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Bibliographic details for Taiwan semiconductor manufacturing company, ltd. (20240203857). PACKAGE STRUCTURE WITH THROUGH VIAS simplified abstract

Citation styles for Taiwan semiconductor manufacturing company, ltd. (20240203857). PACKAGE STRUCTURE WITH THROUGH VIAS simplified abstract

APA style

Taiwan semiconductor manufacturing company, ltd. (20240203857). PACKAGE STRUCTURE WITH THROUGH VIAS simplified abstract. (2024, June 21). WikiPatents, . Retrieved 10:24, July 1, 2024 from http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_company,_ltd._(20240203857)._PACKAGE_STRUCTURE_WITH_THROUGH_VIAS_simplified_abstract&oldid=76477.

MLA style

"Taiwan semiconductor manufacturing company, ltd. (20240203857). PACKAGE STRUCTURE WITH THROUGH VIAS simplified abstract." WikiPatents, . 21 Jun 2024, 16:43 UTC. 1 Jul 2024, 10:24 <http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_company,_ltd._(20240203857)._PACKAGE_STRUCTURE_WITH_THROUGH_VIAS_simplified_abstract&oldid=76477>.

MHRA style

WikiPatents contributors, 'Taiwan semiconductor manufacturing company, ltd. (20240203857). PACKAGE STRUCTURE WITH THROUGH VIAS simplified abstract', WikiPatents, , 21 June 2024, 16:43 UTC, <http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_company,_ltd._(20240203857)._PACKAGE_STRUCTURE_WITH_THROUGH_VIAS_simplified_abstract&oldid=76477> [accessed 1 July 2024]

Chicago style

WikiPatents contributors, "Taiwan semiconductor manufacturing company, ltd. (20240203857). PACKAGE STRUCTURE WITH THROUGH VIAS simplified abstract," WikiPatents, , http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_company,_ltd._(20240203857)._PACKAGE_STRUCTURE_WITH_THROUGH_VIAS_simplified_abstract&oldid=76477 (accessed July 1, 2024).

CBE/CSE style

WikiPatents contributors. Taiwan semiconductor manufacturing company, ltd. (20240203857). PACKAGE STRUCTURE WITH THROUGH VIAS simplified abstract [Internet]. WikiPatents, ; 2024 Jun 21, 16:43 UTC [cited 2024 Jul 1]. Available from: http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_company,_ltd._(20240203857)._PACKAGE_STRUCTURE_WITH_THROUGH_VIAS_simplified_abstract&oldid=76477.

Bluebook style

Taiwan semiconductor manufacturing company, ltd. (20240203857). PACKAGE STRUCTURE WITH THROUGH VIAS simplified abstract, http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_company,_ltd._(20240203857)._PACKAGE_STRUCTURE_WITH_THROUGH_VIAS_simplified_abstract&oldid=76477 (last visited July 1, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "Taiwan semiconductor manufacturing company, ltd. (20240203857). PACKAGE STRUCTURE WITH THROUGH VIAS simplified abstract --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_company,_ltd._(20240203857)._PACKAGE_STRUCTURE_WITH_THROUGH_VIAS_simplified_abstract&oldid=76477",
   note = "[Online; accessed 1-July-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "Taiwan semiconductor manufacturing company, ltd. (20240203857). PACKAGE STRUCTURE WITH THROUGH VIAS simplified abstract --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=Taiwan_semiconductor_manufacturing_company,_ltd._(20240203857)._PACKAGE_STRUCTURE_WITH_THROUGH_VIAS_simplified_abstract&oldid=76477}",
   note = "[Online; accessed 1-July-2024]"
 }


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