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Bibliographic details for 18223788. WAFER-TO-WAFER BONDING STRUCTURE AND IMAGE SENSOR INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- Page name: 18223788. WAFER-TO-WAFER BONDING STRUCTURE AND IMAGE SENSOR INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 21 June 2024 17:14 UTC
- Date retrieved: 3 July 2024 23:20 UTC
- Permanent URL: http://wikipatents.org/index.php?title=18223788._WAFER-TO-WAFER_BONDING_STRUCTURE_AND_IMAGE_SENSOR_INCLUDING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=76728
- Page Version ID: 76728
Citation styles for 18223788. WAFER-TO-WAFER BONDING STRUCTURE AND IMAGE SENSOR INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
APA style
18223788. WAFER-TO-WAFER BONDING STRUCTURE AND IMAGE SENSOR INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.). (2024, June 21). WikiPatents, . Retrieved 23:20, July 3, 2024 from http://wikipatents.org/index.php?title=18223788._WAFER-TO-WAFER_BONDING_STRUCTURE_AND_IMAGE_SENSOR_INCLUDING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=76728.
MLA style
"18223788. WAFER-TO-WAFER BONDING STRUCTURE AND IMAGE SENSOR INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)." WikiPatents, . 21 Jun 2024, 17:14 UTC. 3 Jul 2024, 23:20 <http://wikipatents.org/index.php?title=18223788._WAFER-TO-WAFER_BONDING_STRUCTURE_AND_IMAGE_SENSOR_INCLUDING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=76728>.
MHRA style
WikiPatents contributors, '18223788. WAFER-TO-WAFER BONDING STRUCTURE AND IMAGE SENSOR INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)', WikiPatents, , 21 June 2024, 17:14 UTC, <http://wikipatents.org/index.php?title=18223788._WAFER-TO-WAFER_BONDING_STRUCTURE_AND_IMAGE_SENSOR_INCLUDING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=76728> [accessed 3 July 2024]
Chicago style
WikiPatents contributors, "18223788. WAFER-TO-WAFER BONDING STRUCTURE AND IMAGE SENSOR INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)," WikiPatents, , http://wikipatents.org/index.php?title=18223788._WAFER-TO-WAFER_BONDING_STRUCTURE_AND_IMAGE_SENSOR_INCLUDING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=76728 (accessed July 3, 2024).
CBE/CSE style
WikiPatents contributors. 18223788. WAFER-TO-WAFER BONDING STRUCTURE AND IMAGE SENSOR INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) [Internet]. WikiPatents, ; 2024 Jun 21, 17:14 UTC [cited 2024 Jul 3]. Available from: http://wikipatents.org/index.php?title=18223788._WAFER-TO-WAFER_BONDING_STRUCTURE_AND_IMAGE_SENSOR_INCLUDING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=76728.
Bluebook style
18223788. WAFER-TO-WAFER BONDING STRUCTURE AND IMAGE SENSOR INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.), http://wikipatents.org/index.php?title=18223788._WAFER-TO-WAFER_BONDING_STRUCTURE_AND_IMAGE_SENSOR_INCLUDING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=76728 (last visited July 3, 2024).
BibTeX entry
@misc{ wiki:xxx, author = "WikiPatents", title = "18223788. WAFER-TO-WAFER BONDING STRUCTURE AND IMAGE SENSOR INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) --- WikiPatents{,} ", year = "2024", url = "http://wikipatents.org/index.php?title=18223788._WAFER-TO-WAFER_BONDING_STRUCTURE_AND_IMAGE_SENSOR_INCLUDING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=76728", note = "[Online; accessed 3-July-2024]" }
When using the LaTeX package url (\usepackage{url}
somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx, author = "WikiPatents", title = "18223788. WAFER-TO-WAFER BONDING STRUCTURE AND IMAGE SENSOR INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) --- WikiPatents{,} ", year = "2024", url = "\url{http://wikipatents.org/index.php?title=18223788._WAFER-TO-WAFER_BONDING_STRUCTURE_AND_IMAGE_SENSOR_INCLUDING_THE_SAME_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=76728}", note = "[Online; accessed 3-July-2024]" }