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Bibliographic details for Samsung electronics co., ltd. (20240203946). SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE, AND WAFER DICING METHOD simplified abstract

Citation styles for Samsung electronics co., ltd. (20240203946). SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE, AND WAFER DICING METHOD simplified abstract

APA style

Samsung electronics co., ltd. (20240203946). SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE, AND WAFER DICING METHOD simplified abstract. (2024, June 20). WikiPatents, . Retrieved 01:38, July 2, 2024 from http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240203946)._SEMICONDUCTOR_CHIP,_SEMICONDUCTOR_PACKAGE,_AND_WAFER_DICING_METHOD_simplified_abstract&oldid=75295.

MLA style

"Samsung electronics co., ltd. (20240203946). SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE, AND WAFER DICING METHOD simplified abstract." WikiPatents, . 20 Jun 2024, 18:46 UTC. 2 Jul 2024, 01:38 <http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240203946)._SEMICONDUCTOR_CHIP,_SEMICONDUCTOR_PACKAGE,_AND_WAFER_DICING_METHOD_simplified_abstract&oldid=75295>.

MHRA style

WikiPatents contributors, 'Samsung electronics co., ltd. (20240203946). SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE, AND WAFER DICING METHOD simplified abstract', WikiPatents, , 20 June 2024, 18:46 UTC, <http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240203946)._SEMICONDUCTOR_CHIP,_SEMICONDUCTOR_PACKAGE,_AND_WAFER_DICING_METHOD_simplified_abstract&oldid=75295> [accessed 2 July 2024]

Chicago style

WikiPatents contributors, "Samsung electronics co., ltd. (20240203946). SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE, AND WAFER DICING METHOD simplified abstract," WikiPatents, , http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240203946)._SEMICONDUCTOR_CHIP,_SEMICONDUCTOR_PACKAGE,_AND_WAFER_DICING_METHOD_simplified_abstract&oldid=75295 (accessed July 2, 2024).

CBE/CSE style

WikiPatents contributors. Samsung electronics co., ltd. (20240203946). SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE, AND WAFER DICING METHOD simplified abstract [Internet]. WikiPatents, ; 2024 Jun 20, 18:46 UTC [cited 2024 Jul 2]. Available from: http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240203946)._SEMICONDUCTOR_CHIP,_SEMICONDUCTOR_PACKAGE,_AND_WAFER_DICING_METHOD_simplified_abstract&oldid=75295.

Bluebook style

Samsung electronics co., ltd. (20240203946). SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE, AND WAFER DICING METHOD simplified abstract, http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240203946)._SEMICONDUCTOR_CHIP,_SEMICONDUCTOR_PACKAGE,_AND_WAFER_DICING_METHOD_simplified_abstract&oldid=75295 (last visited July 2, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "Samsung electronics co., ltd. (20240203946). SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE, AND WAFER DICING METHOD simplified abstract --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240203946)._SEMICONDUCTOR_CHIP,_SEMICONDUCTOR_PACKAGE,_AND_WAFER_DICING_METHOD_simplified_abstract&oldid=75295",
   note = "[Online; accessed 2-July-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred: 

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "Samsung electronics co., ltd. (20240203946). SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE, AND WAFER DICING METHOD simplified abstract --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240203946)._SEMICONDUCTOR_CHIP,_SEMICONDUCTOR_PACKAGE,_AND_WAFER_DICING_METHOD_simplified_abstract&oldid=75295}",
   note = "[Online; accessed 2-July-2024]"
 }


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