Cite This Page
Bibliographic details for Samsung electronics co., ltd. (20240204027). WAFER-TO-WAFER BONDING STRUCTURE AND IMAGE SENSOR INCLUDING THE SAME simplified abstract
- Page name: Samsung electronics co., ltd. (20240204027). WAFER-TO-WAFER BONDING STRUCTURE AND IMAGE SENSOR INCLUDING THE SAME simplified abstract
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 20 June 2024 18:49 UTC
- Date retrieved: 2 July 2024 01:33 UTC
- Permanent URL: http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240204027)._WAFER-TO-WAFER_BONDING_STRUCTURE_AND_IMAGE_SENSOR_INCLUDING_THE_SAME_simplified_abstract&oldid=75313
- Page Version ID: 75313
Citation styles for Samsung electronics co., ltd. (20240204027). WAFER-TO-WAFER BONDING STRUCTURE AND IMAGE SENSOR INCLUDING THE SAME simplified abstract
APA style
Samsung electronics co., ltd. (20240204027). WAFER-TO-WAFER BONDING STRUCTURE AND IMAGE SENSOR INCLUDING THE SAME simplified abstract. (2024, June 20). WikiPatents, . Retrieved 01:33, July 2, 2024 from http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240204027)._WAFER-TO-WAFER_BONDING_STRUCTURE_AND_IMAGE_SENSOR_INCLUDING_THE_SAME_simplified_abstract&oldid=75313.
MLA style
"Samsung electronics co., ltd. (20240204027). WAFER-TO-WAFER BONDING STRUCTURE AND IMAGE SENSOR INCLUDING THE SAME simplified abstract." WikiPatents, . 20 Jun 2024, 18:49 UTC. 2 Jul 2024, 01:33 <http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240204027)._WAFER-TO-WAFER_BONDING_STRUCTURE_AND_IMAGE_SENSOR_INCLUDING_THE_SAME_simplified_abstract&oldid=75313>.
MHRA style
WikiPatents contributors, 'Samsung electronics co., ltd. (20240204027). WAFER-TO-WAFER BONDING STRUCTURE AND IMAGE SENSOR INCLUDING THE SAME simplified abstract', WikiPatents, , 20 June 2024, 18:49 UTC, <http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240204027)._WAFER-TO-WAFER_BONDING_STRUCTURE_AND_IMAGE_SENSOR_INCLUDING_THE_SAME_simplified_abstract&oldid=75313> [accessed 2 July 2024]
Chicago style
WikiPatents contributors, "Samsung electronics co., ltd. (20240204027). WAFER-TO-WAFER BONDING STRUCTURE AND IMAGE SENSOR INCLUDING THE SAME simplified abstract," WikiPatents, , http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240204027)._WAFER-TO-WAFER_BONDING_STRUCTURE_AND_IMAGE_SENSOR_INCLUDING_THE_SAME_simplified_abstract&oldid=75313 (accessed July 2, 2024).
CBE/CSE style
WikiPatents contributors. Samsung electronics co., ltd. (20240204027). WAFER-TO-WAFER BONDING STRUCTURE AND IMAGE SENSOR INCLUDING THE SAME simplified abstract [Internet]. WikiPatents, ; 2024 Jun 20, 18:49 UTC [cited 2024 Jul 2]. Available from: http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240204027)._WAFER-TO-WAFER_BONDING_STRUCTURE_AND_IMAGE_SENSOR_INCLUDING_THE_SAME_simplified_abstract&oldid=75313.
Bluebook style
Samsung electronics co., ltd. (20240204027). WAFER-TO-WAFER BONDING STRUCTURE AND IMAGE SENSOR INCLUDING THE SAME simplified abstract, http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240204027)._WAFER-TO-WAFER_BONDING_STRUCTURE_AND_IMAGE_SENSOR_INCLUDING_THE_SAME_simplified_abstract&oldid=75313 (last visited July 2, 2024).
BibTeX entry
@misc{ wiki:xxx, author = "WikiPatents", title = "Samsung electronics co., ltd. (20240204027). WAFER-TO-WAFER BONDING STRUCTURE AND IMAGE SENSOR INCLUDING THE SAME simplified abstract --- WikiPatents{,} ", year = "2024", url = "http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240204027)._WAFER-TO-WAFER_BONDING_STRUCTURE_AND_IMAGE_SENSOR_INCLUDING_THE_SAME_simplified_abstract&oldid=75313", note = "[Online; accessed 2-July-2024]" }
When using the LaTeX package url (\usepackage{url}
somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx, author = "WikiPatents", title = "Samsung electronics co., ltd. (20240204027). WAFER-TO-WAFER BONDING STRUCTURE AND IMAGE SENSOR INCLUDING THE SAME simplified abstract --- WikiPatents{,} ", year = "2024", url = "\url{http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240204027)._WAFER-TO-WAFER_BONDING_STRUCTURE_AND_IMAGE_SENSOR_INCLUDING_THE_SAME_simplified_abstract&oldid=75313}", note = "[Online; accessed 2-July-2024]" }