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Bibliographic details for 18537997. SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE, AND WAFER DICING METHOD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

Citation styles for 18537997. SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE, AND WAFER DICING METHOD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

APA style

18537997. SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE, AND WAFER DICING METHOD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.). (2024, June 21). WikiPatents, . Retrieved 21:53, July 6, 2024 from http://wikipatents.org/index.php?title=18537997._SEMICONDUCTOR_CHIP,_SEMICONDUCTOR_PACKAGE,_AND_WAFER_DICING_METHOD_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=76710.

MLA style

"18537997. SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE, AND WAFER DICING METHOD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)." WikiPatents, . 21 Jun 2024, 17:12 UTC. 6 Jul 2024, 21:53 <http://wikipatents.org/index.php?title=18537997._SEMICONDUCTOR_CHIP,_SEMICONDUCTOR_PACKAGE,_AND_WAFER_DICING_METHOD_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=76710>.

MHRA style

WikiPatents contributors, '18537997. SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE, AND WAFER DICING METHOD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)', WikiPatents, , 21 June 2024, 17:12 UTC, <http://wikipatents.org/index.php?title=18537997._SEMICONDUCTOR_CHIP,_SEMICONDUCTOR_PACKAGE,_AND_WAFER_DICING_METHOD_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=76710> [accessed 6 July 2024]

Chicago style

WikiPatents contributors, "18537997. SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE, AND WAFER DICING METHOD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)," WikiPatents, , http://wikipatents.org/index.php?title=18537997._SEMICONDUCTOR_CHIP,_SEMICONDUCTOR_PACKAGE,_AND_WAFER_DICING_METHOD_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=76710 (accessed July 6, 2024).

CBE/CSE style

WikiPatents contributors. 18537997. SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE, AND WAFER DICING METHOD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) [Internet]. WikiPatents, ; 2024 Jun 21, 17:12 UTC [cited 2024 Jul 6]. Available from: http://wikipatents.org/index.php?title=18537997._SEMICONDUCTOR_CHIP,_SEMICONDUCTOR_PACKAGE,_AND_WAFER_DICING_METHOD_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=76710.

Bluebook style

18537997. SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE, AND WAFER DICING METHOD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.), http://wikipatents.org/index.php?title=18537997._SEMICONDUCTOR_CHIP,_SEMICONDUCTOR_PACKAGE,_AND_WAFER_DICING_METHOD_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=76710 (last visited July 6, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18537997. SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE, AND WAFER DICING METHOD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=18537997._SEMICONDUCTOR_CHIP,_SEMICONDUCTOR_PACKAGE,_AND_WAFER_DICING_METHOD_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=76710",
   note = "[Online; accessed 6-July-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18537997. SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE, AND WAFER DICING METHOD simplified abstract (SAMSUNG ELECTRONICS CO., LTD.) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=18537997._SEMICONDUCTOR_CHIP,_SEMICONDUCTOR_PACKAGE,_AND_WAFER_DICING_METHOD_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=76710}",
   note = "[Online; accessed 6-July-2024]"
 }


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