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Bibliographic details for Samsung electronics co., ltd. (20240203945). SEMICONDUCTOR PACKAGE INCLUDING MOLD LAYER AND MANUFACTURING METHOD THEREOF simplified abstract
- Page name: Samsung electronics co., ltd. (20240203945). SEMICONDUCTOR PACKAGE INCLUDING MOLD LAYER AND MANUFACTURING METHOD THEREOF simplified abstract
- Author: WikiPatents contributors
- Publisher: WikiPatents, .
- Date of last revision: 20 June 2024 18:46 UTC
- Date retrieved: 2 July 2024 01:30 UTC
- Permanent URL: http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240203945)._SEMICONDUCTOR_PACKAGE_INCLUDING_MOLD_LAYER_AND_MANUFACTURING_METHOD_THEREOF_simplified_abstract&oldid=75294
- Page Version ID: 75294
Citation styles for Samsung electronics co., ltd. (20240203945). SEMICONDUCTOR PACKAGE INCLUDING MOLD LAYER AND MANUFACTURING METHOD THEREOF simplified abstract
APA style
Samsung electronics co., ltd. (20240203945). SEMICONDUCTOR PACKAGE INCLUDING MOLD LAYER AND MANUFACTURING METHOD THEREOF simplified abstract. (2024, June 20). WikiPatents, . Retrieved 01:30, July 2, 2024 from http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240203945)._SEMICONDUCTOR_PACKAGE_INCLUDING_MOLD_LAYER_AND_MANUFACTURING_METHOD_THEREOF_simplified_abstract&oldid=75294.
MLA style
"Samsung electronics co., ltd. (20240203945). SEMICONDUCTOR PACKAGE INCLUDING MOLD LAYER AND MANUFACTURING METHOD THEREOF simplified abstract." WikiPatents, . 20 Jun 2024, 18:46 UTC. 2 Jul 2024, 01:30 <http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240203945)._SEMICONDUCTOR_PACKAGE_INCLUDING_MOLD_LAYER_AND_MANUFACTURING_METHOD_THEREOF_simplified_abstract&oldid=75294>.
MHRA style
WikiPatents contributors, 'Samsung electronics co., ltd. (20240203945). SEMICONDUCTOR PACKAGE INCLUDING MOLD LAYER AND MANUFACTURING METHOD THEREOF simplified abstract', WikiPatents, , 20 June 2024, 18:46 UTC, <http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240203945)._SEMICONDUCTOR_PACKAGE_INCLUDING_MOLD_LAYER_AND_MANUFACTURING_METHOD_THEREOF_simplified_abstract&oldid=75294> [accessed 2 July 2024]
Chicago style
WikiPatents contributors, "Samsung electronics co., ltd. (20240203945). SEMICONDUCTOR PACKAGE INCLUDING MOLD LAYER AND MANUFACTURING METHOD THEREOF simplified abstract," WikiPatents, , http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240203945)._SEMICONDUCTOR_PACKAGE_INCLUDING_MOLD_LAYER_AND_MANUFACTURING_METHOD_THEREOF_simplified_abstract&oldid=75294 (accessed July 2, 2024).
CBE/CSE style
WikiPatents contributors. Samsung electronics co., ltd. (20240203945). SEMICONDUCTOR PACKAGE INCLUDING MOLD LAYER AND MANUFACTURING METHOD THEREOF simplified abstract [Internet]. WikiPatents, ; 2024 Jun 20, 18:46 UTC [cited 2024 Jul 2]. Available from: http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240203945)._SEMICONDUCTOR_PACKAGE_INCLUDING_MOLD_LAYER_AND_MANUFACTURING_METHOD_THEREOF_simplified_abstract&oldid=75294.
Bluebook style
Samsung electronics co., ltd. (20240203945). SEMICONDUCTOR PACKAGE INCLUDING MOLD LAYER AND MANUFACTURING METHOD THEREOF simplified abstract, http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240203945)._SEMICONDUCTOR_PACKAGE_INCLUDING_MOLD_LAYER_AND_MANUFACTURING_METHOD_THEREOF_simplified_abstract&oldid=75294 (last visited July 2, 2024).
BibTeX entry
@misc{ wiki:xxx,
author = "WikiPatents",
title = "Samsung electronics co., ltd. (20240203945). SEMICONDUCTOR PACKAGE INCLUDING MOLD LAYER AND MANUFACTURING METHOD THEREOF simplified abstract --- WikiPatents{,} ",
year = "2024",
url = "http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240203945)._SEMICONDUCTOR_PACKAGE_INCLUDING_MOLD_LAYER_AND_MANUFACTURING_METHOD_THEREOF_simplified_abstract&oldid=75294",
note = "[Online; accessed 2-July-2024]"
}
When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:
@misc{ wiki:xxx,
author = "WikiPatents",
title = "Samsung electronics co., ltd. (20240203945). SEMICONDUCTOR PACKAGE INCLUDING MOLD LAYER AND MANUFACTURING METHOD THEREOF simplified abstract --- WikiPatents{,} ",
year = "2024",
url = "\url{http://wikipatents.org/index.php?title=Samsung_electronics_co.,_ltd._(20240203945)._SEMICONDUCTOR_PACKAGE_INCLUDING_MOLD_LAYER_AND_MANUFACTURING_METHOD_THEREOF_simplified_abstract&oldid=75294}",
note = "[Online; accessed 2-July-2024]"
}
