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Bibliographic details for Samsung electronics co., ltd. (20240204027). WAFER-TO-WAFER BONDING STRUCTURE AND IMAGE SENSOR INCLUDING THE SAME simplified abstract

Citation styles for Samsung electronics co., ltd. (20240204027). WAFER-TO-WAFER BONDING STRUCTURE AND IMAGE SENSOR INCLUDING THE SAME simplified abstract

APA style

Samsung electronics co., ltd. (20240204027). WAFER-TO-WAFER BONDING STRUCTURE AND IMAGE SENSOR INCLUDING THE SAME simplified abstract. (2024, June 20). WikiPatents, . Retrieved 01:22, June 30, 2024 from http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240204027)._WAFER-TO-WAFER_BONDING_STRUCTURE_AND_IMAGE_SENSOR_INCLUDING_THE_SAME_simplified_abstract&oldid=75313.

MLA style

"Samsung electronics co., ltd. (20240204027). WAFER-TO-WAFER BONDING STRUCTURE AND IMAGE SENSOR INCLUDING THE SAME simplified abstract." WikiPatents, . 20 Jun 2024, 18:49 UTC. 30 Jun 2024, 01:22 <http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240204027)._WAFER-TO-WAFER_BONDING_STRUCTURE_AND_IMAGE_SENSOR_INCLUDING_THE_SAME_simplified_abstract&oldid=75313>.

MHRA style

WikiPatents contributors, 'Samsung electronics co., ltd. (20240204027). WAFER-TO-WAFER BONDING STRUCTURE AND IMAGE SENSOR INCLUDING THE SAME simplified abstract', WikiPatents, , 20 June 2024, 18:49 UTC, <http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240204027)._WAFER-TO-WAFER_BONDING_STRUCTURE_AND_IMAGE_SENSOR_INCLUDING_THE_SAME_simplified_abstract&oldid=75313> [accessed 30 June 2024]

Chicago style

WikiPatents contributors, "Samsung electronics co., ltd. (20240204027). WAFER-TO-WAFER BONDING STRUCTURE AND IMAGE SENSOR INCLUDING THE SAME simplified abstract," WikiPatents, , http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240204027)._WAFER-TO-WAFER_BONDING_STRUCTURE_AND_IMAGE_SENSOR_INCLUDING_THE_SAME_simplified_abstract&oldid=75313 (accessed June 30, 2024).

CBE/CSE style

WikiPatents contributors. Samsung electronics co., ltd. (20240204027). WAFER-TO-WAFER BONDING STRUCTURE AND IMAGE SENSOR INCLUDING THE SAME simplified abstract [Internet]. WikiPatents, ; 2024 Jun 20, 18:49 UTC [cited 2024 Jun 30]. Available from: http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240204027)._WAFER-TO-WAFER_BONDING_STRUCTURE_AND_IMAGE_SENSOR_INCLUDING_THE_SAME_simplified_abstract&oldid=75313.

Bluebook style

Samsung electronics co., ltd. (20240204027). WAFER-TO-WAFER BONDING STRUCTURE AND IMAGE SENSOR INCLUDING THE SAME simplified abstract, http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240204027)._WAFER-TO-WAFER_BONDING_STRUCTURE_AND_IMAGE_SENSOR_INCLUDING_THE_SAME_simplified_abstract&oldid=75313 (last visited June 30, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "Samsung electronics co., ltd. (20240204027). WAFER-TO-WAFER BONDING STRUCTURE AND IMAGE SENSOR INCLUDING THE SAME simplified abstract --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240204027)._WAFER-TO-WAFER_BONDING_STRUCTURE_AND_IMAGE_SENSOR_INCLUDING_THE_SAME_simplified_abstract&oldid=75313",
   note = "[Online; accessed 30-June-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "Samsung electronics co., ltd. (20240204027). WAFER-TO-WAFER BONDING STRUCTURE AND IMAGE SENSOR INCLUDING THE SAME simplified abstract --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240204027)._WAFER-TO-WAFER_BONDING_STRUCTURE_AND_IMAGE_SENSOR_INCLUDING_THE_SAME_simplified_abstract&oldid=75313}",
   note = "[Online; accessed 30-June-2024]"
 }


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