76728",
   note = "[Online; accessed 1-July-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18223788. WAFER-TO-WAFER BONDING STRUCTURE AND IMAGE SENSOR INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=18223788._WAFER-TO-WAFER_BONDING_STRUCTURE_AND_IMAGE_SENSOR_INCLUDING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=76728}",
   note = "[Online; accessed 1-July-2024]"
 }


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