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Citation styles for 18584028. FORMING A CAVITY WITH A WET ETCH FOR BACKSIDE CONTACT FORMATION simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

APA style

18584028. FORMING A CAVITY WITH A WET ETCH FOR BACKSIDE CONTACT FORMATION simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.). (2024, June 14). WikiPatents, . Retrieved 09:30, June 30, 2024 from http://wikipatents.org/index.php?title=18584028._FORMING_A_CAVITY_WITH_A_WET_ETCH_FOR_BACKSIDE_CONTACT_FORMATION_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=73418.

MLA style

"18584028. FORMING A CAVITY WITH A WET ETCH FOR BACKSIDE CONTACT FORMATION simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)." WikiPatents, . 14 Jun 2024, 06:31 UTC. 30 Jun 2024, 09:30 <http://wikipatents.org/index.php?title=18584028._FORMING_A_CAVITY_WITH_A_WET_ETCH_FOR_BACKSIDE_CONTACT_FORMATION_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=73418>.

MHRA style

WikiPatents contributors, '18584028. FORMING A CAVITY WITH A WET ETCH FOR BACKSIDE CONTACT FORMATION simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)', WikiPatents, , 14 June 2024, 06:31 UTC, <http://wikipatents.org/index.php?title=18584028._FORMING_A_CAVITY_WITH_A_WET_ETCH_FOR_BACKSIDE_CONTACT_FORMATION_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=73418> [accessed 30 June 2024]

Chicago style

WikiPatents contributors, "18584028. FORMING A CAVITY WITH A WET ETCH FOR BACKSIDE CONTACT FORMATION simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)," WikiPatents, , http://wikipatents.org/index.php?title=18584028._FORMING_A_CAVITY_WITH_A_WET_ETCH_FOR_BACKSIDE_CONTACT_FORMATION_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=73418 (accessed June 30, 2024).

CBE/CSE style

WikiPatents contributors. 18584028. FORMING A CAVITY WITH A WET ETCH FOR BACKSIDE CONTACT FORMATION simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) [Internet]. WikiPatents, ; 2024 Jun 14, 06:31 UTC [cited 2024 Jun 30]. Available from: http://wikipatents.org/index.php?title=18584028._FORMING_A_CAVITY_WITH_A_WET_ETCH_FOR_BACKSIDE_CONTACT_FORMATION_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=73418.

Bluebook style

18584028. FORMING A CAVITY WITH A WET ETCH FOR BACKSIDE CONTACT FORMATION simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.), http://wikipatents.org/index.php?title=18584028._FORMING_A_CAVITY_WITH_A_WET_ETCH_FOR_BACKSIDE_CONTACT_FORMATION_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=73418 (last visited June 30, 2024).

BibTeX entry

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18584028. FORMING A CAVITY WITH A WET ETCH FOR BACKSIDE CONTACT FORMATION simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "http://wikipatents.org/index.php?title=18584028._FORMING_A_CAVITY_WITH_A_WET_ETCH_FOR_BACKSIDE_CONTACT_FORMATION_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=73418",
   note = "[Online; accessed 30-June-2024]"
 }

When using the LaTeX package url (\usepackage{url} somewhere in the preamble) which tends to give much more nicely formatted web addresses, the following may be preferred:

 @misc{ wiki:xxx,
   author = "WikiPatents",
   title = "18584028. FORMING A CAVITY WITH A WET ETCH FOR BACKSIDE CONTACT FORMATION simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.) --- WikiPatents{,} ",
   year = "2024",
   url = "\url{http://wikipatents.org/index.php?title=18584028._FORMING_A_CAVITY_WITH_A_WET_ETCH_FOR_BACKSIDE_CONTACT_FORMATION_simplified_abstract_(Taiwan_Semiconductor_Manufacturing_Co.,_Ltd.)&oldid=73418}",
   note = "[Online; accessed 30-June-2024]"
 }